Thermal Conductive Glue

One-component room temperature cure silicone adhesive with 2.0W/mK thermal conductivity and UL94 V-0 flame retardancy. Features low shrinkage, excellent electrical insulation, and strong adhesion to metals. Ideal for LED cooling, power modules, and electronic component thermal management applications.

Two-component silicone encapsulant with 2.8W/m-K thermal conductivity and UL 94 V-0 fire resistance rating. Designed for LED lighting heat spreaders, power drivers, and electronic component potting. Features low viscosity, 30-minute pot life, and operating range from -40℃ to 160℃. Enhances thermal management and extends component lifespan in industrial applications.

TIS®580-25 is a one-component, room-temperature curing silicone adhesive with 2.5W/mK thermal conductivity. Features excellent adhesion, moisture resistance, and UL94 V-0 flame rating. Ideal for bonding, insulation, and sealing in household appliances and electronics. Operates from -50°C to 250°C.

Single-component thermally conductive silicone adhesive with 1.2W/mK thermal conductivity and UL94V-0 rating. Features excellent electrical insulation, adhesion to metals, and operation from -60°C to 250°C. Ideal for LED cooling, electronics heat management, and industrial applications requiring reliable thermal interface solutions.

High-performance two-component silicone potting compound with 3.5W/mK thermal conductivity and UL 94 V-0 fire resistance. Designed for LED heat spreaders, power drivers, and electronic components requiring efficient heat dissipation and excellent insulation properties. Operating temperature range from -40°C to 160°C with low viscosity for easy application.

High-performance one-component thermal conductivity epoxy adhesive with 2.5W/mK thermal conductivity and 150,000 cPs viscosity. Ideal for automotive starters, LED controllers, and power adapters. Features excellent bond strength, thermal shock resistance, and optimized for stencil printing in high-speed production environments.

Single-component heat-cured epoxy potting compound with 4.5W/mK thermal conductivity for electronic protection. Features excellent adhesion, thermal shock resistance, and compatibility with high-speed production. Ideal for automotive, power electronics, LED assemblies, and medical devices with operating temperatures from -40°C to 180°C.

Two-component silicone potting compound with 2.5W/mK thermal conductivity and UL 94 V-0 fire resistance. Features 45-minute pot life, -40℃ to 160℃ service range, and excellent electrical insulation. Ideal for automotive electronics, transformers, capacitors, and power device protection with multiple packaging options available.

Two-component thermal conductive silicone potting compound with 1.5W/mK thermal conductivity and UL94 V-0 fire resistance. Provides excellent electrical insulation, waterproof protection, and thermal shock resistance for capacitors, transformers, and electronic devices. Features 45-minute pot life and service temperature range from -40℃ to 160℃.

High-performance thermal conductive epoxy adhesive with 1.2W/mK thermal conductivity and UL 94 V-0 fire resistance rating. Features low viscosity, excellent electrical insulation, and wide operating temperature range from -40℃ to 160℃. Ideal for automotive, electronics, and industrial potting applications with multiple packaging options available.

High thermal conductive epoxy potting compound with 2.5W/mK conductivity and UL 94 V-0 fire resistance. Features low temperature curing, 45-minute pot life, and excellent adhesion to metals, plastics, and ceramics. Ideal for capacitors, transformers, automotive starters, and electrical device encapsulation with service temperature range of -40℃ to +130℃.