TIF800Q 13.0W/mK Silicone Thermal Pad 0.75mm-5.00mm for Automotive Heat Dissipation
High Thermal Conductive 5.0W Silicone Thermal Sheet Thermal Pad For Automotive Efficient Heat Dissipation
Product descriptions
TIF®800Q Seriesis a high-end compressible thermal pad designed to meet top-level cooling requirements while_maintaining excellent assembly workmanship. Through an innovative material formulation,it successfully achieves an ideal combination of ultra- high thermal conductivity and moderate hardness. This unique performance balance allows it to efficiently handle the cooling challenges posed by ultra-high heat flux densities, while also providing good mechanical strength and compressibility, making it easy to process and install. It offers a reliable interface material solution with both outstanding thermal performance and high reliability for high-power-density electronic devices.
Features
> Good thermal conductive:13.0W/mK
> Moldability for complex parts
> Soft and compressible for low stress applications
> Moldability for complex parts
> Outstanding thermal performance
> High tack surface reduces contact resistance
Application
> Between CPU and heat sink
> Between a component and heat sink
> Flat-panel displays
> Power supplies
> High speed mass storage drives
> Telecommunication hardware
> 5G base station & infrastructure
> High-end Chip
| Typical Properties of TIF®800Q Series | |||
| Property | Value | Test method | |
| Color | Gray | Visual | |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** | |
| Density(g/cm³) | 3.5 | ASTM D792 | |
| Thickness Range(inch/mm) | 0.030 | 0.040~0.200 | ASTM D374 |
| 0.75 | 1.00~5.00 | ||
| Hardness (Shroe 00) | 65 | 45 | ASTM 2240 |
| Recommended Operating Temperature | -40 to 200℃ | ****** | |
| Breakdown Voltage(V/mm) | ≥5500 | ASTM D149 | |
| Dielectric Constant@ 1MHz | 8.0 | ASTM D150 | |
| Volume Resistivity | ＞1.0X1012 Ohm-meter | ASTM D257 | |
| Flame rating | V-0 | UL 94 (E331100) | |
| Thermal conductivity | 13.0 W/m-K | ASTM D5470 | |
| 13.0 W/m-K | ISO22007 | ||
Product Specifications
Product Thicknesses: 0.010" (0.25mm) ~ 0.200" (5.00mm) with increments of 0.01 (0.25mm)
Product Sizes: 16" x 16" (406mm x 406mm)
The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract
5.Free sample offer
6.Quality assurance contract
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.