Thermal Pad

TIF®100-30-06US 1.5mm To 5.0mm Thick 3.0W Ultra Soft Silicone Pad For CPU GPU Semiconductor Heat Dissipation Thermal Pad Product descriptions Ziitek TlF®100-30-06US is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling. Features > Good

Free Sample Heat Transfer Thermal Silicone Pad For High Speed Mass Storage Drives Product descriptions TIF®800Q series of thermal interface materials is specifically designed to fill air gaps between heat-generating components and heat sinks or metal baseplates. It offers excellent compliance, alowing it to conform fightly to heat sources with varying shapes and height dferences. Even in confined or iregular spaces,it maintains stable thermal conductivity, enabling efficient

TIF®800HS Thermal Conductivity Self-Adhesive Silicone Thermal Pads For High Temperature Applications Product descriptions TIF®800HS Seriesis a high-end compressible thermal pad designed to meet top-level cooling requirements while maintaining excellnt assembly workmanship. Through an innovative material formulation, it successfully achieves an ideal combination of ultra-high thermal conductivity and moderate hardness. This unique performance balance allows it to efficientlyha

High Thermal Conductive 5.0W Silicone Thermal Sheet Thermal Pad For Automotive Efficient Heat Dissipation Product descriptions TIF®800Q Seriesis a high-end compressible thermal pad designed to meet top-level cooling requirements while_maintaining excellent assembly workmanship. Through an innovative material formulation,it successfully achieves an ideal combination of ultra- high thermal conductivity and moderate hardness. This unique performance balance allows it to

AI Processors AI Servers Thermal Pad With Thermal Conductivity Of 16.0W/MK For Electronics Cooling And Heat Dissipation Product descriptions The TIF®800TS Series is a high-end compressible thermal pad that meets top-level cooling requirements while also ensuring excellent assembly workability. Through an innovative material formulation, it successfully achieves an ideal combination of ultra-high thermal conductivity and moderate hardness. This unique performance balance

Thermal Conductive Pad Soft Compressible Silicone Thermal Interface Material For Heat Transfer The TIF®100-15-01F Series is a structurally supportive thermal pad designed to provide good heat dissipation while also ensuring structural support and durability. It can reliably fillinterfacegaps,transfer heat,and offer mechanical support for stacked components, resisting compressive deformation. This product is an ideal choice for applications that require a balance between heat

2.0W/mK Heatsink Thermal Pads GPU CPU Heatsink Cooling Conductive Silicone Thermal Pad Accessories Supplies Product descriptions The TIF®100-20-10E Series use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink. Features > Good thermal conductive 2.0W/mK >

Good flexibility and fillability Silicone-Based Thermally Gap Pad Filler For AI Processors AI Servers TIF®100-50-50E Series is a well-balanced, general-purpose thermal pad. It offers excellent thermal conductivity and moderate hardness. This balanced design provides both good surface conformity and excellent ease of use,making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. It is an ideal choice

High Compliance 1.5W Thermally Conductive Gap Filler Pads For AI Processors AI Servers Heat Dissipation Product descriptions The TIF®100-15-14S Series is a well-balanced, general-purpose thermal pad.It offers good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components

TIF100 10055-50 Silicone Thermal Pad Blue Wholesale Silicone Rubber Thermal Insulation Pad Thermal Silicone Pad With Adhesive For 5G Base Stations The TIF®100 10055-50 Series a well-balanced,general-purpose thermal pad. It offers excellent thermal conductivity and moderate hardness. This balanced design provides both good surface conformity and excellent ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of

TIF®100 6045-50 Silicone Thermal Conductive Pad Fiberglass Reinforce Thermal Insulation Sheet For Computer CPU/GPU Cooling Product descriptions TIF®100 6045-50 is a well-balanced, general-purpose thermal conductive pad. It offers excellent thermal conductivity and moderate hardness. This balanced design ensures both superior surface conformability and exceptional ease of handling, providing effective thermal transfer paths and fundamental physicalprotection for a wide range

1.5W/MK Thermal Conductivity TIF®100-05E Silicone Thermal Adhesive Pads For GPU Cooling Product descriptions TlF®100-05E thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -45℃~200℃ and meet the requirement of UL94V0. Features > Good thermal conductive > Moldability for complex parts > Soft and compressible for low stress

Silicone Thermal Pad High Thermal Conductivity Gap Filler With Ultra Soft For Consumer Electronics Products description The TIF®200-02US Series is a compound thermal interface material that combines good thermal conductivity, reliable electrical insulation,and soft characteristics. This product not only provides excellent thermal conductivity but also ensures superior breakdown voltage strength, effectively preventing circuit short circuits. Its soft characteristic allows it

Consumer Electronics Thermally Conductive 2.0W/MK Thermal Gap Pads Product descriptions The TIF®200-20-18U Series is a compound thermal interface material that combines good thermal conductivity,reliable electrical insulation, and extremely soft characteristics. This product not only provides excellent thermal conductivity but also ensures superior breakdown voltage strength,effectively preventing circuit short circuits. Its soft characteristic allows it to fully fill uneven

TIF®200-10-02ES Pink 1.0W/M.K Cooling Gap Filler Insulation Silicone Thermal Pad For Semiconductor Heat Dissipation Product descriptions The TIF®200-10-02ES Series is a compound thermal interface material that combines good thermal conductivity,reliable electrical insulation, and extremely soft characteristics. This product not only provides excellent thermal conductivity but also ensures superior breakdown voltage strength,effectively preventing circuit short circuits. Its

TIF100-15-50S High Dielectric Strength Silicone-Based Gap Pad Filler For Consumer Electronics Cooling Product descriptions The TIF®100-15-50S Series is a well-balanced, general-purpose thermal pad. It offers good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components.

TIF200-02U Signal Communication Thermal Pad 1.5W 0.5mm~5.0mm Thickness Thermal Gap Filler Pad For New Energy Vehicle Product descriptions Ziitek TlF®200-02U Series is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. Ziitek TlF®200-02U is an electrically isolating material, which allows its use in applications

High-Strength High-Temperature Resistant Thermal Silicon Insulator Pad For Battery Product descriptions TlF®100-40-05S Series is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of

TIF®200-20-14E OEM Customized Size Thermal Conductive Pad Thermal Conductive Silicon Pad Product descriptions TlF®200-20-14E Series thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -45℃~200℃ and meet the requirement of UL94V0. Features > Good thermal conductive 2.0W/mK > Moldability for complex parts > Soft and compressible

Silicone Self Adhesive Customizable 1.5W/Mk High-Temperature Silicone Flexible Thermal Pads For LED Lighting Heat Application Product descriptions TlF®100-30-25S thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or