Thermal Pad

TIF100-30-23S High-Performance Silicone Gap Pads Ultra Soft Thermal Pad For Electronic Components 5G,Aerospace, AI Product descriptions TIF®100-30-23S Series is a well-balanced, general-purpose thermal pad.It offers good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic

TIF100-32-05U Ultra Soft Thermal Silicone Pad 3.2W High Conductivity Gap Filler For AI Servers, GPU Cooling, Inverter The TIF®100-32-05U Series is an ultra soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with extreme gel grade flexibility to achieve a perfect fit with low stress.It is suitable for solving problems such as large tolerances

TIF100-30-05US Thermal Management Materials Premium Soft Thermally Conductive Gap Filler Pads For LED Flesible Strip LED Bar Ziitek TIF®100-30-05US thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -40℃~200℃ and meet the requirement of UL94V0. Features: > Good thermal conductive: 3.0W/mK > Moldability for complex parts > Soft

TIF100-40-05U High Quality High Conductive Thermal Silicone Pad Cooling Gap Filler For CPU Premium Insulation Element Ziitek TIF®100-40-05U is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling. Features: > Good thermal conductive: 4.0W/mK

TIF®100-30-05U Thermal Pad 3.0W/Mk 0.25mm-5.0mm Thickness Thermal Silicone Conductive Pads For Automotive Engine Control Units Product descriptions TlF®100-30-05U thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements

High Temperature Resistant Heatsink Cooling Gap Filler Pad Thermal Conductive Silicone Pad For Cpu Gpu Ram The TIF®100-30-05E thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which

TIF700RES High Temperature 8.5W Custom Silicone Gap Filler Electric Thermal Pads for Gpu Cpu Led Product descriptions TIF®700RES Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB,

TIF500S Free Sample Heat Transfer Thermal Silicone Pad For LED CPU GPU MOS Laptop Product descriptions TIFTM500S series use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink. Features > Good thermal conductive > Moldability for complex parts > Soft and compressib

TIF100-20-12S LTD Thermal Pad Thermal Conductive Pad Customized Silicon Thermal Insulation Sheet Thermal Pads For CPU Product descriptions TlFTM100-20-12S use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink. Features > Good thermal conductive 2.0W/mK >

TIF100-05UF Thermal Pad 1.5W The Thermal Conductivity For CPU Thermal Silicone Pads Thermal Pads Product descriptions TlFTM100-05UF thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which

1.5W/M.K Blue Color TIF100-05U Thermal Pad Silicone Heating Pad For CPU GPU Product descriptions TlF®100-05U Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances

Thermal Conductive Sheet Soft Silicone Thermal Pad Thermal Insulator Silicone Pad Thermal Pad Silicon Product descriptions TlFTM100-05ES Series thermally conductive interface materials are gap fillers reinforced one side with kepton; the other side with adhesive. They are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and viscoelastic feature make them ideal to coat very uneven surfaces. Its smooth,

TIF500-30-05U Lithium-Ion Battery Pack Thermal Pads Thermal Interface Materials Product descriptions TlFTM500-30-05U series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly

TIF®100L-2040-06 Ultra-low volatile D3-D20 siloxane Computer CPU GPU Thermal Gap Filler Pad The TIF®100L-2040-06 Series thermally conductive interface materials are applied to fil the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly

TIF®100L-2020-06 Low Volatility Silicone Based Thermal Gap Filler Pad For Graphics Card Thermal Module The TIF®100L-2020-06 Series thermally conductive interface materials are applied to fil the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which

TIF®100-60-01U Ultra-Soft Thermally Conductive Sheet For Electronic Products Energy Storage Industrial Product descriptions The TIF®100-60-01U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress.This product combines high thermal conductivity with exceptional gel-level softness, achieving a perfectly low-stress fit. It is suitable for addressing issues such as large

TIF500-30-11E 3.0W Silicone Thermal Gap Pad For Network Communication Products Product descriptions TIF®500-30-11U Series is a well-balanced, general-purpose thermal pad. It offers good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. It is an ideal choice for

TIF100 3030-06 Thermal Conductivity Of 3.0W/Mk Ultra Soft Thermal Pad For 5G Aerospace AI AIoT And Automotive Product descriptions The TIF®100 3030-06 Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with an exceptionally gel-like softness,achieving a low-stress perfect fit. It is suitable for addressing issues in high

TIF100-15-11S-D Low Density Thermal Pad For High Speed Networks And AI Servers Product descriptions TIS®100-15-11S-D Series is an innovative low-density thermal pad that offers good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and outstanding ease of use, delivering effective heat transfer and basicphysical protection for a wide range of electronic components while achieving lightweight performance. Features: >

TIS®300-45 Thermally Conductive And Electrically Conductive Silicone Thermal Pad For Improvement Of Wifi Signal Product descriptions TIS®300-45 Series is a nickel/graphite-filled conductive and thermally conductive silicone sheet, specially developed for thermal management and electromagnetic interference suppression of 3C electronic products, high-frequency signal devices, and precision electromagnetic components. It features excellent thermal conductivity and surface