TIG680-40AB 4.0W/MK High Thermal Conductive Two Component Potting Silicone Adhesive For Electronic Industry Heat Dissipation
TIG®680-40AB 4.0W/MK High Thermal Conductive Two Component Potting Silicone Adhesive For Electronic Industry Heat Dissipation
TIG®680-40AB Series is a two-component high thermal conductivity silicone sealant with room temperature curing, long working time, and flame retardant properties. This product is particularly suitable for sealing capacitors and small electronic devices. Its excellent flexibility properties enable it to provide excellent cushioning protection for coating materials. The low viscosity characteristic enables the thermal conductive sealant to cover the surface more comprehensively, greatly improving the heat transfer efficiency of the heating element or the entire printed circuit board to the metal shell or heat dissipation plate,thereby improving the performance and service life of electronic components.
Feature
> Good thermal conductivity: 2.0W/mK
> Good insulation performance
> Good elasticity
> Lower shrinkage
> Low viscosity,easy gas emissions
> Good solvent resistance and waterproof performance
> Longer working hours
> Excellent high and low temperature resistance
> No odor release during the curing process
> Heat sink assembly, thermal sensor potting,thermal conductive product potting
> Heat conduction between the battery cell and the cold tube
> LED and power drive potting
| Typical Properties of TIG®680-40AB Series | |||
| Material Properties (Before Curing) | |||
| Property | Numerical | Test Method | |
| Color/Part A | White | Visual | |
| Color/Part B | Gray | Visual | |
| Part A Viscosity (mPa.s) | 16000 | GB/T 10247 | |
| Part B Viscosity (mPa.s) | 23000 | GB/T 10247 | |
| Mix Ratio | 1:1 | Ziitek Test Method | |
| Shelf life | 6 months(Unopened) | Ziitek Test Method | |
| Cure Schedule | |||
| Pot Life @25℃ | 30~45 mins | Ziitek Test Method | |
| Cure @70℃ | 20~30 mins | Ziitek Test Method | |
| Cure Material Properties | |||
| Color | Gray | Visual | |
| Hardness (Shore A) | 25 | ASTM D2240 | |
| Density (g/cm³) | 3.15 | ASTM D792 | |
| Recommended Operating temperature (℃) | -45 ~200 | ***** | |
| Flame Rating | V-0 | UL 94 | |
| Thermal Conductivity (W/mK) | 4.0 | ASTM D5470 | |
| Breakdown Voltage (V/mm) | ≥10000 | ASTM D149 | |
| Dielectric Constant @1MHz | 6.0~8.0 | ASTM D150 | |
| Volume Resistivity (Ohm·cm) | 3.0x1013 | ASTM D257 | |
Company Profile
With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials.
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract.
5.Free sample offer.
6.Quality assurance contract.
Get in Touch
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