TIF500-75-11U High Thermal Conductivity Resistant Flame-Retardant Insulation 7.5W/MK Silicone Thermal Pad
High Thermal Conductivity Resistant Flame-Retardant Insulation 7.5W/MK Silicone Thermal Pad
Product descriptions
TlF®500-75-11U Series is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.
Features
> Good thermal conductive 7.5W/mK
> Moldability for complex parts
> Broad range of hardnesses available
> High tack surface reduces contact resistance
> RoHS compliant
> UL recognized
Application
> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Semiconductor automated test equipment (ATE)
> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
| Typical Properties of TIF®500-75-11U Series | |||
| Property | Value | Test method | |
| Color | Dark gray | Visual | |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** | |
| Density(g/cm³) | 3.45 | ASTM D792 | |
| Thickness Range(inch/mm) | 0.020~0.030 | 0.040~0.200 | ASTM D374 |
| (0.50~0.75) | (1.00~5.00) | ||
| Hardness | 50 Shore 00 | 27 Shore 00 | ASTM 2240 |
| Continuos Use Temp | -40 to 200℃ | ****** | |
| Breakdown Voltage(V/mm) | ≥ 5500 | ASTM D149 | |
| Dielectric Constant | 8.0 MHz | ASTM D150 | |
| Volume Resistivity | ＞1.0X1012 Ohm-meter | ASTM D257 | |
| Thermal Conductivity (W/m-K) | 7.5 | ASTM D5470 | |
| 7.5 | ISO22007 | ||
| Fire rating | V-0 | UL 94 (E331100) | |
Standard Thickness: 0.020" (0.50 mm)～ 0.200" (5.00 mm) with increments of 0.010" (0.25 mm).
Standard Size: 16"×16" (406 mm ×406 mm).
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
With professional R&D capabilities and many year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials.
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract.
5.Free sample offer.
6.Quality assurance contract.
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.