Thermal Pad

Thermal Conductive Silicone Pad Aluminum Battery 5G Phone Thermal Interface Material Thermal Conductive Gap Filler Product descriptions TIF®500-65-11US series is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling. Features > Good thermal

High Thermal Conductivity Resistant Flame-Retardant Insulation 7.5W/MK Silicone Thermal Pad Product descriptions TlF®500-75-11U Series is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling. Features > Good thermal conductive 7.5W/mK >

Good Thermal Conductive Silicone Thermal Pad For Laptop Heatsink CPU GPU SSD IC LED Cooler Product descriptions TIF®700PES Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which

Consumer Electronics Thermally Conductive 2.0W/MK Thermal Gap Pads Product descriptions The TIF®200-20-18U Series is a compound thermal interface material that combines good thermal conductivity,reliable electrical insulation, and extremely soft characteristics. This product not only provides excellent thermal conductivity but also ensures superior breakdown voltage strength,effectively preventing circuit short circuits. Its soft characteristic allows it to fully fill uneven

TIF®200-10-02ES Pink 1.0W/M.K Cooling Gap Filler Insulation Silicone Thermal Pad For Semiconductor Heat Dissipation Product descriptions The TIF®200-10-02ES Series is a compound thermal interface material that combines good thermal conductivity,reliable electrical insulation, and extremely soft characteristics. This product not only provides excellent thermal conductivity but also ensures superior breakdown voltage strength,effectively preventing circuit short circuits. Its

TIF®100-85-11US Silicone Based Thermal Interface Material 8.5W Soft Thermal Pad For Electric Vehicle Product descriptions The TIF®100-85-11US Series​ is a thermal pad designed specifically for environments sensitive to extreme mechanical stress. It combines excellent thermal conductivity with an almost fluid-like extreme softness, ensuring perfect contact interface fillng even under ultra-low mounting pressure,completely eliminating air thermal resistance,and providing

TIF100-60-62US High Compressibility Soft 6.0W Thermally Conductive Gap Filler Pads For Medical Equipment Product descriptions The TIF®100-60-62US Series​ is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress.This product combines high thermal conductivity with exceptional gel-level softness, achieving a perfectly low stress fit. lt is suitable for addressing issues such as large

TIF®100-30-06US 1.5mm To 5.0mm Thick 3.0W Ultra Soft Silicone Pad For CPU GPU Semiconductor Heat Dissipation Thermal Pad Product descriptions Ziitek TlF®100-30-06US is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling. Features > Good

TIF100-30-11U Highly Efficient Thermal Conductivity 3.0W/MK Silicone Thermal Pads For Laptop Heat Insulation Materials Product descriptions TlF®100-30-11U thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even

6.5W High Quality TIF®500-65-11U Factory Wholesale Customized Thermal Pad For LED CPU GPU MOS Product descriptions The TIF®500-65-11U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness, achieving a perfectly low-stress fit. It is suitable for addressing issues such as large tolerances,

Silicone-Based Thermal Gap Pad Thermal Management Thermal GAP PAD Materials For Network Communication Products Product descriptions TIF®500-65-11ES Series is a thermal pad specifically designed to tackle the high level cooling challenges and environments sensitive to extreme mechanical stress. It combines higt thermal conductivity with a near-fluid ultimate softness, ensuring perfect filling of the contact interface even under ultra-low mounting pressure, completely

TIF100-10S Thermal Pad Silicone Thermal Insulator Gap Filling Pad Effect Heat Dissipation Conductive Pad Product descriptions TlF®100-10S thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB,

TIF100-15-50S High Dielectric Strength Silicone-Based Gap Pad Filler For Consumer Electronics Cooling Product descriptions The TIF®100-15-50S Series is a well-balanced, general-purpose thermal pad. It offers good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components.

TIF100-15-11S UL94 V-0 Compliant 1.5W/MK Thermal Management Silicone Pads With Good Insulation Performance Product descriptions The TIF®100-15-11S Series is a well-balanced, general-purpose thermal pad. It offers good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic

TIF100-30-05US Thermal Management Materials Premium Soft Thermally Conductive Gap Filler Pads For LED Flesible Strip LED Bar Ziitek TIF®100-30-05US thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -40℃~200℃ and meet the requirement of UL94V0. Features: > Good thermal conductive: 3.0W/mK > Moldability for complex parts > Soft

TIF100-30-02US High Conductive Insulation Thermal Silicone Pad Cooling Gap Filler For Semiconductor Ziitek TIF®100-30-02US thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -40℃~200℃ and meet the requirement of UL94V0. Features: > Good thermal conductive: 3.0W/mK > Moldability for complex parts > Soft and compressible for low

TIF®100-30-05U Thermal Pad 3.0W/Mk 0.25mm-5.0mm Thickness Thermal Silicone Conductive Pads For Automotive Engine Control Units Product descriptions TlF®100-30-05U thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements

High Temperature Resistant Heatsink Cooling Gap Filler Pad Thermal Conductive Silicone Pad For Cpu Gpu Ram The TIF®100-30-05E thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which

TIF®100-20-11S Electric Insulation Thermal Pad Thermally Conductive Silicon Protective Cushioning Material Product descriptions TlF®100-20-11S thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire

TIF®100-18-11US High Performance 1.8W Thermal Conductive Pad Sheet Thermal Gap Filler For Telecommunication Equipment Product descriptions TlF®100-18-11US Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or