Thermal Gap Filler

TIF100-12E silicone rubber thermal gap filler provides 1.5 W/mK thermal conductivity with 45 Shore 00 hardness for optimal heat dissipation. This RoHS compliant, UL 94 V0 rated material offers excellent moldability, electrical isolation, and high tack surface for reduced contact resistance in electronic cooling applications including LED systems and storage drives.

High-performance thermal interface material with 5.0 W/mK conductivity and 45 Shore 00 hardness. Blue ceramic-filled silicone rubber pad provides excellent heat transfer, insulation, and sealing for telecommunication hardware, automotive electronics, and LED applications. Available in multiple thicknesses with UL 94 V0 fire rating and customizable options.

High-performance ceramic-filled silicone rubber thermal gap filler with 4.0W/mK conductivity and natural tackiness. Ideal for handheld portable electronics, LED systems, and automotive applications. Features vibration dampening, UL94 V0 fire rating, and available in 20 thickness options from 0.010" to 0.200" for optimal heat dissipation.

High-performance thermal gap filler with 3.0 W/mK conductivity and glass fiber backing. Features natural tackiness, multiple thickness options from 0.25mm to 5.08mm, and UL94 V0 fire rating. Ideal for LED lighting, automotive electronics, and telecommunications applications requiring efficient heat dissipation.

High-performance thermal gap filler pad with 3.0 W/mK thermal conductivity and 5.5 MHz dielectric constant. Designed for LED lighting systems, telecommunications, and automotive applications. Features natural tackiness, UL 94 V0 fire rating, and available in thicknesses from 0.25mm to 5.08mm. Enhances heat dissipation efficiency and extends component lifespan.

High-performance thermal gap filler with 2.0 W/mK conductivity and 35 Shore 00 hardness. This 2.032 mm silicone rubber sheet provides excellent thermal management for electronics, featuring natural tackiness, electrical isolation, and UL94 V-0 compliance. Ideal for LED systems, automotive controls, and portable devices.

High-performance thermal conductive rubber sheet gap filler with 1.25 W/mK thermal conductivity and 1.75g/cc density. Features adhesive coating, RoHS compliance, UL recognition, and electrical isolation. Ideal for electronics cooling in automotive, IT infrastructure, LED systems, and consumer electronics applications.

Compressible silicone thermal gap filler with 1.5 W/mK conductivity, naturally tacky surface, and excellent vibration dampening. Ideal for memory modules, CPUs, and automotive electronics with UL94 V-0, ROHS, and multiple ISO certifications. Available in thicknesses from 0.25mm to 5.08mm for various application requirements.

High-performance thermal interface material with 2.5 W/mK conductivity and 60 Shore 00 hardness. Features natural tackiness, UL 94 V-0 rating, and wide temperature range (-50°C to 200°C). Ideal for LED lighting, automotive electronics, telecommunications, and portable devices requiring efficient heat dissipation.

TIF™100 Series thermal gap filler provides 1.5W/mK conductivity for automotive engine control units and electronics. Features natural tackiness, compressible design, and UL 94V-0 fire rating. Available in thicknesses from 0.25mm to 5.08mm with optional adhesive and reinforcement options for enhanced thermal management.

Thermal Gap Filler with Superior Thermal Conductivity and Softness to Improve Cooling Efficiency of Electronic Assemblies Products description TIF® 100-30-11US Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combineshigh thermal conductivity with exceptional gel-level softness achieving a perfcly low-stress fit ,It is suitable for addressing issues such as

Thermal Gap Filler Offering Superior Softness and Thermal Conductivity to Enhance Cooling and Reliability of Electronic Assemblies Products description TIF® 100-30-10S Series is a well-balanced,general-purpose thermal pad. It offers good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range

Thermal Gap Filler Designed to Enhance Heat Dissipation and Extend Lifespan of Electronic Components in Embedded Systems Products description TIF® 100-20-10S Series is a well-balanced,general-purpose thermal pad.It offers good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of

Low Volatility Silicone Thermally Conductive Gap Filler Pads For Embedded Motherboard Products description The TIF® 100L 2050-06 eries is a thermal pad with ultra-lowsiliconoxygen volatilization, designed specifically for optical and high-precision applications. Its soft and elastic material can fill the uneven gaps between heating elements and heat sinks or metal bases, limprove thermal conductivity efficiency,and effectively extend the life of electronic components. The

Multiple Thickness Factory Thermal Pad Thermally Conductive Silicone Pad For Electric Products Company Profile A silicone thermal pad is a type of thermal interface material (TIM) which is highly conductive and comprises of conformable materials which are used to provide a heat path between heat sinks and electronic devices where uneven surface topography, air gaps and texture preclude good thermal transfer. Ziitek supply a wide range of silicone thermal pads with varying

Thermal Management Materials Premium Soft Thermally Conductive Gap Filler Pads For Street Lights The TIF®160-07E Series is a well-balanced, general-purpose thermal pad. It offers good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use,making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. Features > Good thermal

1.5W/M. K Silicone Thermal Pad Manufacturer Direct Sale High Temperature Thermal Pad For CPU/GPU/SSD The TIF®100-05U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines good thermal conductivity with an exceptionally gel-like softness, achieving a low-stress perfect fit. Features > Good thermal conductivity: 1.5W/mK > Moldability for complex parts >

Naturally Tacky 6.5W Ultra Soft Thermal Conductive Gap Filler Pad For LED CPU GPU EV Battery TIF®100 6520-11 series of thermal interface materials is specifically designed to fill air gaps between heat-generating components and heat sinks or metal baseplates.lt offers excellent compliance, allowing it to conform tightly to heat sources with varying shapes and height differences. Even in confined or irregular spaces,it maintains stable thermal conductivity, enabling efficient

Easy And Safe To Install 7.5W/M.K Thermal Pads Silicone Cooling Pad With Self-Adhesive For PC Laptop The TIF®500-75-11U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress.This product combines high thermal conductivity with exceptional gel-level softness, achieving a perfectly low stress fit. It is suitable for addressing issues such as large tolerances, uneven surfaces,

Easy And Safe To Install 7.5W/M.K Thermal Pads Silicone Cooling Pad With Self-Adhesive For PC Laptop The TIF®500-75-11U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress.This product combines high thermal conductivity with exceptional gel-level softness, achieving a perfectly low stress fit. It is suitable for addressing issues such as large tolerances, uneven surfaces,