Thermal Gap Filler

High-performance thermal gap filler with 6.2W/mK conductivity, 3mm thickness, and 200x400mm size. Fills air gaps to enhance heat transfer and component lifespan. Flexible, durable, with UL94 V0 rating. Custom sizes and adhesive options available. Ideal for LED lighting, automotive, and telecom applications.

High-performance thermal silicone pad with 1.25 W/mK conductivity, low thermal resistance, and high softness. Ideal for LED-lit lamps, automotive, and telecom. UL94 V-0, RoHS compliant. Custom thicknesses available.

High-performance silicone thermal gap filler with 5.0W/mK thermal conductivity for automotive electronics and LED applications. Features natural tackiness, UL94 V0 fire rating, and wide temperature range from -40°C to 200°C. Available in multiple thickness options with custom die-cut shapes for precise thermal management solutions.

High-performance thermal conductive rubber sheet gap filler with 1.25 W/mK thermal conductivity and 1.75g/cc density. Features adhesive coating, RoHS compliance, UL recognition, and electrical isolation. Ideal for electronics cooling in automotive, IT infrastructure, LED systems, and consumer electronics applications.

High-performance thermal interface material with 2.5 W/mK conductivity and 60 Shore 00 hardness. Features natural tackiness, UL 94 V-0 rating, and wide temperature range (-50°C to 200°C). Ideal for LED lighting, automotive electronics, telecommunications, and portable devices requiring efficient heat dissipation.

TIF120FG-20-15S is a soft, compressible silicone gap pad with 2W/mK thermal conductivity. Electrically isolating, naturally tacky, and available in 0.25mm to 5.08mm thicknesses. Ideal for CPUs, power supplies, and automotive electronics. UL94 V0 rated.

Soft, compressible thermal pad with 1.5W/mK conductivity fills air gaps between heat sources and sinks. Naturally tacky, UL94 V-0 rated, and available in custom thicknesses, shapes, and adhesive options. Ideal for LEDs, telecom, and automotive electronics.

High-performance thermal gap filler pad with fiberglass reinforcement, 0.5mm thickness, and 1.5 W/mK conductivity. Fills gaps, reduces contact resistance, and provides insulation. UL recognized, RoHS compliant, and available in custom sizes and adhesive options.

Flexible ceramic-filled silicone pad fills air gaps between heat sources and sinks. Thermal conductivity 1.5 W/mK, thickness from 0.25mm. Self-adhesive, UL94 V-0 rated. Ideal for laptops, LEDs, and automotive electronics. Custom sizes and fiberglass reinforcement available.

Soft, compressible thermal pad with 3.0W/mK conductivity. Naturally tacky, electrically isolating, and available in 0.25-5.00mm thickness. Ideal for ATE, LED, and telecom hardware. UL94 V-0 rated. Custom shapes and adhesive options available.

TIF200 series thermal gap filler offers 2.0 W/mK conductivity, low hardness, and electrical isolation. UL recognized, RoHS compliant, and available in 0.25-5.08mm thicknesses. Ideal for LED, power adapters, and routers. Custom die-cut and adhesive options available.

Soft, compressible thermal gap filler with 3.0 W/mK conductivity and naturally tacky surface for low-stress assembly. Reduces contact resistance, available in 0.25–5.08 mm thickness. Ideal for LEDs, telecom, automotive, and portable electronics. UL94 V0 rated.

High-performance thermal gap filler with 3.0 W/mK conductivity and glass fiber backing. Features natural tackiness, multiple thickness options from 0.25mm to 5.08mm, and UL94 V0 fire rating. Ideal for LED lighting, automotive electronics, and telecommunications applications requiring efficient heat dissipation.

High-performance thermal gap filler pad with 3.0 W/mK thermal conductivity and 5.5 MHz dielectric constant. Designed for LED lighting systems, telecommunications, and automotive applications. Features natural tackiness, UL 94 V0 fire rating, and available in thicknesses from 0.25mm to 5.08mm. Enhances heat dissipation efficiency and extends component lifespan.

TIF100-07E thermal pad offers 1.5W/mK conductivity, soft compressibility, and natural tack. Ideal for AI servers and ATE. UL94 V-0 rated, custom thicknesses available. Free samples offered.

TIF 120-07E thermal pad offers 1.5 W/mK conductivity and ultra-soft 35 Shore 00 hardness for low-stress CPU cooling. Naturally tacky, RoHS compliant, UL recognized. Custom thicknesses and shapes available.

TIF140-15-07E thermally conductive interface material features 1.5 W/mK thermal conductivity and low thermal impedance for efficient heat transfer. Available in thicknesses from 0.010" to 0.200" with UL 94 V0 fire rating. Ideal for electronics cooling in LED lighting, automotive systems, telecommunications, and portable devices.

TIF130-30-05S is a 3.0 W/mK blue silicone gap pad with natural tack, soft compressibility, and wide temp range -50 to 200C. Ideal for LED, automotive, telecom, and electronics cooling. UL94 V0 rated, customizable thickness, and available with adhesive or fiberglass reinforcement.

TIF110FG-05F thermal gap filler with 1.5 W/mK conductivity. Soft, compressible, naturally tacky. Available in 0.25mm to 5.08mm thickness. UL94 V0 rated. Ideal for filling air gaps in electronics, LED, telecom, and automotive applications.

TIF150-30-05S series gap filler offers 3.0 W/mK thermal conductivity with natural tack for no adhesive. Soft, compressible, and available in 20 thicknesses from 0.25mm to 5.08mm. UL94 V0 rated, ideal for LEDs, automotive, and telecom. Custom die-cut and adhesive options available.