Thermal Conductive Pad

Ultra-soft ceramic-filled silicone thermal pad with 1.5W/mK conductivity. Low assembly stress, high conformability. UL recognized, RoHS compliant. Custom thicknesses from 0.5mm to 5mm. Ideal for CPU, GPU, and power electronics.

TIF120-02F series ultra soft thermal gap pad with 1.5 W/mK conductivity, 60 Shore 00 hardness, and >5500 VAC dielectric strength. Naturally tacky, RoHS compliant, available in 0.254–5.080 mm thickness. Ideal for CPUs, power supplies, and automotive electronics.

TIF 140-20-18 series thermal gap filler pad with 2.0W/mK conductivity, 45 Shore 00 hardness, and 0.5-5.0mm thickness. Naturally tacky, soft, compressible, and RoHS compliant. Ideal for IGBTs, LED power supplies, and automotive electronics. Custom die-cut and adhesive options available.

High-performance thermal pad with 3.0W/mK conductivity, continuous use from -40 to 200℃. Soft, compressible, and naturally tacky for easy installation. UL94 V-0 rated. Custom thicknesses and shapes available. Ideal for LED lighting, automotive, and telecom applications.

UL recognized silicone thermal pad with 2.0W/mK conductivity, soft and compressible for low stress applications. Fills air gaps to enhance heat dissipation and component lifespan. RoHS compliant, available in custom thicknesses and die cut shapes.

TIF140-20-18S thermal pad offers 2.0W/mK conductivity, UL94 V-0 flame rating, and soft compressibility for low-stress thermal management. Ideal for CPUs, LEDs, and PCBs. Custom thicknesses from 0.5mm to 5.0mm available. RoHS compliant.

Soft, compressible thermal pad with 1.5 W/mK conductivity and 27 Shore 00 hardness. Naturally tacky, no adhesive needed. Fills uneven gaps for efficient heat transfer in LED modules and electronics. UL V-0 rated, custom shapes available.

High-performance thermal pad with 3W/mK conductivity and 2.50g/cc density. Soft 27 Shore 00 hardness ensures low-stress application. Electrically isolating, naturally tacky, and available in multiple thicknesses. Ideal for laptops, LEDs, and power electronics.

Ultra soft thermal pad with 2.0W/mK conductivity and 35 Shore 00 hardness. Naturally tacky, compressible, and available in thicknesses from 0.25mm to 5.08mm. Ideal for LED, automotive, telecom, and semiconductor applications. UL94 V0 rated.

High-performance thermal pad with 1.2W/mK conductivity, 85 Shore 00 hardness, and ceramic-filled silicone construction. Provides efficient heat transfer, insulation, and damping for AI processors and electronics. UL94 V0 rated, customizable thickness, and available with adhesive or fiberglass reinforcement.

High-performance thermal gap pad with 5.0W/mK conductivity and 0.5mm thickness. Ultra soft and compressible for low-stress applications. Fills uneven gaps to enhance heat dissipation and extend component life. UL 94 V0 rated. Custom sizes and adhesive options available.

TIF1100-02S series thermal pad offers 1.5W/mK conductivity, ultra-soft 45 Shore 00 hardness, and natural tack for excellent surface conformity. Ideal for LED lights, power adapters, and modules. UL94 V-0 rated, available in custom thicknesses and shapes.

TIF180-02F series silicone pad offers 1.5 W/mK thermal conductivity, soft compressibility, and natural tack. Available in 0.5mm to 5.0mm thickness with custom die-cut options. UL 94 V0 rated, ISO certified. Ideal for CPUs, GPUs, and power electronics.

TIF780Z series silicone-based gap pad with 7W/mK thermal conductivity, UL recognized, RoHS compliant. Low hardness, electrically isolating, fiberglass reinforced for durability. Ideal for CPUs, memory modules, and automotive electronics. Custom thicknesses and adhesive options available.

TIF100-11U series thermal pads offer 1.5 W/mK conductivity, high voltage isolation, and natural tack. Soft, compressible, and available in 20 thicknesses from 0.25mm to 5.08mm. Ideal for LED, telecom, and automotive cooling. UL94 V0 rated.

TIF180-30-01E silicone thermal pad offers 3W/mK conductivity, low hardness, and electrical isolation. Naturally tacky, soft, and compressible for low-stress applications. Available in custom thicknesses and die-cut shapes. UL 94 V0 rated.

High-performance gap pad with 2W/mK thermal conductivity, naturally tacky on both sides. Soft, compressible, and fiberglass reinforced for durability. Ideal for IGBTs, LEDs, and automotive electronics. UL94 V0 rated. Custom sizes and thicknesses available.

TIF180-01E thermally conductive pad fills air gaps between heating elements and heat sinks. Soft, compressible, naturally tacky. 1.5 W/mK thermal conductivity. Enhances LED lamp efficiency and lifespan. Custom thickness and adhesive options available.

TIF180-20-12S thermal pad offers 2W/mK conductivity, 50 Shore00 softness, and natural tack. Fills air gaps to enhance heat dissipation and component lifespan. UL94 V0 rated, customizable thickness, and fiberglass reinforcement available.

TIF180-12S thermal silicone pad offers 1.5 W/mK conductivity, low oil permeability, and high softness. UL94 V-0 rated, it operates from -50°C to 200°C. Ideal for LED, automotive, and telecom applications. Custom thickness and adhesive options available.