TIG680-28AB 2.8W/MK High Thermal Conductive Two Component Potting Silicone Adhesive For High Voltage Package,Relay
2.8W/MK High Thermal Conductive Two Component Potting Silicone Adhesive For High Voltage Package,Relay
TIG®680-28AB Series is a two-component high thermal conductivity silicone sealant with room temperature curing, long working time, and flame retardant properties. This product is particularly suitable for sealing capacitors and small electronic devices. Its excellent flexibility properties enable it to provide excellent cushioning protection for coating materials. The low viscosity characteristic enables the thermal conductive sealant to cover the surface more comprehensively, greatly improving the heat transfer efficiency of the heating element or the entire printed circuit board to the metal shell or heat dissipation plate,thereby improving the performance and service life of electronic components.
Feature
> Good thermal conductivity: 2.8W/mK
> Good insulation performance
> Good elasticity
> Lower shrinkage
> Low viscosity,easy gas emissions
> Good solvent resistance and waterproof performance
> Longer working hours
> Excellent high and low temperature resistance
> No odor release during the curing process
> Heat sink assembly, thermal sensor potting,thermal conductive product potting
> Heat conduction between the battery cell and the cold tube
> LED and power drive potting
| Typical Properties of TIG®680-28AB Series | |||
| Material Properties (Before Curing) | |||
| Property | Numerical | Test Method | |
| Color/Part A | White | Visual | |
| Color/Part B | Gray | Visual | |
| Part A Viscosity (mPa.s) | 7000 | GB/T 10247 | |
| Part B Viscosity (mPa.s) | 8000 | GB/T 10247 | |
| Mix Ratio | 1:1 | Ziitek Test Method | |
| Shelf life | 6 months(Unopened) | Ziitek Test Method | |
| Cure Schedule | |||
| Pot Life @25℃ | 30~45 mins | Ziitek Test Method | |
| Cure @70℃ | 20~30 mins | Ziitek Test Method | |
| Cure Material Properties | |||
| Color | Gray | Visual | |
| Hardness (Shore A) | 25 | ASTM D2240 | |
| Density (g/cm³) | 2.95 | ASTM D792 | |
| Recommended Operating temperature (℃) | -45 ~200 | ***** | |
| Flame Rating | V-0 | UL 94 | |
| Thermal Conductivity (W/mK) | 2.8 | ASTM D5470 | |
| Breakdown Voltage (V/mm) | ≥8000 | ASTM D149 | |
| Dielectric Constant @1MHz | 6.0~8.0 | ASTM D150 | |
| Volume Resistivity (Ohm·cm) | 1.0x1013 | ASTM D257 | |
Company Profile
Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!
Ziitek Culture
Quality :
Do it right the first time, total quality control
Effectiveness:
Work precisely and thoroughly for effectiveness
Service:
Quick response, On time delivery and Excellent service
Team work:
Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.