TIC800G-ST 5.0W/mK Phase Change Silicone Thermal Pad for Laptop CPU GPU Cooling - 0.005" to 0.012" Thickness
The TIC800G-ST is a high-performance phase change thermal interface material with 5.0W/mK thermal conductivity, specifically designed for laptop CPU and GPU cooling applications. This silicone pad sheet begins softening at 50°C to fill microscopic surface irregularities, effectively reducing thermal resistance.
- 0.014℃-in²/W thermal resistance for efficient heat transfer
- Naturally tacky at room temperature - no adhesive required
- No heat sink preheating needed for installation
- Maintains thermal performance after 1,000 hours at 130°C
- Withstands 500 thermal cycles from -25°C to 125°C
- Minimal migration (pump out) at operating temperatures
- High frequency microprocessors and computing systems
- Notebook and desktop PC cooling solutions
- Cooling components to chassis or frame
- High-speed mass storage drives
- LED TV backlight units and LED lighting systems
- RDRAM memory modules and micro heat pipe solutions
| Property | TIC805G | TIC808G | TIC810G | TIC812G | Test Method |
|---|---|---|---|---|---|
| Color | Gray | Gray | Gray | Gray | Visual |
| Thickness | 0.005" (0.127mm) | 0.008" (0.203mm) | 0.010" (0.254mm) | 0.012" (0.305mm) | Standard |
| Thickness Tolerance | ±0.0005" (±0.127mm) | ±0.0008" (±0.203mm) | ±0.0010" (±0.0254mm) | ±0.0012" (±0.0305mm) | Standard |
| Thermal Impedance @ 50 psi | 0.014℃-in²/W (0.09℃-cm²/W) | 0.020℃-in²/W (0.13℃-cm²/W) | 0.024℃-in²/W (0.15℃-cm²/W) | 0.028℃-in²/W (0.18℃-cm²/W) | ASTM D5470 |
0.005" (0.127mm), 0.008" (0.203mm), 0.010" (0.254mm), 0.012" (0.305mm) - Consult factory for alternate thicknesses
10" x 16" (254mm x 406mm) and 16" x 400" (406mm x 121.92M)
The TIC800G series features no reinforcement components that could reduce thermal performance, requires no pressure sensitive adhesive, and is supplied with white release paper and bottom liner. Available in kiss cut, extended pull tab liner, or individual die cut shapes for flexible application.
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