Thermal Conductive Pad

Thermal Conductive Pad Providing Thermal Interface Solution To Enhance Heat Dissipation And Maintain Electronic Component Stability Company Profile Ziitek, founded in 2006 and headquartered in Dongguan, Guangdong Province, is the world's leading manufacturer of thermal interface materials and thermal management solutions. After years of technical development, the company has built a complete product matrix including thermal interface materials, EMI shielding materials,

6.0W/mK Thermal Conductive Pad Offering superior thermal conductivity and mechanical stability for electronic cooling solutions Product Overview TIF® 100 6050-19 Series is a well-balanced, general-purpose thermal pad that offers high thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of

Thermal Conductive Pad With Super Soft And Highly Compliant And 2W/mK Thermal Conductivity For Electronics Product Overview TIF® 100-30-15U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness, achieving a perfectly low-stress fit. It is suitable for addressing issues such as large tolerances

Thermal Conductive Pad Silicone Based Soft Compressible Electrically Isolating Moldable For Complex Parts And Low Stress Applications The TIF® 100-15-11F Series is a structurally supportive thermal pad designed to provide excellent heat dissipation while ensuring structural support and durability. It reliably fills interface gaps, transfers heat efficiently, and offers mechanical support for stacked components while resisting compressive deformation. This product is ideal for

Soft and compressible thermal pad with 1.5 W/mK conductivity, naturally tacky, electrically isolating, and durable. Ideal for CPU, LED, and power modules. Custom thicknesses and die-cut shapes available. UL94 V0 rated.

Premium soft silicone thermal pad with 1.5W/mK conductivity, electrically isolating and RoHS compliant. Naturally tacky, available in 0.5mm–5.0mm thicknesses and custom shapes. UL 94 V0 rated, ideal for CPUs, LEDs, automotive, and telecom hardware.

Soft, compressible thermal pad with 1.0W/mK conductivity and low thermal resistance. Electrically isolating, naturally tacky, and UL94 V-0 rated. Ideal for CPUs, GPUs, power supplies, and automotive electronics. Custom thicknesses and die-cut shapes available.

High-performance thermal pad with 3.0W/mK conductivity and >5500VAC dielectric strength. UL94V0 rated, low oil permeability, and high compliance. Operates from -40°C to 200°C. Custom thicknesses and shapes available for automotive, telecom, and LED applications.

5.0W/MK Thermal Conductive Pad Designed For Easy Application With Naturally Tacky Surface And No Additional Adhesive Coating Needed Product Overview The TIF® 100 5027-11 Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness, achieving a perfectly low-stress fit. It is suitable for addressing

Gray Thermal Gap Pad Offering Excellent 15.0W/mK Thermal Conductivity and Flexible Elasticity for Electronic Cooling Solutions Company Profile Dongguan Ziitek Electronic Material and Technology Ltd. is a professional manufacturer of thermal interface materials with many years of industry experience. Integrating R&D, production, sales, and technical services, the company offers a comprehensive product line covering thermally conductive silicone pads, thermal conductive grease

Thermal Conductive Pad Featuring Balanced Softness And 3W Thermal Conductivity The TIF® 100-30-11ES Series is a thermal pad specifically designed to tackle high-level cooling challenges in environments sensitive to extreme mechanical stress. It combines high thermal conductivity with near-fluid softness, ensuring perfect filling of the contact interface even under ultra-low mounting pressure, completely eliminating air thermal resistance, and providing superior thermal

Thermal Conductive Pad for Heat Dissipation in Electronic Devices TIF®100-10F Series is a structurally supportive thermal pad designed to provide excellent heat dissipation while ensuring structural support and durability. It reliably fills interface gaps, transfers heat, and offers mechanical support for stacked components, resisting compressive deformation. Key Features Excellent thermal conductivity: 1.5W/mK Good softness and fillability Self-adhesive without additional

TIF 800TS Series thermal pad delivers 16W/mK conductivity with moderate hardness for easy assembly. Self-adhesive, insulating, and V-0 rated. Ideal for AI servers, 5G base stations, and high-power electronics. Custom shapes and thicknesses available.

Ultra-soft thermal interface material with 1.5W/mK conductivity, ideal for AI processors and servers. Protects delicate components from mechanical stress. UL V-0 rated, customizable thickness 0.25-5.00mm. RoHS compliant.

TIF 100-15-14S series offers 1.5W/mK thermal conductivity with 45-65 Shore 00 hardness for excellent conformity. Self-adhesive, UL94 V-0 rated, and available in custom shapes. Ideal for AI servers, CPUs, and 5G base stations.

TIF500-18-11US silicone thermal pad offers 1.8W/mK thermal conductivity, self-adhesive design, and good insulation. Ideal for AI, EV batteries, and CPU cooling. Custom shapes available. UL V-0 rated.

Ultra-soft thermal pad with 3.0 W/mK conductivity, ideal for delicate components. Self-adhesive, electrically insulating, and UL94 V-0 certified. Custom thicknesses and shapes available. Perfect for CPU, GPU, LED, and battery cooling.

TIF100-15-16S series thermal pad offers 1.5W/mK conductivity, hardness options (45-65 Shore 00), and thickness from 0.25mm to 5.0mm. Self-adhesive, UL V-0 rated, ideal for power modules, LED lighting, and solar panels. Custom shapes available.

High-performance thermal pad with 10.0 W/mK conductivity, moderate hardness, and self-adhesive design. Ideal for AI servers, 5G base stations, and EV batteries. UL V-0 rated, customizable thickness and shapes. Balances cost and efficiency for medium to high power dissipation.

TIF 500-40-11S series thermal pad offers 4.0W/mK conductivity, soft compressibility, and natural tack. Ideal for network, EV, and CPU cooling. UL94 V-0, custom shapes available.