Thermal Gap Filler

High Thermal Conductivity 8.0W/MK Low Dielectric Thermally Conductive Gap Filler Pads For Semiconductor Microwave Components Product Overview The TIF® 100N 8085-06 Series is a thermal pad that combines excellent heat dissipation performance with reliable structural support capability. It can fill interface gaps, establish efficient thermal conduction pathways, and provide stable mechanical support for stacked or adjacent electronic components, effectively meeting long-term

TIF 200-20-18U series thermal gap pad offers 2.0W/mK conductivity, super soft compliance, and high insulation. Self-adhesive, puncture resistant, and UL94 V-0 rated. Ideal for power electronics, automotive, and new energy applications. Custom shapes available.

2.5W/mK Silicone Thermal Pad EV Thermal Interface Material For Battery Pack Thermal Management Product Overview The TIF® 100 2540-11 Series is a versatile thermal pad with balanced performance. It offers good thermal conductivity and moderate hardness. This balanced design combines good surface fit and excellent operational convenience, providing effective heat transfer paths and basic physical protection for a wide range of electronic components. It is an ideal choice for

Thermal Gap Filler Designed To Improve Thermal Conductivity And Extend Service Life Of Electronic Components Product Overview The TIF® 100-30-15S Series is a well-balanced, general-purpose thermal pad offering high thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic

TIF 800Q series thermal pad offers 13.0W/mK conductivity, natural tack, and high compliance. Ideal for automotive, telecom, and LED applications. Available in custom shapes and thicknesses from 0.75mm to 5mm. UL 94 V0 rated.

TS-TIF 100C 8045-11 series silicone pad offers 8.0 W/mK thermal conductivity and excellent flexibility for uneven surfaces. UL94 V-0 rated, it efficiently transfers heat from components to cooling plates, extending equipment lifespan. Custom thicknesses and die-cut shapes available.

High conductivity 1.5W/mK thermal pad fills air gaps between heating elements and heat sinks. Soft, compressible with high tack surface. UL recognized, RoHS compliant. Custom thickness and die-cut shapes available.

Silicone Thermal Pad With 1.5W/mK Thermal Conductivity Product Overview The TIF® 100-15-01E Series is a well-balanced, general-purpose thermal pad offering good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. Key Features Good thermal conductivity Moldability

High-performance thermal pad with 1.5W/mK conductivity, soft and compressible for low-stress applications. UL94 V-0 rated, electrically isolating, and durable from -45 to 200°C. Ideal for automotive, LED, and telecom cooling. Custom thickness and die-cut options available.

TIF100-06S series silicone gap pad offers 1.5W/mK thermal conductivity, low hardness, and electrical isolation. Soft, compressible, and high tack for optimal thermal performance. UL recognized and RoHS compliant. Custom thicknesses and die-cut shapes available.

High-performance ceramic-filled silicone thermal pad with 8.5W/mK conductivity. Naturally tacky, flexible, and UL94 V-0 rated. Ideal for filling air gaps in GPU, CPU, and LED assemblies. Custom thicknesses and shapes available. RoHS compliant.

TIF 100-16-38UF thermal gap filler with 1.6 W/mK conductivity fills air gaps for optimal heat transfer. Soft, compressible, naturally tacky, RoHS and UL compliant. Custom shapes and thicknesses available.

Naturally tacky 6.5W/mK thermal pad fills air gaps between heat sources and heatsinks. Soft, compressible, and moldable for low-stress applications. UL V-0 rated, available in custom shapes and thicknesses. Enhances device stability and lifespan.

Soft, compressible gap filler with 1.5W/mK thermal conductivity and ≥5500V/mm breakdown voltage. Naturally tacky, UL94 V-0 rated, and available in custom shapes. Ideal for optical modules, LED, and automotive electronics.

Ultra-soft 3.0 W/m-K thermal pad with 12 Shore 00 hardness ensures perfect contact under low pressure. Self-adhesive, V-0 flame rated, and electrically insulating. Ideal for 5G, AI, EV, and aerospace electronics. Custom shapes and thicknesses available.

TIF®500-30-11U thermal pad offers 3.0W/m-K conductivity, ultra-soft conformability, and self-adhesive design. Ideal for routers, LEDs, and power systems. UL94 V-0 rated, custom shapes available. Balances performance and cost effectively.

Ultra-soft thermal interface material with 2.8 W/m-K conductivity and 0.5mm thickness. Protects sensitive components, self-adhesive, good insulation. Ideal for EV batteries, LEDs, and electronics. Custom shapes available. UL94 V-0 rated.

Ultra soft thermal gap pad with 5.0 W/mK conductivity, designed for AI processors and servers. Protects sensitive components from mechanical stress. Self-adhesive, flexible, and available in custom thicknesses. UL V-0 rated.

Ultra-soft thermal pad with 2.0W/mK conductivity, ideal for delicate components. Custom shapes, sizes, and thicknesses available. Electrically isolating, V-0 flame rated, and durable for industrial, automotive, and IT applications.

Ultra-soft thermal pad with 2.0W/mK conductivity, ideal for delicate components. UL94 V-0 rated, RoHS compliant. Custom shapes and thicknesses available. Reduces mechanical stress in high-precision assemblies.