TIF080 AB-11S 8.0W/mK Two-Component Thermal Gel for Telecommunications and Electronics Cooling
TIF080 AB-11S is a high-performance two-component thermal gel featuring exceptional 8.0W/mK thermal conductivity. This liquid gap filling material cures at different temperatures and forms a soft, elastomeric interface for efficient heat transfer from electronic components to heat sinks or metal housings.
- Excellent thermal conductivity: 8.0W/mK
- Two-part formulation for extended shelf life and easy storage
- Superior mechanical and chemical stability across temperature extremes (-45°C to 200°C)
- Ultra-conforming low-stress interface application
- Flexible curing options: ambient or accelerated schedules
- Optimized shear thinning characteristics for easy dispensing
- Computer systems and peripherals
- Telecommunications equipment
- Automotive electronics
- Thermally conductive vibration dampening
- Heat sinks and heat-generating semiconductors
| Property | Value | Test Method |
|---|---|---|
| Thermal Conductivity | 8.0W/mK | ASTM D5470 |
| Continuous Use Temperature | -45°C to 200°C | Standard Test |
| Mix Ratio | 1:1 | Standard Test |
| Pot Life @25°C | 30 minutes | Standard Test |
| Cure Time @25°C | 120 minutes | Standard Test |
| Cure Time @100°C | 30 minutes | Standard Test |
| Hardness | 45 Shore 00 | ASTM D2240 |
| Voltage Strength | ≥4000 V/mm | ASTM D149 |
| Volume Resistivity | >1.0×10¹² Ohm-meter | ASTM D257 |
| Flame Rating | V-0 | UL 94 |
| Bond Line Thickness | 0.2mm | ASTM D374 |
| Density | 3.4g/cm³ | ASTM D792 |
Available in 50cc/pc (48pcs per box) and 400cc/pc (9pcs per box). Custom syringe packaging for automated dispensing applications is available upon request.
Ziitek Electronic Material and Technology Ltd. specializes in thermal management solutions for high-performance electronic equipment. Our products effectively control and dissipate heat to maintain optimal operating temperatures and extend component lifespan.
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