Thermal Gap Filler

Thermal Gap Filler in Telecommunication hardware The TIF100-03Fthermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the

gray Silicone Rubber 1.0 W/MK Thermal Gap Filler For Automotive Engine Control Units Company Profile Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field. We serve customers with customized products, full product lines and flexible production, which makes us be the

Violet Thermal Conductivity Materials thermal gap filler 1.5 W/M-K For Micro Heat Pipe Thermal Solutions Company Profile Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating

Blue Thermal Gap Filler For Semiconductor Automated Test Equipment silicone sheet 1.5 W/m-K Company Profile Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production

thermal gap filler In High Speed Mass Storage Drives 2.0 W/M-K Cyan thermal conductive TIF100-200S Company ProfileZiitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. The TIF100-200S thermally conductive interface materials are applied to fill the air gaps between the heating

Telecommunication Hardware 3.0W/M-K Thermal Gap Fillers Materials With High Thermal Conductivity The TIF®100-30-02US thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which

Gray Heat Sinking Housing Thermal Gap Filler Available in varies thickness, 1.5W/mK Company Profile With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others. The TIF100-20-02E is not only designed

Thermal Gap Filler in Micro heat pipe thermal solutions 4.0 W/m-K The light blue The TIF100-40-12S​ thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect

6.2 W/M-K Deep Red​ Thermal Gap Filler For Handheld Portable Electronics Company Profile Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field. We serve customers with customized products, full product lines and flexible production, which makes us be the best and

High Speed Mass Storage Drives Thermally Gap Filler 2.0 W/M-K Light Green​ Company ProfileZiitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market.Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and

Thermal Gap Filler Heat Conductivity Materials For Cooling Components, 1.5 W/m-K The TIF100-15-16Sthermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances

Ultra thin blue silicone pad 1.5W/mK TIF130-05S thermal gap filler 2.10 g/cc 55 Shore 00 for LED lighting Company Profile With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others. The TIF130-05S use

Cooling components to the chassis of frame Thermally Conductive Filler Ultrasoft Low Thermal Resistance The TIF100-15-19U thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB,

Thermal Gap Filler in Semiconductor automated test equipment (ATE) Applications: > Cooling components to the chassis of frame > High speed mass storage drives > Heat Sinking Housing at LED-lit BLU in LCD > LED TV and LED-lit lamps > RDRAM memory modules > Micro heat pipe thermal solutions > Automotive engine control units > Telecommunication hardware > Handheld portable electronics > Semiconductor automated test equipment (ATE) Typical Properties of TIF™110FG-05F Se

Gray 2.0W/mK silicone rubber sheet Thermally Gap Filler silicone pad For Telecommunication Hardware 27Shore 00 Company Profile With professional R&D capabilities and over 13 year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation. The TIF160-20-10Uthermally

Soft Silicone Rubber High thermal gap filler, Heat Insulation Pad, RoHS compliant 45 Shore 00 Company Profile With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others. The TIF™200-U Series products

Soft Compressible Siliocne Gray Thermally Gap Filler For RDRAM Memory Modules 1.5W/M-K 45 Shore00 Hardness The TIF®100-02S thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB,

Compressible Thermal Gap Filler For Semiconductor Automated Test Equipment, High tack surface reduces resistance The TIF100-12F thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire

Thermal Gap Filler 2.0 W/m-K Temperature conductive silicone rubber pad For LED TV / LED-Lit Lamps 35 Shore 00 Company Profile With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others. The TIF100-20

LED TV and LED-lit lamps Thermal Gap Filler Replace Bergquist Sil-PAD900 For CPU Heat Sinking Company Profile Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field. We serve customers with customized products, full product lines and flexible production, which makes