Laminating Film Roll
3in1 Laminating Release Film Roll 25-500μm for RF-PCB Lamination with Temperature Resistance
Professional 3in1 release film designed for rigid and flexible PCB lamination processes. Features superior temperature resistance, accommodates board height variations, and maintains dimensional stability. Available in thicknesses from 25μm to 500μm with matte or glossy surface finishes for various manufacturing requirements.
25μm-100μm Silicon Free Release Film Roll for FPC Lamination with Matte Finish and 10-35gf/inch Release Force
Specialized silicon-free release film for FPC manufacturing, available in 25μm-100μm thicknesses with matte finish. Features no oil transfer, excellent dimensional stability, and superior adhesive resistance. Ideal for large surface FPC laminating, reinforcing steel sheets, and electronic component pressing with environmental benefits.
36-100μm PET Substrate Release Film for Rigid PCB Lamination - ESRF2 Series with High Temperature Resistance
ESRF2 PET substrate release film offers 25-100μm thickness options for rigid PCB lamination. Features double matte surfaces, low static electricity, minimal silicone oil transfer, and superior high-temperature performance. Ideal for PCB blind hole boards, slotted boards, and back panel manufacturing with reliable isolation and separation capabilities.
25μm-100μm Matte Glossy Release Film for FPC Lamination with 10-35gf/inch Release Force
Specialized release film for flexible printed circuit board lamination featuring 25μm-100μm thickness range and matte glossy surfaces. Provides reliable isolation, minimal static electricity, and low silicone oil transfer for contamination-free FPC manufacturing processes. Ideal for EML and FR4 compression applications.
60μm-115μm Double-Layer High-Temperature Protective Lamination Film for FPC Manufacturing Processes
Industrial-grade double-layer laminating film rolls in 60μm and 115μm thicknesses. Features high temperature resistance, acid/alkali protection, and easy adhesion/separation. Ideal for FPC manufacturing, RTR processes, wet process protection, and panel transportation. Three-layer structure with PET substrate ensures reliable performance in demanding electronic manufacturing environments.
ESBF-60 60um Double-Layer High Temperature Bearing Film for FPC Protection and Lamination Processes
60um thickness double-layer functional film providing high temperature resistance and acid/alkali protection for FPC manufacturing. Features easy application without bubbles, clean removal with no residue, and compatibility with pressing and electroplating processes. Ideal for roll-to-roll production and industrial lamination applications.
ESRF-3in1 25-500μm 3-Layer Release Film for Rigid-Flexible PCB and RF-PCB Lamination
Professional 3-in-1 release film designed for rigid-flexible PCB and RF-PCB lamination processes. Features 25-500μm thickness range, 3-layer construction, and matte/glossy surface options. Provides superior temperature resistance, dimensional stability, and compatibility with various core layers for reliable circuit board manufacturing.