Dongguan Ziitek Electronic Materials & Technology Ltd.
                                                                                                           
Verified Supplier
20 Years
Since 2006
Menu

TIF112FG-20-10S Ultra Thin Adhesive Thermal Gap Filler 2.0 W/mK for LED TV and Telecom Hardware

Price Negotiable
Price: negotiation
MOQ: 1000pcs
Delivery Time: 3-5work days
Brand: ZIITEK
Product Description
Product Overview

The TIF112FG-20-10S is an ultra-thin adhesive thermal gap filler designed for efficient heat dissipation in electronic applications. This ceramic-filled silicone rubber material features 2.0 W/mK thermal conductivity and natural tackiness for easy application.

Key Features
  • High thermal conductivity: 2.0 W/mK
  • Naturally tacky surface requires no additional adhesive
  • Soft and compressible design for low-stress applications
  • Available in multiple thickness options from 0.25mm to 5.08mm
  • UL 94 V-0 fire rating for safety compliance
  • Excellent dielectric strength: >10,000 VAC
Technical Specifications
Property Value Test Method
Thermal Conductivity 2.0 W/mK ASTM D5470
Color Gray Visual
Specific Gravity 2.75 g/cc ASTM D297
Hardness 45 Shore 00 ASTM 2240
Tensile Strength 45 psi ASTM D412
Operating Temperature -50°C to 200°C -
Dielectric Breakdown Voltage >10,000 VAC ASTM D149
Fire Rating 94 V-0 UL equivalent
Available Thickness Options

Standard thicknesses range from 0.010" (0.25mm) to 0.200" (5.08mm) in 0.010" increments. Custom thicknesses available upon request.

Standard Sheet Sizes
  • 8" x 16" (203mm x 406mm)
  • 16" x 18" (406mm x 457mm)
Adhesive Options
  • Single-sided adhesive: Add "A1" suffix
  • Double-sided adhesive: Add "A2" suffix
Applications
  • LCD/LED TV backlight units and LED lighting systems
  • Telecommunication hardware and network equipment
  • Automotive engine control units and electronics
  • High-speed mass storage drives and RDRAM memory modules
  • Portable electronics and handheld devices
  • Semiconductor automated test equipment (ATE)
  • Micro heat pipe thermal solutions
Product Image
Ultra thin adhesive thermal gap filler material for electronic cooling applications
Quality Assurance

Our commitment to quality includes comprehensive quality control processes, competitive product advantages, confidentiality agreements, free sample offerings, and quality assurance contracts to ensure customer satisfaction.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Dongguan Ziitek Electronic Materials & Technology Ltd.
Location No.12 Xiju Road, Hengli Township, 523465 Dongguan City
Contact Person Dana Dai

Request A Quote

Please check your email address.
Your message must be at least 20 characters.