CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
                                                                                                           
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20 Years
Since 2006
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TIF100C 3030-11 Custom High Performance Cpu Silicone High Thermal Conductivity Pad Thermal Gap Filler Factory

Price Negotiable
Price: 0.1-10 USD/PCS
MOQ: 1000pcs
Delivery Time: 3-5 work days
Brand: Ziitek
Product Description

TIF100C 3030-11 Custom High Performance Cpu Silicone High Thermal Conductivity Pad Thermal Gap Filler Factory

 

Product descriptions

 

TS-TIF®100C 3030-11 series is a silicone-based thermal material designed to fill the gaps between heat-generating components and liquid cooling plates or metal bases.lts flexibility and elasticity make it ideal for covering highly uneven surfaces.With excellent thermal conductivity, it efficiently transfers heat from heat-generating elements or PCBs to liquid cooling plates or metal heat dissipation structures, thereby improving the cooling efficiency of high-power electronic components and extending the lifespan of the equipment.

 

Features:


>Excellent thermal conductivity 5.0W/mK

>Moldability for complex parts
>Soft and compressible for low stress applications
>Moldability for complex parts
>Outstanding thermal performance
>High tack surface reduces contact resistance
>RoHS compliant


Applications:

 

>Cooling components to the chassis of frame
>High speed mass storage drives
>Heat Sinking Housing at LED-lit BLU in LCD
>LED TV and LED-lit lamps
>RDRAM memory modules
>Micro heat pipe thermal solutions
>Handheld portable electronics
>Notebook
>Power supply
>Heat pipe thermal solutions
>Memory Modules
>Mass storage devices
>Automotive electronics

 

Typical Properties of TS-TIF®100C 3030-11 Series
Color Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Specific Gravity 3.1g/cc ASTM D297
thickness 0.012"(0.30mm)~0.200"(5.00mm) ASTM D374
Hardness (thickness<1.0mm) 30(Shore 00) ASTM 2240
Continuos Use Temp -45 to 200℃ ******
Dielectric Breakdown Voltage ≥5500 VAC ASTM D149
Dielectric Constant 4.5MHz ASTM D150
Volume Resistivity ≥1.0X10¹²Ohm-meter ASTM D257
Fire rating 94 V0 equivalent UL
Thermal conductivity 3.0W/m-K ASTM D5470

 

Product Specification

Product Thicknesses: 0.012"(0.30mm)-0.200"(5.00mm)
Product Sizes:8" x 16"(203mm x406mm)

Custom die-cut shapes and thicknesses are available.Please contact us for details.
Store in a cool, dry place, away from fire and sunlight.

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Company Profile

 

With professional R&D capabilities and many year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.

 

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

 

Independent R&D team

 

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

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Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
Location Plot CN4, Ming Lang Industrial Cluster, Thu Tri Commune, Hung Yen Province, Vietnam
Contact Person Sophia

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