TIF050-11-1 Thermal Conductive Silicone Gel - 5.0 W/mK Conductivity, 3.25 g/cm³ Density for Electronics

TIF®050-11-1 is a premium thermal conductive silicone gel engineered for advanced electronic component thermal management. This ceramic-filled silicone material delivers exceptional thermal performance with 5.0 W/mK conductivity while providing low-stress protection for sensitive electronic components.

• High thermal conductivity: 5.0 W/mK for efficient heat dissipation
• Low stress characteristics: Protects sensitive components during assembly and operation
• Excellent plasticity: Free-forming ability for easy construction and assembly
• Superior dielectric properties: Breakdown voltage ≥6000 V/mm for electrical safety
• High temperature stability: Maintains performance in demanding thermal environments
• UL 94 V-0 certified: Meets flame resistance standards

• Power modules and semiconductor devices
• LED backlight modules and LED lighting systems
• High-speed hardware drivers and micro heat pipes
• Vehicle engine controllers and automotive electronics
• Telecom industry equipment and network infrastructure
• Semiconductor automatic laboratory equipment

• 30 cc per piece, 98 pieces per box
• 300 cc per piece, 6 pieces per box
• Custom packaging in syringes for automated dispensing applications available

Ziitek is a high-tech enterprise specializing in the research, development, manufacturing, and sales of thermal interface materials (TIMs). With advanced production equipment, comprehensive testing facilities, and fully automated coating production lines, we provide cutting-edge thermal management solutions including thermal silicone pads, graphite sheets, phase change materials, and thermal greases. All products comply with UL94 V-0, SGS, and ROHS standards.