TIF100-30-05E High Temperature Resistant Heatsink Cooling Gap Filler Pad Thermal Conductive Silicone Pad For Cpu Gpu Ram
High Temperature Resistant Heatsink Cooling Gap Filler Pad Thermal Conductive Silicone Pad For Cpu Gpu Ram
The TIF®100-30-05E thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.
Features:
> Good thermal conductive: 3.0W/mK
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating
> Available in varies thicknesses
> Broad range of hardnesses available
> Moldability for complex parts
> Outstanding thermal performance
> High tack surface reduces contact resistance
> RoHS compliant
> UL recognized
Applications:
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics
> Set top boxes
> Audio and video components
> IT infrastructure
> GPS navigation and other portable devices
| Typical Properties of TIF®100-30-05E Series | |||
| Property | Value | Test method | |
| Color | Blue | Visual | |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** | |
| Density(g/cm³) | 3.0 | ASTM D792 | |
| Thickness Range(inch/mm) | 0.010~0.020 | 0.030~0.200 | ASTM D374 |
| (0.25~0.50) | (0.75~5.00) | ||
| Hardness | 65 Shore 00 | 35 Shore 00 | ASTM 2240 |
| Continuos Use Temp | -40 to 200℃ | *** | |
| Breakdown Voltage(V/mm) | ≥5500 | ASTM D149 | |
| Dielectric Constant | 7.0 MHz | ASTM D150 | |
| Volume Resistivity | ＞1.0X1012 Ohm-meter | ASTM D257 | |
| Thermal Conductivity (W/m-K) | 3.0 | ASTM D5470 | |
| 3.0 | ISO22007 | ||
| Fire rating | V-0 | UL 94 (E331100) | |
Product Specifications
Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size:16*×16 (406 mmX406 mm)
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1(Single-sided hardening).
Adhesive Options:A1/A2(Single-sided/Double-sided adhesive)
The TIF® series is available in custom shapes and various foms.
For other thicknesses or more information,please contact us.
Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.
Our services
Online-service : 12 hours , Inquiry reply within fastest.
Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).
Well-trained & experienced staff are to answer all your inquiries in English of course.
Standard Export Carton Or Marked With Customer's Information Or Customized.
Provide free samples
After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.
we will help you to deal with it and give you satisfactory solution.
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.