TIF035AB-05S Thermal Conductive Gel - 3.5W/mK Two-Component Heat Transfer Paste with 200°C Operating Temperature
Price:
0.1-10 USD/PCS
MOQ:
1000 pcs
Delivery Time:
3-5 work days
Brand:
Ziitek
Product Description
TIF035AB-05S High Thermal Conductive Paste
TIF TM035AB-05S is a two-component thermal conductive gel featuring 3.5W/mK thermal conductivity and flexible curing options. This liquid gap-filling material provides superior heat transfer from electronic components to heat sinks and metal housings.
Key Features
- High thermal conductivity: 3.5W/mK
- Two-part formulation for extended shelf life
- Excellent temperature stability from -45°C to 200°C
- Low-stress interface application
- Ambient or accelerated curing options
- Optimized for easy dispensing applications
Applications
- Notebook computers and peripherals
- Telecommunications equipment
- Automotive electronics
- Thermal vibration damping
- Heat sinks and semiconductor cooling
Technical Specifications
| Property | Value | Test Method |
|---|---|---|
| Thermal Conductivity | 3.5 W/mK | ISO22007-2 / ASTM D5470 |
| Mix Ratio | 1:1 | - |
| Viscosity (Mixed) | 200K Pa.s | GB/T 10247 |
| Hardness | 55 Shore 00 | ASTM D2240 |
| Operating Temperature | -45°C to 200°C | - |
| Volume Resistivity | >10¹² Ohm-cm | ASTM D257 |
| Flame Rating | 94V0 | E331100 |
| Shelf Life @25°C | 6 months | - |
Packaging Options
- 50cc per piece, 48 pieces per box
- 400cc per piece, 9 pieces per box
- Custom syringe packaging for automated dispensing
Manufacturer Information
Vietnam Ziitek Electronic Material Technology Co., Ltd. specializes in thermal interface materials research, development, and production since 2006. Our product range includes thermal gap fillers, interface pads, adhesives, and thermal greases for diverse electronic cooling applications.
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Get in Touch
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Company
CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
Location
Plot CN4, Ming Lang Industrial Cluster, Thu Tri Commune, Hung Yen Province, Vietnam
Contact Person
Sophia