TIE380-25 One Part Thermal Conductive Epoxy Potting Compound 2.5W/mK with 140,000 cPs Viscosity
Price:
0.1-10 USD/KG
MOQ:
5kg
Delivery Time:
3-5 work days
Brand:
Ziitek
Product Description
TIE380-25 Thermal Conductive Epoxy Potting Compound
One-component, heat-cured epoxy adhesive with excellent thermal conductivity (2.5W/mK) and strong bonding performance. Ideal for high-speed production environments with stencil printing capability.
Key Features
- High thermal conductivity: 2.5W/mK
- Excellent adhesion to metals and ceramics
- Low shrinkage and viscosity
- Good solvent and water resistance
- Extended working time for precise application
- Superior thermal shock resistance
Technical Specifications
| Property | Value | Test Method |
|---|---|---|
| Thermal Conductivity | 2.5W/m-K | ASTM D5470 |
| Continuous Use Temperature | -40 to 180℃ | - |
| Tensile Strength (Al/Al @25°C) | >2800psi | - |
| Hardness | 92 Shore A | ASTM 2240 |
| Viscosity @25℃ | 140,000 cPs | - |
| Specific Gravity @25℃ | 2.1 g/cc | - |
Curing Procedures
| Curing Temperature | Curing Time |
|---|---|
| 100℃ | 3 Hours |
| 125℃ | 1.5 Hour |
| 150℃ | 20 Minutes |
| 170℃ | 5 Minutes |
Storage & Packaging
Shelf life: 10 days @25℃ / 6 months @0℃
Standard packaging: 1kg/can
Manufacturer Information
Ziitek Company specializes in thermal interface materials with professional R&D capabilities and extensive industry experience. Our commitment to quality, effectiveness, service excellence, and teamwork ensures reliable products and long-term customer partnerships.
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Company
CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
Location
Plot CN4, Ming Lang Industrial Cluster, Thu Tri Commune, Hung Yen Province, Vietnam
Contact Person
Sophia