China TIC™808P Pink Thermal Phase Change Interface Material 0.95 W/mK 0.008

TIC™808P Pink Thermal Phase Change Interface Material 0.95 W/mK 0.008" Thickness for Notebook PCs

Price Negotiable

Price: negotiation

MOQ: 1000PCS

Delivery Time: 3-5days

Brand: Ziitek

Product Description

TIC™808P Series Thermal Phase Change Interface Material

Product Overview

The TIC™808P Series is a low melting point thermal interface material designed for notebook and desktop computer applications. This pink thermal material begins softening at 50℃, flowing to fill microscopic surface irregularities and reducing thermal resistance between components.

Key Features

0.024℃-in²/W thermal resistance for efficient heat transfer
0.95 W/mK thermal conductivity rating
Naturally tacky at room temperature - no adhesive required
No heat sink preheating required for installation
Flexible solid at room temperature with no reinforcing components
Proven reliability: no thermal performance degradation after 1,000 hours at 130℃ or 500 thermal cycles from -25℃ to 125℃

Technical Specifications

Property	Value	Testing Standards
Product Name	TIC™808P
Color	Pink	Visual
Composite Thickness	0.008" (0.203mm)
Thickness Tolerance	±0.0008" (±0.019mm)
Density	2.2g/cc	Helium Pycnometer
Operating Temperature	-25℃ to 125℃
Phase Transition Temperature	50℃ to 60℃
Thermal Conductivity	0.95 W/mK	ASTM D5470 (modified)
Thermal Impedance @ 50 psi	0.053℃-in²/W (0.34℃-cm²/W)	ASTM D5470 (modified)

Available Thickness Options

0.003" (0.076mm) 0.005" (0.127mm) 0.008" (0.203mm) 0.010" (0.254mm)

Consult the factory for alternate thickness requirements.

Standard Sizes

9" x 18" (228mm x 457mm)
9" x 400' (228mm x 121M)

Application Areas

High Frequency Microprocessors
Notebook and Desktop PCs
Computer Servers
Memory Modules
Cache Chips
IGBTs

Packaging & Customization

TIC™800 series products are supplied with white release paper and bottom liner. Available in kiss cut, extended pull tab liner, or individual die cut shapes to meet specific application requirements.