TIC800T Low Thermal Impedance 9.6W/MK Thermal Conductive Phase Change Material For Various Electrical Products
Low Thermal Impedance 9.6W/MK Thermal Conductive Phase Change Material For Various Electrical Products
Products description
The TIC®800T Series is an ultra-high thermal conductivity phase change material with a unique grain orientation structure. This structure achieves directional optimization of the heat flow path through micro ordered arrangement, significantly doubling the macroscopic thermal conductivity efficiency. When the temperature exceeds the phase transition point of 50℃, the material can soften and infiltrate the interface, filling micro irregular gaps, and ultimately forming a heat conduction channel with extremely low thermal resistance at the contact surface, improving the eficiency of the heat dissipation system.
Features
> Excellent thermal conductivity
> Good process compatibility
> Soft surface and self adhesive
> Low steady-state thermal resistance
Applications
> Power conversion equipment
> Payload processor
> Server CPU
> Game graphics card GPU chip heat dissipation
| Typical Properties of TIC®800T Series | |||
| Product Name | TIC®808T | TIC®810T | Testing standards |
| Color | Gray | Visual | |
| Thickness(inch/mm) | 0.008" | 0.010" | ASTM D374 |
| (0.20mm) | (0.25mm) | ||
| Density(g/cm³) | 2.8 | ASTM D792 | |
| Recommended Operating Temperature (℃) |
-40～125 | - | |
| Phase Change Temperature(℃) | 50~60 | - | |
| Thermal conductivity | 9.6 W/mK | ASTM D5470 | |
|
Thermal lmpedance (℃-in²/W)@10 psi |
0.018 | 0.019 | ASTM D5470 |
|
Thermal lmpedance (℃-in²/W)@50 psi |
0.013 | 0.014 | ASTM D5470 |
Product Specifications
Standard Thickness: 0.008" (0.20 mm), 0.010" (0.25 mm),
Standard Size: 10" x 16" (254 mm x 406 mm)
TIC®series can be molded into different shapes to provide. If you need different thicknesses or would like to learn more about thermal conductive materials, please contact our company.
Vietnam Ziitek Technology Company Limited (ZIITEK) has been deeply involved in the field of heat conducting materials for many years, and is a high-tech enterprise integrating R&D, production and sales. Headquartered in Dongguan, with four production bases in Kunshan, Taiwan Province and Viet Nam, the global delivery capacity is stable and reliable. Mainly engaged in thermal conductive silica pads, thermal conductive graphite sheets, thermal conductive insulation materials, PCM phase change materials, thermal conductive plastics, thermal conductive silicone grease/paste, thermal conductive gel, thermal conductive epoxy potting glue, thermal conductive silicone adhesive, silicone foam, and silicon-free thermal pads. The core explosive heating plate is widely recognized by the market. Our products have passed ISO9001 and IATF16949 certification, and meet RoHS/UL standards, and are widely used in new energy, 5G, data center, automotive electronics and other fields.
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in Vietnam.
Q: Do you accept custom orders ?
A:Yes , welcome to custom orders. Our custom elements including dimension , shape , color and coated on side or two sides adhesive or coated fiberglass. If you want to place a custom order , pls kindly offer a drawing or leave your custom order information .
Q: How much are the pads?
A: Price is depended on your size, thickness, quantity, and other requirements, such as adhesive and others. Please let us know these factors first so that we could give you an exact price.
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.