Thermal Gap Filler

TIF100-12F series thermal gap filler offers 1.5 W/mK conductivity, high tack surface, and compressibility for low-stress applications. Ideal for semiconductor ATE, it reduces thermal resistance. Available in 0.25-5.08mm thickness with custom options, UL 94 V0 rated.

Soft and compressible thermal pad with 2.5 W/m-K conductivity and strong adhesive backing. Fills uneven gaps to enhance heat transfer. UL94 V-0, ROHS compliant. Custom thicknesses and die-cut shapes available.

Ultrasoft thermal pad with 2.0 W/mK conductivity, 45 Shore 00 hardness, and ceramic-filled silicone. Naturally tacky, compressible, and available in thicknesses from 0.254 mm to 5.080 mm. Ideal for CPU heatsinks, LED TV, and automotive ECUs. UL, ISO9001, and IATF16949 certified. Custom adhesive and reinforcement options available.

TIF600GP is a soft, compressible thermal pad with 6.0 W/mK conductivity. Electrically isolating, naturally tacky, and available in thicknesses from 0.254mm to 5.080mm. UL 94 V0 rated, ideal for high-voltage isolation and uneven surfaces.

Silicone-based thermal gap pad with 2.0W/mK conductivity, 45 Shore 00 softness, and >10000VAC dielectric strength. Naturally tacky, compressible, and electrically isolating. Ideal for automotive, telecom, and LED applications. Custom thickness and adhesive options available.

High-performance thermal gap filler with 3.0 W/mK conductivity, 35 Shore 00 softness, and low thermal impedance. Operates from -50°C to 200°C, UL94V0 rated. Naturally tacky, compressible, and available in custom thicknesses for LED, automotive, and telecom applications.

High-performance thermal interface material with 2.0W/mK conductivity and 60 Shore 00 hardness. This ceramic-filled silicone elastomer provides exceptional heat dissipation for electronics cooling applications. Features natural tackiness, RoHS compliance, UL recognition, and operates from -45°C to 200°C. Ideal for LED systems, automotive electronics, and telecommunications hardware.

Ceramic-filled silicone thermal gap filler with 2.0 W/mK conductivity and natural tackiness. Available in thicknesses from 0.25mm to 5.08mm with UL 94 V-0 rating. Ideal for LED lighting, telecommunications, automotive electronics, and portable devices requiring efficient heat dissipation.

High-performance ceramic-filled silicone rubber thermal gap filler with 4.0W/mK conductivity and natural tackiness. Ideal for handheld portable electronics, LED systems, and automotive applications. Features vibration dampening, UL94 V0 fire rating, and available in 20 thickness options from 0.010" to 0.200" for optimal heat dissipation.

High-performance thermal gap filler with 2.0 W/mK conductivity and 35 Shore 00 hardness. This 2.032 mm silicone rubber sheet provides excellent thermal management for electronics, featuring natural tackiness, electrical isolation, and UL94 V-0 compliance. Ideal for LED systems, automotive controls, and portable devices.

Thermal Gap Filler Designed To Improve Thermal Conductivity And Extend Service Life Of Electronic Components Product Overview The TIF® 100-30-15S Series is a well-balanced, general-purpose thermal pad offering high thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic

Thermal Gap Filler Providing Superior 4.0W/mK Thermal Conductivity and Electrical Insulation for Electronic Device Applications Product Overview The TIF® 100-40-10F Series is a structurally supportive thermal pad designed to provide high heat dissipation while also ensuring structural support and durability. It can reliably fill interface gaps, transfer heat, and offer mechanical support for stacked components, resisting compressive deformation. This product is an ideal

Thermal Conductive Pad Designed to Provide Heat Dissipation and Electrical Insulation for High Power Electronic Components Product Overview The TIF® 100-11S Series is a well-balanced, general-purpose thermal pad offering good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of

TIF 800Q series thermal pad offers 13.0W/mK conductivity, natural tack, and high compliance. Ideal for automotive, telecom, and LED applications. Available in custom shapes and thicknesses from 0.75mm to 5mm. UL 94 V0 rated.

RoHS Compliant Custom Thickness And Shape Extremely Soft Thermal Pads For New Energy Charging Box Product Overview The TIF® 100-18-11U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with an exceptionally gel-like softness, achieving a low-stress perfect fit. It is suitable for addressing issues in high-precision

TS-TIF 100C 8045-11 series silicone pad offers 8.0 W/mK thermal conductivity and excellent flexibility for uneven surfaces. UL94 V-0 rated, it efficiently transfers heat from components to cooling plates, extending equipment lifespan. Custom thicknesses and die-cut shapes available.

Thermal Conductive Pad Silicone Material with 3.0W/mK Thermal Conductivity for Power Tools Heat Dissipation Applications Company Profile Dongguan Ziitek Electronic Material and Technology Ltd. (ZIITEK ) has been deeply involved in the field of heat conducting materials for many years, and is a high-tech enterprise integrating R&D, production and sales. Headquartered in Dongguan, with four production bases in Kunshan, Taiwan Province and Viet Nam, the global delivery capacity

High conductivity 1.5W/mK thermal pad fills air gaps between heating elements and heat sinks. Soft, compressible with high tack surface. UL recognized, RoHS compliant. Custom thickness and die-cut shapes available.

Thermal Gap Filler Providing Heat Transfer And Insulation And Sealing Properties For Compact Electronic Assemblies Product Overview The TIF® 100-50-50S Series is a well-balanced, general-purpose thermal pad offering high thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic

Silicone Thermal Pad With 1.5W/mK Thermal Conductivity Product Overview The TIF® 100-15-01E Series is a well-balanced, general-purpose thermal pad offering good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. Key Features Good thermal conductivity Moldability