Thermal Pad

TIF100-19U is a soft, compressible silicone gap pad with 1.5W/mK thermal conductivity and >5500VAC dielectric strength. Naturally tacky, electrically isolating, and UL 94-V0 rated. Custom thicknesses and die-cut shapes available for LED, power, and memory module applications.

TIF700RES gap filler pads offer 8.5W/mK thermal conductivity, high tack surface, and flexibility for uneven surfaces. Ideal for medical devices, LEDs, and electronics. RoHS compliant, UL V-0 rated, available in custom thicknesses and shapes.

TIF100-20-02S is a soft, compressible silicone thermal pad with 2.0W/mK conductivity. It offers low hardness, natural tack, and electrical isolation. Ideal for automotive ECUs, CPUs, and LEDs. UL 94 V0 rated. Custom thicknesses and die-cut shapes available.

High-performance thermal conductive silicone pad with 8.0W/mK thermal conductivity, available in thicknesses from 0.5mm to 5.0mm. Features natural tackiness, compressible design, and UL94 V-0 certification. Ideal for LED lighting, power systems, semiconductor equipment, and router thermal management applications.

High-performance silicone-based thermal interface pads with 1.0W/mK thermal conductivity and UL V-0 flame rating. These gap fillers reduce thermal resistance between heat sources and sinks, featuring RoHS compliance, electrical isolation, and durability for electronics cooling applications including CPUs, motherboards, and portable devices.

Thermal Conductive Pad Featuring 2W Thermal Conductivity And Ideal For Heat Dissipation In Electronics Products description Ziitek TIF®100-20-11E Series is a well-balanced, general-purpose thermal pad. It offers good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic

Silicone Thermally Conductive Gap Filler Pad Thermally Conductive Silicone Thermal Pad For High Temperature Application Products description The TIF®100-18-11U Series an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with an exceptionally gel-like softness, achieving a low-stress perfect fit. It is suitable for addressing issues in

5.0W/mK Thermal Gap Filler Thermal Pad Suitable For Electronic Devices Requiring Heat Transfer And Insulation Products description TIF®100-50-50S Series is a well-balanced,general-purpose thermal pad.It offers high thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic

Thermal Gap Filler With Effective Heat Sinking In LED Lighting Heat Sinking And Electronic Component Cooling TIF®100-18-02s Series is a well-balanced,general-purpose thermal pad. Ilt offers good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use,making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. Features: > Good

TIF600P series thermal pad offers 6.0 W/mK thermal conductivity, ultra-soft compliance, and self-adhesive design. Ideal for AI servers, CPUs, and power electronics. UL V-0 rated, available in custom thicknesses and shapes.

TIF600G series thermal pad offers 6.0W/mK conductivity, ultra-soft compliance, and excellent insulation. Self-adhesive, electrically isolating, and durable. Ideal for AI servers, CPUs, and power electronics. UL94 V-0 rated. Custom shapes available.

Soft, compressible thermal pad with 2.0W/mK conductivity and low thermal resistance. Electrically isolating, UL94 V-0 rated, and available in custom thicknesses. Ideal for CPU, GPU, and power electronics cooling.

TIF100-10S thermal pad fills air gaps between heat sources and sinks. With 1.5W/mK conductivity, soft compressibility, and UL V-0 rating, it enhances efficiency and lifespan. Available in custom shapes and thicknesses.

TIF600P thermal pad offers 6.0W/mK conductivity, low thermal resistance, and high softness. UL94V0 rated, RoHS compliant, and works from -45°C to 200°C. Ideal for LED, power adapters, and medical devices. Custom thickness and die-cut shapes available.

TIF800 is a 5.0W/m-K soft silicone thermal pad designed for high-performance automotive ECUs. It offers exceptional thermal performance, low assembly stress, and high conformability. UL recognized, RoHS compliant, and available in custom thicknesses and die-cut shapes.

TIF600GP garnet thermal pad offers 6.0W/m-K conductivity, soft compressibility, and natural tack for easy LED TV assembly. UL94 V-0 rated, electrically isolating, and available in custom thicknesses from 0.5mm to 5.0mm. Ideal for heat pipe solutions and power adapters.

TIF100-11S silicone thermal gap pad offers 1.5W/mK thermal conductivity for efficient heat transfer in electronic applications. Features natural tackiness, RoHS compliance, UL recognition, and operates from -40 to 160℃. Available in thicknesses from 0.5mm to 5.0mm with adhesive and reinforcement options.

TIF100-16-38UF silicone thermal gap filler pad offers 1.6W/mK thermal conductivity for efficient heat transfer in electronic applications. Features natural tackiness, RoHS compliance, UL recognition, and available in thicknesses from 0.5mm to 5.0mm. Ideal for CPUs, GPUs, motherboards, automotive electronics, and power supply cooling solutions.

High thermal conductivity 3.0W/mK silicone pad with moderate hardness for excellent surface conformity. Self-adhesive, UL94 V-0 rated, and available in custom shapes. Ideal for AI servers, CPUs, and EV batteries.

Ultra-soft thermal gap pad with 6.5W/mK conductivity, ideal for AI processors and servers. Self-adhesive, electrically isolating, and highly compliant for uneven surfaces. UL94 V-0 rated, custom shapes available.