TIF030AB-05S Two Component Liquid Thermal Gap Filling Gel 3.0W/mK for Power Semiconductor Cooling
TIF030AB-05S is a two-component liquid thermal gap filling silicone gel with 3.0W/mK thermal conductivity, designed for efficient heat dissipation in power semiconductor applications. This UL-recognized material cures at different temperatures and forms a dry, touchable elastomer for reliable thermal management.
- High thermal conductivity: 3.0W/mK
- UL 94V0 flame rating recognized
- Naturally tacky surface requires no additional adhesive
- Two-part formulation for extended shelf life
- Excellent durability and reliability
- Optimized shear thinning for easy dispensing
- Available in liquid form for variable thickness applications
- Notebook computers
- Set-top boxes
- Power box monitoring systems
- High-speed mass storage drives
- Heat sinks for heat-generating semiconductors
| Property | Value | Test Method |
|---|---|---|
| Color/Part A | White | Visual |
| Color/Part B | Blue | Visual |
| Part A Viscosity | 900,000 cps | GB/T 10247 |
| Part B Viscosity | 1,500,000 cps | GB/T 10247 |
| Flow Rate | 25 g/min | Ziitek Test Method |
| Density | 3.1 g/cc | ASTM D297 |
| Bond Line Thickness | 0.2 mm | Ziitek Test Method |
| Thermal Resistance @10psi | 0.75 ℃•in²/W | ASTM D5470 |
| Thermal Resistance @50psi | 0.45 ℃•in²/W | ASTM D5470 |
| Mix Ratio | 0.042 | Standard |
| Shelf Life | 12 months | Standard |
| Process | Time | Test Method |
|---|---|---|
| Pot Life @25℃ | 30 min | Ziitek Test Method |
| Cure @25℃ | 16 hrs | Ziitek Test Method |
| Cure @70℃ | 30 min | Ziitek Test Method |
| Property | Value | Test Method |
|---|---|---|
| Color | Blue | Visual |
| Hardness | 65 shore00 | ASTM D2240 |
| Continuous Use Temperature | -45~200℃ | Ziitek Test Method |
| Break Voltage | ≥5500 V | ASTM D149 |
| Flame Rating | 94V0 | UL E331100 |
| Thermal Conductivity | 3.0 W/mK | ASTM D5470 |
Standard packaging: 50cc/pc (48pcs/box) or 400cc/pc (9pcs/box). Custom syringe packaging available for automated dispensing applications. Contact us for specific packaging requirements.
Ziitek Electronic Material and Technology Ltd. specializes in developing composite thermal solutions and manufacturing superior thermal interface materials. With extensive experience in thermal engineering, we provide customized products, comprehensive product lines, and flexible production capabilities to meet diverse customer requirements.
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