Thermal Gap Filler

High-performance thermal gap filler with 5.0 W/mK conductivity, ultra-soft and compressible for low-stress AI processor cooling. Naturally tacky, available in custom thicknesses. UL94 V-0, RoHS compliant. Ideal for servers, LED, and telecom hardware.

TIF840QE thermally conductive filler pads efficiently fill air gaps between heating elements and heat sinks. With 13.0W/mK thermal conductivity, 1mm thickness, and natural tack, they enhance heat dissipation and component lifespan. Ideal for LED lighting, automotive electronics, and telecom equipment. UL94 V-0 compliant.

TIF310FG silicone pad with 2.8W/mK thermal conductivity fills air gaps between heat sources and sinks. Fiberglass reinforced, flexible, and UL certified. Ideal for LED lighting, automotive, and telecom. Custom thicknesses and adhesive options available.

High-performance thermal interface pad with 6.0 W/mK conductivity, UL recognized, fiberglass reinforced for durability. Ideal for LED TVs, LCD BLUs, and electronics. Custom thickness and adhesive options available.

Soft, compressible ceramic-filled silicone gap filler with 2.0W/mK thermal conductivity and 50 Shore 00 hardness. Naturally tacky, fiberglass reinforced for durability. Ideal for automotive engine control units, LED lighting, and telecom hardware. UL94 V0 rated, custom thicknesses available.

TIF600P series thermal gap filler pad offers 6.0 W/mK conductivity, soft and compressible for uneven surfaces. Naturally tacky, no adhesive needed. Available in 0.254mm to 5.080mm thickness. UL94 V0 rated, enhances component lifespan and efficiency.

Ultra-soft thermal gap filler with 4.0 W/m-K conductivity and 35 Shore 00 hardness. Conforms to irregular surfaces, reduces assembly stress. RoHS compliant, UL recognized. Ideal for high-speed drives, LED, and telecom hardware. Custom thicknesses available.

Soft, compressible thermal silicone pads with 1.5 W/mK conductivity for efficient heat transfer in electronic devices. Features natural tackiness, RoHS compliance, UL recognition, and fire rating 94 V0. Available in thicknesses from 0.51mm to 5.08mm for CPU, GPU, SSD, LED, and automotive applications.

TIF520S-FG thermal gap filler fills air gaps between heat sources and sinks. Soft, compressible, naturally tacky, and available in varied hardness. Offers 3W/mK conductivity, UL94 V0 rating, and custom thicknesses. Ideal for telecom, LED, and automotive electronics.

High-performance thermal interface pad with 3.0 W/mK conductivity and 3mm thickness. Soft, compressible, and naturally tacky for easy installation. Ideal for LED, automotive, and telecom applications. UL 94 V0 rated. Custom sizes and adhesive options available.

TIF100-30-05U thermal gap pad offers 3.0W/mK conductivity, ultra-soft naturally tacky surface, and wide temp range -50 to 200°C. UL94 V-0, SGS, ROHS compliant. Ideal for low-stress medical, LED, and telecom applications. Custom shapes available.

High thermal conductivity 3.2 W/mK silicone-based gap filler with UL94 V0 flammability rating. Naturally tacky, soft, and compressible for low-stress applications. Available in custom shapes and thicknesses from 0.25mm to 5.00mm. Ideal for LED, telecom, automotive, and semiconductor cooling.

TIF410FG thermal gap filler fills air gaps between heating elements and heat sinks. With 2.0 W/mK conductivity, fiberglass reinforcement, and 0.25mm thinness, it enhances heat transfer and component lifespan. UL 94 V-0 rated, customizable thickness and adhesive options available.

TIF4120 ultra soft thermal gap filler fills air gaps between heating elements and heat sinks. Features 2 W/mK thermal conductivity, 3 mm thickness, and ceramic filled silicone rubber. Offers custom shapes, adhesive options, and UL 94 V0 fire rating. Ideal for telecom, automotive, and IT hardware.

TIF4100 is a ceramic-filled silicone thermal gap filler with 2.0 W/mK conductivity and 2.5mm thickness. Flexible, durable, and cost-effective for uneven surfaces. UL94 V0 rated. Custom sizes and adhesive options available. Ideal for LED, telecom, and automotive electronics.

High-performance thermal silicone pad with 2.0W/mK conductivity, low thermal resistance, and high softness. UL94V0 rated, operates from -40°C to 160°C. Ideal for motherboards, LEDs, and power electronics. Custom thickness and adhesive options available.

High thermal conductivity 4.0W/mK, soft 55 Shore 00 hardness, and ceramic-filled silicone ensure efficient heat transfer and gap filling. Naturally tacky, compressible, and available in thicknesses from 0.25mm to 5.08mm. UL 94 V0 rated, ideal for LED controllers and electronics.

TIF400 series thermally conductive gap filler pads offer 2.0 W/mK thermal conductivity, natural tack, and high compressibility. Ideal for automotive ECUs, LED lighting, and telecom hardware. Available in 0.25mm to 5.08mm thicknesses with UL94 V0 rating and custom adhesive options.

High-performance thermal gap filler with 2.0 W/mK conductivity and 45 Shore 00 hardness. Soft, compressible, and electrically isolating for low-stress applications. UL94 V-0, SGS, ROHS compliant. Available in thicknesses from 0.25mm to 5.08mm with optional adhesive or fiberglass reinforcement.

High-performance thermal conductive pad with 13.0W/mK conductivity, naturally tacky, and high compliance. Fills irregular gaps between components and heat sinks. UL94 V-0 rated, available in custom shapes and thicknesses from 0.75mm to 5.0mm. Ideal for telecom, automotive, and LED applications.