CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
                                                                                                           
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TIF100-15-50S High Dielectric Strength Silicone-Based Gap Pad Filler For Consumer Electronics Cooling

Price Negotiable
Price: 0.1-10 USD/PCS
MOQ: 1000pcs
Delivery Time: 3-5 work days
Brand: Ziitek
Product Description

TIF100-15-50S High Dielectric Strength Silicone-Based Gap Pad Filler For Consumer Electronics Cooling

  

 Product descriptions

 

The TIF®100-15-50S Series is a well-balanced, general-purpose thermal pad. It offers good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components.

 

Features

 

> Good thermal conductivity 1.5W/mK
> Moldability for complex parts
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating
> Available in varies thicknesses

> RoHS compliant
> UL recognized

 

Application


Electronic Components – 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Netcom, Panel, Power Electronics, Robotics, Servers, Smart Home, Telecom, etc.

 

Typical Properties of TIF®100-15-50S Series
Property Value Test method
Color Pink Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³)

2.3

ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.50) (0.75~5.00)
Hardness 65 Shore 00 45 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 4.5 MHz ASTM D150
Volume Resistivity >1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 1.5 W/m-K ASTM D5470
1.5 W/m-K ISO22007

 

Product Specifications


Standard Thickness:0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm).
Standard Size: 16"X16" (406 mm X406 mm).


Component Codes:


Reinforcement Fabric: FG(Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening)-
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).


TheTIF® series is available in custom shapes and various forms
For other thicknesses or more information, please contact us.

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Company Profile

 

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

 

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

 

Ziitek Culture

 

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

 

 

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
Location Plot CN4, Ming Lang Industrial Cluster, Thu Tri Commune, Hung Yen Province, Vietnam
Contact Person Sophia

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