Thermal Pad

TIF700PU CPU High Thermal Conductivity Die Cut Silicon Thermal Pad For AI Processors AI Servers The TIF®700PU Series is a thermal pad specifically designed to tackle the high level cooling challenges and environments sensitive to extreme mechanical stress. It combines excellent thermal conductivity with a near-fluid ultimate softness, ensuring perfect flling of the contact interface even under ultra-low mounting pressure, completely eliminating air thermal resistance,and

Ultra Soft Thermal GAP PAD Materials 5.0W Thickness 0.25mm To5.0mm Thermal Gap Filler Pad For Car Battery Product descriptions TIF®100-50-11U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness, achieving a perfectly low-stress fit. It is suitable for addressing issues such as large

TIF®100-30-01E UL Certificated Soft Heat Sinking Thermal Conductive Pad 3.0W/MK Silicone Thermal Pad for Mainboard/Mother Board Product descriptions TlF®100-30-01E thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements

TIF100-18-06E High Thermal Conductivity Gap Filler Pad For Automotive Silicon Thermal Pad Product descriptions TlF100-18-06E thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly

TIF100-01F Thermally Conductive Gap Filler Pads black thermal pad for Laptop Product descriptions TlFTM100-01F Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly

TIF100-01ES Self-Adhesive Thermal Gap Pad 6.0W/M·K Silicone Thermal Pad Product descriptions TlFTM100-07S Series use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink. Features > Good thermal conductivity 1.5W/mK > Naturally tacky needing no furtheradhesive

TIF200-15-01F-A1 Customized Self Adhesive Silicone Thermal Pad Product descriptions TlF200-15-01F-A1 Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to themetal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the

TIFTM100-01S CPU Conductive Silicon Thermal Pad Products Custom Product descriptions TlFTM100-01S Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the

TIF®500BS Efficient Silicone Thermal-Pad Mobile Phone Thermal Pad Thermal Gap Filler Product descriptions TIF®500BS Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with an exceptionally gel-like softness, achieving a low-stress perfect fit. It is suitable for addressing issues in high-precision assemblies,such as large

TIF600 Silicone Thermal Conductive Gap Filler Pad Sheet For Heat Sink Cooling Product descriptions TlF600 Series is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling. Features > Good thermal conductivity 4.7W/mK > Naturally tacky needing

TIF200-08-04U UL recognized CPU Display card Thermal Gap Filler Pad Heat Sink Thermal Pad Product descriptions TlFTM200-08-04U is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling. Features > Good thermal conductive 0.8W/mK > Moldability

TIF500-20-01U Thermally Conductive Gap Filler Pads Thermal Pad Product descriptions TlF500-20-01U series thermally conductive interface materials are applied tofill the air gaps between the heating elements and the heat dissipation fins or themetal base.Their flexibility and elasticity make them suited to coat very unevensurfaces. Heat can transmit to the metal housing or dissipation plate from theheating elements or even the entire PCB, which effecitly enhances the

Factory Supply TIF®100-01E Ultra Soft 1.5W Customized Die-Cutting Heatsink Thermal Pad For Laptop Led Cpu Gpu Product descriptions TlF®100-01E thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -45℃~200℃ and meet the requirement of UL94V0. Features > Good thermal conductive 1.5W/mK > Moldability for complex parts > Soft and

3W Low Cost Silicone Gap Filler Thermal Conductive Pad For Unmanned Aerial Vehicle(UAV) Product descriptions TlF®100-30-05S thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -45℃~200℃ and meet the requirement of UL94V0. Features > Good thermal conductive > Moldability for complex parts > Soft and compressible for low stress

Ultra Soft TIF®100-12U silicone Thermal Gap Filler Thermal Pad Thermal Sheet For Unmanned Drone Product descriptions TlF®100-12U thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -45℃~200℃ and meet the requirement of UL94V0. Features > Good thermal conductive > Moldability for complex parts > Soft and compressible for low

Ultra Soft TIF®100-12U silicone Thermal Gap Filler Thermal Pad Thermal Sheet For Unmanned Drone Product descriptions TlF®100-12U thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -45℃~200℃ and meet the requirement of UL94V0. Features > Good thermal conductive > Moldability for complex parts > Soft and compressible for low

TIF®100-05S Heat Transfer Silicone Pad Thermal Pads Gap Filling Materials GPU Desktop Notebook Product descriptions TlF®100-05S series is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling. Features > Good thermal conductivity > Naturally

Manufature Silicone Thermal Pad Thermal Sheet For Mainboard/Mother Board Product descriptions TlF®100-60-16S series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly

TIF®100-40-12S Thermal Pad Thermal Sheet For Heat Sink Colling Product descriptions TlF®100-40-12S series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the

TIF100-01US Factory Termal Pad 1.5w Thermal Conductive Cooling Pad For Led Laptop GPU Cooling Product descriptions TlF®100-01US series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB,