Thermal Gap Filler

Garnet silicone Thermal gap filler Heatsink Thermal Pad 6.0 W/MK The TIF600P Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components. Features: > Good thermal conductive:6.0 W/mK > Naturally tacky needing no further adhesive coating

Thermal Gap Filler Replace Gap pad VO Ultra Soft for Cooling Components / LED TV Yellow Soft Compressible Ziitek provide thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products and so on, for various applications. The TIF™200 Series is

Ceramic Filled Silicone Rubber 2.0 W/mK Thermal Gap Filler TIF™100-20-19S, 45 Shore 00 ​ Company Profile Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines

Gap pad 2500 Compressible Conductive Heatsink Thermal Pad With Adhesive Backing 2.5 W / mK Company Profile Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production

Naturally Tacky Rubber Gap Filler Thermally Conductive Interface Materials 3.0 W/MK The TIF150-30-05S thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect

Pink 3W/mK High Tack Surface Reduces Contact Resistance Thermal Gap Filler G579 2.10 g/cc The TIF140-30-49U is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an

Soft Compressible Violet 4W Thermal Gap Filler 50 shore00 apply for High speed mass storage drives The TIF™100-40-16S Series is an extremely soft gap filling material rated at a thermal conductivity of 4.0 W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique filler package and ultra low modulus resin formulation. Ziitek TIF™100-40-16S (产品型号) is

2.0 W/mK Ultrasoft CPU Heatsink Pad , Green Thermal Silicone Pads TIF100-20-07E thermal gap filler 45 Shore 00 Company Profile Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications. The TIF100-20-07E is not only designed to take advantage of

Heat Sinking Housing Conductive Garnet Thermal Gap Filler 6.0 W/MK UL / RoHs silicone rubber pad 45shore00 The TIF600GP is an electrically isolating material, which allows its use in applications requiring isolation between heat sinks and high-voltage, bare-leaded devices. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB,

China company supplied Heatsink Cooling 4W Thermal Gap Filler Ultra soft Low Thermal Resistance for Memory Modules The TIF100-40-12U thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the

2.0W/mK PINK High Voltage Isolation Thermal Gap Filler, TIF100-20-15S Cooling Heatsink 45 Shore 00 -50 to 200℃ Company Profile With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others. The TIF100-20

Moldability for complex partsBlue 4.0 W/mK Naturally Tacky Thermal Gap Filler TIF100-40-05E with Adhesive Coating Silicone Rubber sheet -50 to 200℃Company ProfileZiitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing

Pink Heat Dissipation Fins Thermal Gap Filler For LED - lit Lamps -40 - 160℃ Continuos Use Temp 1.0 W/m-K Company Profile Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating

Ultrasoft CPU Heatsink Green 3.0W / m - K silicone thermal gap filler TIF100-30-07E with 35shore00 Company Profile With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others. The TIF100-30-07E This

3.0 W/m-K Ultrasoft Low Thermal Resistance High Temperature blue Thermal Gap Filler 35 shore00 TIF100-30-12E The TIF100-30-12E thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -50℃~200℃ and meet the requirement of UL94V0. Features: > Good thermal conductive:3.0 W/mK > Naturally tacky needing no further adhesive coating >

High-performance thermal interface material with 2.0W/mK conductivity and 60 Shore 00 hardness. This ceramic-filled silicone elastomer provides exceptional heat dissipation for electronics cooling applications. Features natural tackiness, RoHS compliance, UL recognition, and operates from -45°C to 200°C. Ideal for LED systems, automotive electronics, and telecommunications hardware.

High-performance silicone thermal gap filler with 5.0W/mK thermal conductivity for automotive electronics and LED applications. Features natural tackiness, UL94 V0 fire rating, and wide temperature range from -40°C to 200°C. Available in multiple thickness options with custom die-cut shapes for precise thermal management solutions.

Ceramic-filled silicone thermal gap filler with 2.0 W/mK conductivity and natural tackiness. Available in thicknesses from 0.25mm to 5.08mm with UL 94 V-0 rating. Ideal for LED lighting, telecommunications, automotive electronics, and portable devices requiring efficient heat dissipation.

Soft, compressible thermal silicone pads with 1.5 W/mK conductivity for efficient heat transfer in electronic devices. Features natural tackiness, RoHS compliance, UL recognition, and fire rating 94 V0. Available in thicknesses from 0.51mm to 5.08mm for CPU, GPU, SSD, LED, and automotive applications.

High-performance thermal interface pad with 1.6 W/mK conductivity, naturally tacky surface, and UL 94 V0 fire rating. Available in thicknesses from 0.25mm to 5.08mm for LED lighting, power adapters, and electronic cooling applications. Features ceramic-filled silicone construction with temperature range -40°C to 160°C and customizable adhesive options.