TIR700-09 Carbon Fiber Thermal Pad 9.0W/mK for 5G Equipment - 1.0-5.0mm Thickness Range
Price:
0.1-10 USD/PCS
MOQ:
1000pcs
Delivery Time:
3-5 work days
Brand:
Ziitek
Product Description
TIR700-09 High Thermal Conductive Carbon Fiber Thermal Pad
TS-TIR®700-09 series is a high-performance carbon-based thermal pad that combines thermally conductive carbon fiber with polymer silicone materials. Utilizing advanced manufacturing processes to precisely distribute thermal pathways, it achieves exceptional thermal conductivity of 9.0W/mK, effectively reducing interfacial thermal resistance and enhancing heat dissipation efficiency.
Key Features
- Excellent thermal conductivity: 9.0W/mK
- Ultra-low thermal resistance
- Operates effectively under low pressure
- Non-insulating material
- Non-adhesive surface
- Ultra-thin, lightweight design with mechanical flexibility
Applications
- Between chips and heat dissipation modules
- 5G communication equipment
- Optoelectronics industry
- Wearable devices
- High-performance chips and high heat flux applications
Technical Specifications
| Property | Value | Test Method |
|---|---|---|
| Product Name | TIR®700-09 | - |
| Color | Gray | Visual |
| Construction | Carbon fiber filled silicone | - |
| Thickness Range | 0.04"~0.20" (1.0~5.0 mm) | ASTM D374 |
| Hardness | 55±10 Shore 00 | ASTM D2240 |
| Density | 2.1 g/cm³ | ASTM D792 |
| Operation Temperature | -40℃~200℃ | - |
| Thermal Conductivity | 9.0W/m-K | ASTM D5470 |
| Specific Heat Capacity | 0.93 J/g℃ | ASTM E1269 @25℃ |
| Flame Rating | V-0 | UL94 |
| RoHS Compliance | Compliant | IEC62321 |
Standard Dimensions
Standard Thickness: 0.04" (1.0mm), 0.06" (1.5mm), 0.08" (2.0mm), 0.10" (2.5mm), 0.12" (3.0mm)
Standard Size: 1.97" x 1.97" (50.0mm x 50.0mm)
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Company
CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
Location
Plot CN4, Ming Lang Industrial Cluster, Thu Tri Commune, Hung Yen Province, Vietnam
Contact Person
Sophia