Thermal Pad

Thermal Conductive Pad Offering 5.0W/MK Heat Dissipation Performance Across Wide Temperature Range And Multiple Thickness Options Product descriptions TIF®100 5030-05 Series is a well-balanced, general-purpose thermal pad offering high thermal conductivity and moderate hardness. This balanced design provides excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of

3.0W/MK Thermal Gap Filler Pads With Thermal Conductivity And Low Volatile For Precision Devices Product descriptions The TIF®100L 3040-06 Series is an ultra-low silicon oxygen volatilization thermal pad designed specifically for the thermal management needs of optical and high-precision electronic devices.Balances efficient thermal conductivity and extremely low precipitation of condensable volatile substances, effectively avoiding pollution to sensitive optical components

Thermal Gap Filler With Soft Elastic Silicone Material For Filling Uneven Gaps Between Heating Elements And Heat Sinks Products description Ziitek TIF®100-20-16E Series is a well-balanced, general-purpose thermal pad. It offers good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of

Thermally Conductive Silicone Thermal Pad Suitable For Heat Sink Applications And Electronic Device Protection The TIF®100-15-11F Series is a structurally supportive thermal pad designed to provide good heat dissipation while also ensuring structural support and durability. It can reliably fill interface gaps, transfer heat,and offer mechanical support for stacked components, resisting compressive deformation. This product is an ideal choice for applications that require a

10W/MK Thermal Conductivity Excellent Electrical Insulation Thermally Conductive Gap Filler Pads For Memory Modules Product descriptions TIF®100 10020-11 Series is an ultra-soft thermal interface material specifically designed to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-like softness, achieving a low-stress perfect fit. It effectively addresses issues in high-precision

High-performance 8.5W/mK thermal pad fills air gaps between heat sources and sinks. Naturally tacky, flexible, and UL94 V-0 rated. Custom thicknesses from 0.4 to 5mm. Ideal for automotive, telecom, and electronics cooling.

TIF100-20-18S thermal gap filler pad offers 2.0W/mK conductivity, UL V-0 rating, and soft compressibility for low-stress assembly. Ideal for LEDs, CPUs, and automotive electronics. Custom thicknesses from 0.5mm to 5.0mm available.

TIF100-19S silicone pad fills air gaps between heating elements and heatsinks. Features 1.5W/mK thermal conductivity, UL recognized, RoHS compliant, and soft compressibility for uneven surfaces. Custom thicknesses from 0.5mm to 5.0mm available. Ideal for CPUs, LEDs, and automotive electronics.

Soft, compressible 1.5W/mK thermal pad with 0.5mm thickness for efficient heat transfer. UL 94-V0 rated, electrically isolating, and customizable in size and shape. Ideal for CPUs, LEDs, and power supplies.

Soft, compressible thermal pad with 1.5W/mK conductivity fills air gaps for efficient heat transfer. Naturally tacky, UL recognized, RoHS compliant. Custom thicknesses and die-cut shapes available for OEM applications.

TIF100-02F is a soft, compressible thermal gap filler with 1.5W/mK conductivity. Naturally tacky, it reduces thermal resistance between heat sources and sinks. UL recognized and RoHS compliant, it offers custom thicknesses and die-cut shapes for electronics, notebooks, and power supplies.

High-performance thermal pad with 3.0W/mK conductivity, soft and compressible for low-stress applications. Naturally tacky, no adhesive needed. UL94 V-0 rated, custom thicknesses and die-cut shapes available. Ideal for mass storage, CPUs, and power supplies.

TIF100-05S is a soft, compressible silicone thermal pad with 1.5W/mK conductivity and electrical isolation. Naturally tacky, UL 94 V0 rated, and available in custom thicknesses and die-cut shapes for GPUs, notebooks, and power supplies.

Thermally Silicone Thermal Pad 1.5W/MK Designed For Enhanced Heat Transfer In Electronics And Home Appliance Applications Product descriptions TIF®100-15-01E Series is a well-balanced, general-purpose thermal pad. It offers good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use,making it capable of effectively transferring heat and providing basic physical protection for a wide range of

5.0W/MK Thermal Conductive Pad Suitable For Heat Transfer In Power Electronics LED Modules And Other Thermal Sensitive Components Product descriptions TIF®100 5027-11 Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness, achieving a perfectly low-stress fit. It is suitable for addressing

Thermal Gap Filler With Low Volatility Silicone And Ceramic Fillers To Optimize Heat Transfer Between Electronic Components And Heatsink Product descriptions The TIF®100L 3030-06 Series is an ultra-low silicon oxygen volatilization thermal pad designed specifically for the thermal management needs of optical and high-precision electronic devices.Balances efficient thermal conductivity and extremely low precipitation of condensable volatile substances, effectively avoiding

Thermal Conductive Pad Soft Compressible Silicone Material With Naturally Tacky Surface For Low Stress Electronic Cooling Product descriptions TlF®100-20-05E Series is a well-balanced, general-purpose thermal pad. It offers good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of

Soft, compressible thermal gap pad with 2.0W/mK conductivity and natural tack. Electrically isolating, UL94 V-0 rated. Ideal for automotive electronics, CPUs, and power supplies. Custom thickness and die-cut options available.

TIF100-20-05U thermal pad fills air gaps between heat sources and sinks. Features 2.0W/mK conductivity, soft compressibility, natural tack, and electrical isolation. UL94 V-0 rated. Available in 0.5mm to 5.0mm thicknesses and custom shapes.

TIF100-10F is a soft silicone thermal pad with 1.5W/mK conductivity, low hardness, and electrical isolation. Ideal for CPUs, power supplies, and automotive electronics. UL 94 V0 rated, customizable thickness, and easy to handle.