TIF030AB-WA Two Component 3.0W/MK Thermally Conductive Wave Absorbing Gel For Power Modules And Industrial Control Motherboards
Two Component 3.0W/MK Thermally Conductive Wave Absorbing Gel For Power Modules And Industrial Control Motherboards
TIF®030AB-WA is a two-component thermally conductive and wave-absorbing gel designed for high-performance equipment. It delivers excellent EMl suppression while boasting superior thermal conductivity, making it ideal for applications requiringsimultaneous electromagnetic interference absorption and heat dissipation. Its gel form ensures exceptional application flexibility and gap adaptability, along with outstanding compressibility and conformability. The product is compatible withlarge-scale, automated dispensing processes, and is especially suitable for irregular surfaces and gap scenarios.
Features
>Integrated thermal conductivity and wave absorption dual functions
>Highly flexible silicone gel material
>High-viscosity stable system, no filler migration
>Easy for automated operation of dispensing systems
>Long-term reliability
Applications
>RF modules for Routers/ Switches
>RF chips in smartphones,Tablets and Laptops
>Battery management system for new energy vehicles
>Power modules and Industrial control motherboards
>Lasers, Sensors and High-speed transmission interfaces
| Typical Properties of TIF®030AB-WA | ||
| Uncured Material Properties | ||
| Property | Value | Test Method |
| Construction | Ceramic and magnetic powder-filled silicone materials | - |
| Color/Part A | Gray | Visual |
| Color/Part B | Gray | Visual |
| Part A Viscosity (mPa·s) | 7,000,000 | GB/T 10247 |
| Part B Viscosity (mPa·s) | 7,000,000 | GB/T 10247 |
| Bond Line Thickness (mm) | 0.1 | - |
| Mix Ratio | 1:1 | - |
| Shelf Life(Month) | 12(Unopened) | - |
| Cure Schedule | ||
| Pot Life @25℃ | 30 mins | Ziitek Test Method |
| Cure @25℃ | 2-4 hours | Ziitek Test Method |
| Cure @70℃ | 30 mins | Ziitek Test Method |
| Cure Material Properties | ||
| Color | Gray | Visual |
| Hardness (Shore 00) | 60 | ASTM D2240 |
| Density(g/cm³) | 4.0 | ASTM D792 |
| Thermal Resistance @10psi (℃·in²/W) | 0.08 | ASTM D5470 |
| Thermal Resistance @50psi (℃·in²/W) | 0.07 | ASTM D5470 |
| Thermal Conductivity (W/Mk) | 3.0 | ASTM D5470 |
| Recommended Operating Temperature (°C) | -40~200℃ | - |
| Flame Rating | V-0 | UL 94 |
Product Specification:
50cc/pcs, 400cc/pcs,or customized packaging for automation applications.
For information on products of different specifications, please contact our company.
If you want to learn more about our thermal conductivity products, please visit our official website.
Company Profile
Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!
FAQ
Q: Are you trading company or manufacturer ?
A: We are manufacturer in Vietnam.
Q: What thermal conductivity test method was used to achieve the values given on the data sheets?
A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.
Q: Is GAP PAD offered with an adhesive?
A: Currently, Most of thermal gap pad surface has double side natural inherent tack,Non-stick surface can also be treated according to customer's requirements.
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.