TIF TM015-07 Thermal Conductive Gel with 1.5W/mK Thermal Conductivity and -45°C to 200°C Operating Range

TIF TM015-07 is a soft silicone putty thermal gap filler formulated with an exclusive blend that delivers superior thermal performance and excellent compressibility. Manufactured using high-viscosity silicone oil, this thermal gel prevents separation of thermal compounds while offering better control over bonding shifting compared to traditional thermal pads.

This thermal gel operates similarly to grease and can be applied using silk screening, screen printing, or automated injection facilities. It is suitable for various electronic components including chip microprocessors, PPGAs, Micro BGA packages, BGA packages, DSP chips, LED lighting, and other high-power electrical components.

• High thermal conductivity: 1.5W/mK
• Soft texture with very low compression force
• Low thermal impedance for efficient heat transfer
• Compatible with automated application systems
• Proven long-term reliability in demanding applications

• CPU cooling solutions
• Display card thermal management
• Motherboard and mainboard applications
• Notebook computer thermal solutions
• Power supply thermal management
• Heat pipe thermal solutions

Standard packaging: 30 cc/pc, 98 pc/box; 300 cc/pc, 6 pc/box

Custom packaging available in syringes for automated dispensing applications. Please contact us for specific packaging requirements.

Ziitek Electronic Material and Technology Ltd. is a research and development company specializing in thermal conductive materials. With multiple production lines and advanced processing technologies, we provide comprehensive thermal solutions for diverse applications across various industries.