TIS580-13 Dealcoholized Thermally Conductive Silicone Glue - 1.3W/mK Thermal Conductivity, 20K cps Viscosity
Price:
0.1-10 USD/kg
MOQ:
10KG
Delivery Time:
3-5 work days
Brand:
Ziitek
Product Description
Product Overview
TIS580-13 is a one-component, dealcoholized, room temperature cured thermally conductive silicone adhesive designed for electronic component bonding and heat dissipation applications.
Key Features
- Thermal conductivity: 1.3W/mK for efficient heat transfer
- Excellent adhesion to copper, aluminum, and stainless steel
- Dealcoholized formulation prevents metal corrosion
- Low viscosity ensures void-free application surfaces
- UL94 V-0 flame retardant rating for safety compliance
- Extended working life and excellent thermal shock resistance
- Good solvent and water resistance properties
Applications
Ideal for replacing thermal grease and thermal pads in LED aluminum base plates, radiators, high-power electrical modules, and various electronic components including:
- Personal computers and integrated circuits
- Microprocessors and memory modules
- High-power LED lighting systems
- DC/AC converters and IGBT power modules
- Semiconductors, relays, transformers, and converters
Technical Specifications
| Property | Value | Test Method |
|---|---|---|
| Appearance | Black paste | Visual |
| Density (g/cm³, 25℃) | 1.4 | ASTM D297 |
| Viscosity @25℃ Brookfield (Uncured) | 20K cps | ASTM D1084 |
| Hardness (Shore A) | 25 | ASTM D2240 |
| Thermal Conductivity W/(m*K) | 1.3 | ASTM D5470 |
| Operation Temperature (℃) | -60 to 250 | Standard Test |
| Volume Resistivity (Ω*cm) | 2.0×10¹⁶ | ASTM D257 |
| Flame Retardancy | UL94 V-0 | E331100 |
Packaging
300ml per tube, 24 tubes per box
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
Location
Plot CN4, Ming Lang Industrial Cluster, Thu Tri Commune, Hung Yen Province, Vietnam
Contact Person
Sophia