Thermal Gap Filler

TIF130-20-05S is a naturally tacky, ultra soft silicone gap filler with 2.0 W/mK thermal conductivity. It requires minimal pressure, offers vibration dampening, and is electrically isolating. Ideal for high-voltage and heat sink applications. Available in various thicknesses with custom options.

Soft, compressible thermal gap filler with 1.5 W/mK conductivity. Naturally tacky, UL94 V-0 rated, available in 0.25mm to 5.08mm thickness. Ideal for micro heat pipes, LED TV, and automotive electronics. Custom die-cut and adhesive options available.

TIF130-05S is a soft, compressible thermal gap filler with 1.5W/mK conductivity and 55 Shore 00 hardness. Naturally tacky, it reduces thermal resistance between heat sources and sinks. Ideal for LED lighting, automotive, and telecom applications. UL94 V0 rated.

Soft, compressible thermal gap filler with 2.0 W/mK conductivity and 45 Shore 00 hardness. Electrically isolating, naturally tacky, and ideal for low-stress automotive ECU cooling. UL94 V0 rated, available in 0.25–5.08 mm thicknesses with custom die-cut options.

High-performance thermal interface pad with 1.5 W/mK conductivity and 55 Shore 00 softness. UL recognized, naturally tacky, and compressible for low-stress applications. Available in multiple thicknesses with custom die-cut and adhesive options. Ideal for LEDs, telecom, and automotive electronics.

TIF100-20-02S thermal silicone pad offers 2.0 W/mK conductivity, low thermal impedance, and high softness. Naturally tacky, UL94 V0 rated, and stable from -40°C to 160°C. Ideal for automotive ECUs, LED lighting, and power electronics. Custom thicknesses and die-cut shapes available.

Electrically insulating thermal gap filler with 1.6 W/mK conductivity. Soft, compressible, and moldable for complex assemblies. Ideal for LED TV, CPU cooling, and automotive ECUs. UL94 V-0 rated. Custom thicknesses and shapes available.

High-performance thermal interface material with 5.0 W/mK conductivity and 45 Shore 00 hardness. Blue ceramic-filled silicone rubber pad provides excellent heat transfer, insulation, and sealing for telecommunication hardware, automotive electronics, and LED applications. Available in multiple thicknesses with UL 94 V0 fire rating and customizable options.

High-performance thermal gap filler with 5.0 W/mK conductivity, ultra-soft and compressible for low-stress AI processor cooling. Naturally tacky, available in custom thicknesses. UL94 V-0, RoHS compliant. Ideal for servers, LED, and telecom hardware.

TIF310FG silicone pad with 2.8W/mK thermal conductivity fills air gaps between heat sources and sinks. Fiberglass reinforced, flexible, and UL certified. Ideal for LED lighting, automotive, and telecom. Custom thicknesses and adhesive options available.

High-performance thermal interface pad with 6.0 W/mK conductivity, UL recognized, fiberglass reinforced for durability. Ideal for LED TVs, LCD BLUs, and electronics. Custom thickness and adhesive options available.

Soft, compressible ceramic-filled silicone gap filler with 2.0W/mK thermal conductivity and 50 Shore 00 hardness. Naturally tacky, fiberglass reinforced for durability. Ideal for automotive engine control units, LED lighting, and telecom hardware. UL94 V0 rated, custom thicknesses available.

TIF600P series thermal gap filler pad offers 6.0 W/mK conductivity, soft and compressible for uneven surfaces. Naturally tacky, no adhesive needed. Available in 0.254mm to 5.080mm thickness. UL94 V0 rated, enhances component lifespan and efficiency.

Ultra-soft thermal gap filler with 4.0 W/m-K conductivity and 35 Shore 00 hardness. Conforms to irregular surfaces, reduces assembly stress. RoHS compliant, UL recognized. Ideal for high-speed drives, LED, and telecom hardware. Custom thicknesses available.

Soft, compressible thermal silicone pads with 1.5 W/mK conductivity for efficient heat transfer in electronic devices. Features natural tackiness, RoHS compliance, UL recognition, and fire rating 94 V0. Available in thicknesses from 0.51mm to 5.08mm for CPU, GPU, SSD, LED, and automotive applications.

TIF520S-FG thermal gap filler fills air gaps between heat sources and sinks. Soft, compressible, naturally tacky, and available in varied hardness. Offers 3W/mK conductivity, UL94 V0 rating, and custom thicknesses. Ideal for telecom, LED, and automotive electronics.

High-performance thermal interface pad with 3.0 W/mK conductivity and 3mm thickness. Soft, compressible, and naturally tacky for easy installation. Ideal for LED, automotive, and telecom applications. UL 94 V0 rated. Custom sizes and adhesive options available.

TIF100-30-05U thermal gap pad offers 3.0W/mK conductivity, ultra-soft naturally tacky surface, and wide temp range -50 to 200°C. UL94 V-0, SGS, ROHS compliant. Ideal for low-stress medical, LED, and telecom applications. Custom shapes available.

High thermal conductivity 3.2 W/mK silicone-based gap filler with UL94 V0 flammability rating. Naturally tacky, soft, and compressible for low-stress applications. Available in custom shapes and thicknesses from 0.25mm to 5.00mm. Ideal for LED, telecom, automotive, and semiconductor cooling.

High thermal conductivity 4.0W/mK, soft 55 Shore 00 hardness, and ceramic-filled silicone ensure efficient heat transfer and gap filling. Naturally tacky, compressible, and available in thicknesses from 0.25mm to 5.08mm. UL 94 V0 rated, ideal for LED controllers and electronics.