TIF500-40-11U Silicone Thermal Pad Gap Filling For Mass storage devices 

TIF^®500-40-11U Silicone Thermal Pad Gap Filling For Mass storage devices

Product descriptions

TlF^®500-40-11U is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. Ziitek TIF^®500-40-11U is an electrically isolating material, which allows its use in applications requiring isolation between heat sinks and high-voltage, bare-leaded devices.

Features

> Good thermal conductive 4.0W/mK
> Moldability for complex parts
> Soft and compressible for low stress applications
> Broad range of hardnesses available
> RoHS compliant
> UL recognized
> Easy release construction
> Electrically isolating
> High durability

Application

> Mainboard/mother board
> Notebook
> Power supply
> CPU
> Micro heat pipe thermal solutions
> Telecommunication hardware
> Cooling components to the chassis of frame
> High speed mass storage drives
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units

Standard Thicknesses

0.020-inch to 0.200-inch (0.5mm to 5.0mm)

Product Sizes:

8" x 16"(203mm x406mm)

Individual die cut shapesand and custom thickness can be supplied.

Please contact us for confirming

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Company Profile

Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

Independent R&D team

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