Thermal Gap Filler

TIF100-12F series thermal gap filler offers 1.5 W/mK conductivity, high tack surface, and compressibility for low-stress applications. Ideal for semiconductor ATE, it reduces thermal resistance. Available in 0.25-5.08mm thickness with custom options, UL 94 V0 rated.

Soft and compressible thermal pad with 2.5 W/m-K conductivity and strong adhesive backing. Fills uneven gaps to enhance heat transfer. UL94 V-0, ROHS compliant. Custom thicknesses and die-cut shapes available.

Ultrasoft thermal pad with 2.0 W/mK conductivity, 45 Shore 00 hardness, and ceramic-filled silicone. Naturally tacky, compressible, and available in thicknesses from 0.254 mm to 5.080 mm. Ideal for CPU heatsinks, LED TV, and automotive ECUs. UL, ISO9001, and IATF16949 certified. Custom adhesive and reinforcement options available.

TIF600GP is a soft, compressible thermal pad with 6.0 W/mK conductivity. Electrically isolating, naturally tacky, and available in thicknesses from 0.254mm to 5.080mm. UL 94 V0 rated, ideal for high-voltage isolation and uneven surfaces.

Silicone-based thermal gap pad with 2.0W/mK conductivity, 45 Shore 00 softness, and >10000VAC dielectric strength. Naturally tacky, compressible, and electrically isolating. Ideal for automotive, telecom, and LED applications. Custom thickness and adhesive options available.

High-performance thermal gap filler with 3.0 W/mK conductivity, 35 Shore 00 softness, and low thermal impedance. Operates from -50°C to 200°C, UL94V0 rated. Naturally tacky, compressible, and available in custom thicknesses for LED, automotive, and telecom applications.

High-performance thermal interface material with 2.0W/mK conductivity and 60 Shore 00 hardness. This ceramic-filled silicone elastomer provides exceptional heat dissipation for electronics cooling applications. Features natural tackiness, RoHS compliance, UL recognition, and operates from -45°C to 200°C. Ideal for LED systems, automotive electronics, and telecommunications hardware.

Ceramic-filled silicone thermal gap filler with 2.0 W/mK conductivity and natural tackiness. Available in thicknesses from 0.25mm to 5.08mm with UL 94 V-0 rating. Ideal for LED lighting, telecommunications, automotive electronics, and portable devices requiring efficient heat dissipation.

High-performance ceramic-filled silicone rubber thermal gap filler with 4.0W/mK conductivity and natural tackiness. Ideal for handheld portable electronics, LED systems, and automotive applications. Features vibration dampening, UL94 V0 fire rating, and available in 20 thickness options from 0.010" to 0.200" for optimal heat dissipation.

High-performance thermal gap filler with 2.0 W/mK conductivity and 35 Shore 00 hardness. This 2.032 mm silicone rubber sheet provides excellent thermal management for electronics, featuring natural tackiness, electrical isolation, and UL94 V-0 compliance. Ideal for LED systems, automotive controls, and portable devices.

Ultra-soft thermal pad with 6.0W/mK conductivity, ideal for protecting sensitive components. UL recognized, RoHS compliant. Custom shapes and thicknesses available for automotive, LED, and telecom applications.

RoHS Compliant Custom Thickness And Shape Extremely Soft Thermal Pads For New Energy Charging Box Product Overview The TIF® 100-18-11U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with an exceptionally gel-like softness, achieving a low-stress perfect fit. It is suitable for addressing issues in high-precision

Thermal Conductive Pad Designed to Provide Heat Dissipation and Electrical Insulation for High Power Electronic Components Product Overview The TIF® 100-11S Series is a well-balanced, general-purpose thermal pad offering good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of

TIF®100-50-11F series thermal pad offers 5.0W/mK conductivity, soft compressibility, and natural tack. UL recognized and RoHS compliant. Ideal for AI processors, automotive electronics, and LED lighting. Custom shapes and thicknesses available.

Thermal Gap Filler Providing Superior 4.0W/mK Thermal Conductivity and Electrical Insulation for Electronic Device Applications Product Overview The TIF® 100-40-10F Series is a structurally supportive thermal pad designed to provide high heat dissipation while also ensuring structural support and durability. It can reliably fill interface gaps, transfer heat, and offer mechanical support for stacked components, resisting compressive deformation. This product is an ideal

Thermal Gap Filler Pads Low Volatility Silicone Material for Enhanced Thermal Conductivity in Electronic Components and Optical Devices Products description The TIF® 100L 3030-06 Series is an ultra-low silicon oxygen volatilization thermal pad designed specifically for the thermal management needs of optical and high-precision electronic devices.Balances efficient thermal conductivity and extremely low precipitation of condensable volatile substances, effectively avoiding

Custom Thermal Pad 2.0w/mk 0.25mm-5mm Thickness RoHS UL Certified Thermal Silicone Conductive Pads For LED Battery The TIF® 100-20-10F Series is a structurally supportive thermal pad designed to provide excellent heat dissipation while ensuring structural support and durability. It reliably fills interface gaps, transfers heat efficiently, and offers mechanical support for stacked components, resisting compressive deformation. This product is ideal for applications requiring

Thermal Gap Filler Providing Heat Transfer And Insulation And Sealing Properties For Compact Electronic Assemblies Product Overview The TIF® 100-50-50S Series is a well-balanced, general-purpose thermal pad offering high thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic

Flexible Thermal Gap Filler Reinforced With Fiberglass For Thermal Management In LED TV And LED Lit Lamps Product Overview TIF® 100-18-02s Series is a well-balanced, general-purpose thermal pad offering good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. Key

Soft, compressible thermal pad with 1.5W/mK conductivity. Fills gaps, transfers heat, and provides mechanical support. UL V-0 rated, RoHS compliant. Custom shapes and thicknesses available. Ideal for LEDs, automotive, and AI processors.