Thermal Conductive Gel

High-performance thermal conductivity gel with 3.5W/mK efficiency, UL certification, and flexible curing options. Ideal for notebooks, set-top boxes, power systems, and semiconductor cooling. Features 200,000 cps viscosity, -45°C to 200°C temperature range, and 94V0 flame rating for reliable thermal management solutions.

Professional two-component thermal conductive gel with 3.0W/mK thermal conductivity for memory chips and electronic components. Features UL94V0 flame rating, -45 to 200℃ operating range, and easy dispensing for efficient heat transfer in computers, telecommunications, and automotive applications.

High-performance two-component thermal gel with 3.0W/mK conductivity, UL94 V-0 flame rating, and temperature range from -45°C to 200°C. Ideal for computer peripherals, automotive electronics, and telecommunications equipment. Offers easy dispensing, excellent stability, and custom packaging options for automated applications.

High-performance thermal conductive putty with 2.0W/mK thermal conductivity and UL 94V0 flame rating. Features two-component formulation, 550,000 cps viscosity, and wide -45°C to 200°C operating range. Ideal for notebook computers, power supplies, and semiconductor heat dissipation applications.

High-performance thermal conductive putty with 1.5W/mK thermal conductivity for efficient heat management in electronic devices. Features UL recognition, two-part formulation, and custom packaging options. Ideal for tablets, notebooks, and high-speed storage drives requiring reliable thermal solutions.