Thermal Pad

Thermal Conductive Pad Designed To Fill Air Gaps And Provide Thermal Interface For Enhanced Heat Dissipation In Electronic Systems Product descriptions TIF®100-30-15E Series is a well-balanced,general-purpose thermal pad. It offers good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range

Good Softness And Fillability Thermally Conductive Gap Filler Pads For EV Battery And Energy Storage Product descriptions TlF®100 6050-19 Series is a well-balanced, general-purpose thermal pad. It offers high thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use,making it capable of effectively transferring heat and providing basic physical protection for awide range of electronic components.It is

Custom Thermal Pad 3.0W/MK Electrically Insulating Thermal Pad For EV Battery Energy Storage And BMS Product descriptions TIF®100-30-15U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness,achieving a perfectly low-stress fit. It is suitable for addressing issues such as large tolerances,

Soft, compressible thermal pad with 1.5W/mK conductivity and high dielectric breakdown voltage >5500 VAC. Naturally tacky, electrically isolating, and RoHS compliant. Ideal for CPUs, power supplies, and automotive electronics. Custom thickness and die-cut shapes available.

TIF100-01F gap filler pads offer 1.5W/mK thermal conductivity, soft compressibility, and high tack for efficient heat transfer. UL 94-V0 rated, customizable thickness from 0.5mm to 5.0mm. Ideal for CPUs, LEDs, and automotive electronics.

TIF100-4010S is a 4.0W/mK thermal conductive silicone pad with high tack, electrical insulation, and vibration dampening. RoHS compliant, UL 94 V0 rated. Custom thicknesses and die-cut shapes available for LED, automotive, and IT applications.

Thermal Gap Filler Offering Excellent 4.0W/MK Thermal Conductivity For Electronic Thermal Management Product descriptions TIF®100-40-10F Series is a structurally supportive thermal pad designed to provide high heat dissipation while also ensuring structural support and durability. It can reliably fill interface gaps, transfer heat, and offer mechanical support for stacked components, resisting compressive deformation. This product is an ideal choice for applications that

3.0W/MK Thermal Gap Filler Material Providing Excellent Elasticity For Thermal Management In Electronic Assemblies Product descriptions TIF®100-30-15S Series is a well-balanced, general-purpose thermal pad. It offers high thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic

Thermal Conductive Pad Offering 5.0W/MK Heat Dissipation Performance Across Wide Temperature Range And Multiple Thickness Options Product descriptions TIF®100 5030-05 Series is a well-balanced, general-purpose thermal pad offering high thermal conductivity and moderate hardness. This balanced design provides excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of

3.0W/MK Thermal Gap Filler Pads With Thermal Conductivity And Low Volatile For Precision Devices Product descriptions The TIF®100L 3040-06 Series is an ultra-low silicon oxygen volatilization thermal pad designed specifically for the thermal management needs of optical and high-precision electronic devices.Balances efficient thermal conductivity and extremely low precipitation of condensable volatile substances, effectively avoiding pollution to sensitive optical components

Thermal Gap Filler With Soft Elastic Silicone Material For Filling Uneven Gaps Between Heating Elements And Heat Sinks Products description Ziitek TIF®100-20-16E Series is a well-balanced, general-purpose thermal pad. It offers good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of

Thermally Conductive Silicone Thermal Pad Suitable For Heat Sink Applications And Electronic Device Protection The TIF®100-15-11F Series is a structurally supportive thermal pad designed to provide good heat dissipation while also ensuring structural support and durability. It can reliably fill interface gaps, transfer heat,and offer mechanical support for stacked components, resisting compressive deformation. This product is an ideal choice for applications that require a

10W/MK Thermal Conductivity Excellent Electrical Insulation Thermally Conductive Gap Filler Pads For Memory Modules Product descriptions TIF®100 10020-11 Series is an ultra-soft thermal interface material specifically designed to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-like softness, achieving a low-stress perfect fit. It effectively addresses issues in high-precision

TIF100-20-18S thermal gap filler pad offers 2.0W/mK conductivity, UL V-0 rating, and soft compressibility for low-stress assembly. Ideal for LEDs, CPUs, and automotive electronics. Custom thicknesses from 0.5mm to 5.0mm available.

TIF100-19S silicone pad fills air gaps between heating elements and heatsinks. Features 1.5W/mK thermal conductivity, UL recognized, RoHS compliant, and soft compressibility for uneven surfaces. Custom thicknesses from 0.5mm to 5.0mm available. Ideal for CPUs, LEDs, and automotive electronics.

Soft, compressible 1.5W/mK thermal pad with 0.5mm thickness for efficient heat transfer. UL 94-V0 rated, electrically isolating, and customizable in size and shape. Ideal for CPUs, LEDs, and power supplies.

Soft, compressible thermal pad with 1.5W/mK conductivity fills air gaps for efficient heat transfer. Naturally tacky, UL recognized, RoHS compliant. Custom thicknesses and die-cut shapes available for OEM applications.

TIF100-02F is a soft, compressible thermal gap filler with 1.5W/mK conductivity. Naturally tacky, it reduces thermal resistance between heat sources and sinks. UL recognized and RoHS compliant, it offers custom thicknesses and die-cut shapes for electronics, notebooks, and power supplies.

High-performance thermal pad with 3.0W/mK conductivity, soft and compressible for low-stress applications. Naturally tacky, no adhesive needed. UL94 V-0 rated, custom thicknesses and die-cut shapes available. Ideal for mass storage, CPUs, and power supplies.

TIF100-05S is a soft, compressible silicone thermal pad with 1.5W/mK conductivity and electrical isolation. Naturally tacky, UL 94 V0 rated, and available in custom thicknesses and die-cut shapes for GPUs, notebooks, and power supplies.