Thermal Conductive Pad

Soft, compressible thermal pad with 1.0W/mK conductivity and low thermal resistance. Electrically isolating, naturally tacky, and UL94 V-0 rated. Ideal for CPUs, GPUs, power supplies, and automotive electronics. Custom thicknesses and die-cut shapes available.

TIF 800TS Series thermal pad delivers 16W/mK conductivity with moderate hardness for easy assembly. Self-adhesive, insulating, and V-0 rated. Ideal for AI servers, 5G base stations, and high-power electronics. Custom shapes and thicknesses available.

Ultra-soft thermal interface material with 1.5W/mK conductivity, ideal for AI processors and servers. Protects delicate components from mechanical stress. UL V-0 rated, customizable thickness 0.25-5.00mm. RoHS compliant.

TIF 100-15-14S series offers 1.5W/mK thermal conductivity with 45-65 Shore 00 hardness for excellent conformity. Self-adhesive, UL94 V-0 rated, and available in custom shapes. Ideal for AI servers, CPUs, and 5G base stations.

TIF500-18-11US silicone thermal pad offers 1.8W/mK thermal conductivity, self-adhesive design, and good insulation. Ideal for AI, EV batteries, and CPU cooling. Custom shapes available. UL V-0 rated.

Ultra-soft thermal pad with 3.0 W/mK conductivity, ideal for delicate components. Self-adhesive, electrically insulating, and UL94 V-0 certified. Custom thicknesses and shapes available. Perfect for CPU, GPU, LED, and battery cooling.

TIF100-15-16S series thermal pad offers 1.5W/mK conductivity, hardness options (45-65 Shore 00), and thickness from 0.25mm to 5.0mm. Self-adhesive, UL V-0 rated, ideal for power modules, LED lighting, and solar panels. Custom shapes available.

High-performance thermal pad with 10.0 W/mK conductivity, moderate hardness, and self-adhesive design. Ideal for AI servers, 5G base stations, and EV batteries. UL V-0 rated, customizable thickness and shapes. Balances cost and efficiency for medium to high power dissipation.

TIF 500-40-11S series thermal pad offers 4.0W/mK conductivity, soft compressibility, and natural tack. Ideal for network, EV, and CPU cooling. UL94 V-0, custom shapes available.

TIF 100 2855-10 thermal pad offers 2.8W/mK conductivity, softness, and self-adhesion. Ideal for AI servers, CPUs, and LEDs. UL V-0 rated, custom shapes available. Reliable thermal transfer and insulation.

Ultra-soft thermally conductive gap pad with 4.0W/mK conductivity. Protects sensitive components from mechanical stress. Self-adhesive, good insulation, UL94 V-0 rated. Custom thicknesses and shapes available for AI servers and power electronics.

Low-density thermal pad with 1.5 W/mK conductivity and 45-65 Shore 00 hardness. Self-adhesive, good insulation, and V-0 fire rated. Ideal for power modules, LEDs, and AI servers. Custom shapes and thicknesses available.

Nickel/graphite-filled silicone pad with 4.5 W/mK thermal conductivity and surface resistivity

High-performance thermal pad with 1.2W/mK conductivity, soft and compressible for low-stress applications. Electrically isolating, naturally tacky, and available in multiple thicknesses. UL94 V-0 certified, ideal for CPUs, LEDs, and automotive electronics.

High-performance 5.0 W/mK thermal pad fills air gaps between heat sources and sinks. Soft, compressible, naturally tacky. Available in 0.25-5.00mm thickness. UL V-0 rated. Custom shapes and sizes offered. Ideal for CPUs, GPUs, LEDs, and power electronics.

High-performance thermal pad with 8.0W/mK conductivity, 1.5mm thickness, and soft compressibility for low-stress applications. UL94 V0 rated, ideal for filling gaps in LED, power supply, and memory modules. Custom sizes available.

High-performance 8.0W/m-K thermal pad with 1.0mm thickness, ceramic-filled silicone for efficient heat transfer. Soft, compressible, naturally tacky, and flame retardant (UL94 V0). Ideal for CPUs, GPUs, EV batteries, and LED cooling. Custom sizes and thicknesses available.

High-performance thermal pad with 8.5W/mK conductivity and 4.5mm thickness. Soft, compressible, and flame retardant (UL94 V0). Custom sizes available for LED, GPU, CPU, and SSD cooling. Reduces thermal resistance effectively.

High-performance thermal silicone pad with 8.5W/mK conductivity, low oil permeability, and high softness. Operates from -45°C to 200°C, UL94V0 rated. Ideal for LED, CPU, GPU, and power modules. Custom thicknesses and die-cut shapes available.

Ziitek TIFTM7140RUS silicone thermal pad offers 8.5W/mK conductivity, low hardness, and high tack for efficient heat transfer. UL recognized and RoHS compliant, it is ideal for cooling CPUs, memory modules, and LED components. Custom thicknesses available.