The TIC800D Series is a high-performance thermal interface material featuring a polyimide film substrate coated with low-melting-point phase change material filled with ceramic blend. At 50°C, the material softens and flows to fill microscopic surface irregularities between heat sinks and integrated circuit boards, reducing thermal resistance and enhancing heat transfer efficiency.

• Highly compliant surface with high thermal conductivity
• High dielectric strength for electrical insulation
• Low thermal resistance with high voltage isolation
• Resistant to tears and punctures for durability

• Power semiconductors, MOSFETs, and IGBTs
• Audio and video components
• Automotive control devices
• Electric motor control equipment

Standard Thickness: 0.005" (0.127 mm). Custom thickness and die-cut shapes available upon request.

Standard Sizes: 10" x 100' (254 mm x 30 m). Individual die-cut shapes can be supplied.

Reinforcement: Polyimide film reinforcement for structural integrity.

Ziitek Electronic Material and Technology Ltd. specializes in developing composite thermal solutions and manufacturing superior thermal interface materials. With extensive experience in thermal engineering, we provide customized products, comprehensive product lines, and flexible production capabilities to meet diverse application requirements.