TIF100-50-50S 5.0W/mK Thermal Gap Filler Thermal Pad Suitable For Electronic Devices Requiring Heat Transfer And Insulation

5.0W/mK Thermal Gap Filler Thermal Pad Suitable For Electronic Devices Requiring Heat Transfer And Insulation

Products description

TIF^®100-50-50S Series is a well-balanced,general-purpose thermal pad.It offers high thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. It is an ideal choice for addressing medium to high power heat dissipation needs, achieving the best balance between cost and performance.

Features:
 

> Good thermal conductivity: 5.0W/mK

> Ultra soft and highly compliant
> Self-adhesive without the need for additional surface adhesives
> Easy release construction
> Electrically isolating
> High durability

Applications

> AI Servers, Inverters, Telecom Devices
> New energy vehicle power systems

> Monitoring the Power Box
> Medical Devices
> Auditioning electronic products
> Unmanned aerial vehicle(UAV)
> Photovoltaic
> Signal communication
> New energy vehicle
> Motherboard chip
> Radiator

> Electric vehicle batteries
> Computer CPU/GPU Cooling
> New energy vehicle power systemss

Product Specifications

Standard Thickness: 0.010"(0.250 mm)-0.20" (5.00 mm) with increments of 0.01 inch (0.25 mm).
Standard Size: 16"×16" (406 mm ×406 mm)

Component Codes:

Reinforcement Fabric: FG (Fiberglass).

Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

Notes: FG (Fiberglass) provides enhanced strength,
suitable for materials with thicknesses of 0.010" to 0.020" (0.25mm to 0.50mm)

The TIF^® series is available in custom shapes and various forms.

For other thicknesses or more information, please contact us.

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Company Profile

VIETNAM ZITEK TECHNOLOGY COMPANY LIMITD is dedicated to providing a comprehensive range of thermal management products and services to meet various demand scenarios. Ziitek Technology offers prompt and flexible services. Our thermal conductive materials are widely used in the fields of new energy, electronic appliances, transportation, industry, healthcare, communication, etc. Ziitek has obtained ISO9001, ISO14001 and IECQ certifications, which indicate our commitment to producing high-quality products and adopting excellent management methods. Our products comply with RoHS, REACH and UL standards, ensuring safety and reliability.

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

Independent R&D team

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