TIF100L 4035-06 Low Volatility Thermal Pad 100x100mm Highly Efficient Thermal Conductivity 4.0W/MK Heat Resistant High Temperature
Low Volatility Thermal Pad 100x100mm Highly Efficient Thermal Conductivity 4.0W/MK Heat Resistant High Temperature
Product descriptions
The TIF®100L 4035-06 Series is a soft, low-volatility thermal pad designed specifically for demanding application environments. While providing high thermal conductivity, it significantly reduces the content of volatile silicones. Its high flexibility allows it to fill uneveninterfaces effectively,achieving ultra-low thermal resistance and protecting delicate electronic components from mechanical stress damage. This series is an ideal thermal interface material of choice for fields sensitive to volatile substances, such as aerospace, automotive electronics, optical devices, and high-end communication equipment.
Features
> High thermal conductivity
> Low volatility
> High reliability
> Easy to install and operate
Applications
Electronic components, 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.
| Typical Properties of TIF®100L 4035-06 Series | |||
| Property | Value | Test method | |
| Color | White | Visual | |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** | |
| Density(g/cm³) | 3.1 | ASTM D792 | |
| Thickness Range(inch/mm) |
0.010~0.020 (0.25~0.5) |
0.030~0.200 (0.75~5.0) |
ASTM D374 |
| Hardness | 65 Shore 00 | 35 Shore 00 | ASTM 2240 |
| Continuos Use Temp | -40 to 200℃ | ****** | |
| Breakdown Voltage(V/mm) | ≥5500 | ASTM D149 | |
| Dielectric Constant @1MHz | 7.3 | ASTM D150 | |
| Volume Resistivity | ＞1.0X1012 Ohm-meter | ASTM D257 | |
| Thermal Conductivity(W/m.K) | 4.0 | ASTM D5470 | |
| 4.0 | ISO22007 | ||
| ∑D3-D10(PPM) | <100 | GC-MS | |
| Flame rating | V-0 | UL 94 (E331100) | |
Standard Thickness:0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"X16" (406 mm×406 mm)
The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Independent R&D team
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