TIF TM900-15S Thermal Conductive Absorption Material - 1.5W/mK, 0.5-5.0mm Thickness for 5G & Industrial Electronics
TIF TM900-15S Series is a composite material manufactured using high polymer silicon glue as the substrate, enhanced with ceramic powder, soft magnetic particles, and specialized auxiliary agents. This formulation delivers exceptional low interface thermal resistance and electromagnetic absorbing performance under minimal pressure, effectively filling gaps to facilitate heat transfer and electromagnetic noise absorption between heating components and heat dissipation systems. The material also provides insulation, shock absorption, and sealing capabilities, supporting equipment miniaturization and ultra-thin design requirements.
| Property | Value | Test Method |
|---|---|---|
| Color | Dark Gray | Visual |
| Construction | Ferrite filled silicone rubber | - |
| Thickness Range | 0.02" (0.5mm) - 0.2" (5.0mm) | ASTM D374 |
| Hardness (Shore 00) | 45±5 | ASTM 2240 |
| Density | 3.5 g/cm³ | ASTM D792 |
| Operating Temperature | -40°C to 160°C | - |
| Frequency Range | 100MHz - 10GHz | PNA-X N5247A |
| Permeability | 4.1 GHz | ASTM D2520 |
| Volume Resistivity | ≥1.0×10¹² Ohm-cm | ASTM D257 |
| Thermal Conductivity | 1.5 W/mK | ASTM D5470 / ISO22007-2 |
- Soft, lightweight construction with excellent flexibility and easy processing capabilities
- Simple installation in confined spaces with straightforward cutting and handling
- Insulating properties requiring bonding or pressing to metal base plates for optimal absorbing performance
- Customizable dimensions and shapes to meet specific application requirements
- Flame retardant and high temperature resistant with halogen-free, lead-free composition
- Compliant with RoHS environmental standards
- Significantly reduces free space reflection of electromagnetic waves on metal surfaces
- Effectively suppresses cavity resonance in conductive enclosures to maintain circuit stability
- Absorbs surface traveling waves along transmission lines and conductor surfaces
- Business Communications: Antennas, base stations, optical modules, routers, switches
- Millimeter Wave Applications: 5G communications, millimeter wave radar systems
- Industrial Electronics: Automotive electronics, drones, industrial control systems
- Instrument Measurement: Amplifiers, filters, test and measurement equipment
- Security and Defense: Radar systems, aerospace applications, defense electronics
Standard sheet size: 8" x 16" (203mm x 406mm)
Available thickness: 0.020-inch to 0.200-inch (0.5mm to 5.0mm)
Custom die-cut shapes and specialized thickness options available upon request
Ziitek Company specializes in manufacturing thermal management solutions including thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive interface pads, thermal grease, thermal conductive plastics, silicone rubber, silicone foams, and phase changing materials. Our facility features advanced testing equipment and strong technical capabilities to ensure product quality and performance.
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