Thermal Conductive Pad

High thermal conductivity 3W/mK gap filler pad with 2mm thickness. Soft, compressible, and naturally tacky for low-stress thermal management. Ideal for LED lighting, automotive, and electronics. UL94 V0 flame rated. Custom thickness and adhesive options available.

Soft and compressible 2W/mK thermal pad fills air gaps between heat sources and sinks. Naturally tacky, no adhesive needed. UL94 V-0 rated, 45psi tensile strength. Custom thickness and die-cut options available for efficient heat dissipation.

Soft and compressible thermal pad with 2W/mK conductivity, naturally tacky, no adhesive needed. Ideal for LED lamps, IGBTs, and electronics. Available in custom thicknesses and die-cut shapes. UL94 V0 rated.

Ultra-soft silicone gap filler with 1.5 W/mK thermal conductivity, low hardness, and natural tack. Electrically isolating, compressible, and available in 0.5mm to 5.0mm thickness. Ideal for GPUs, IGBTs, and LEDs. UL 94 V0 rated.

TIF100-40-12U thermal pad fills air gaps between heat sources and sinks. Features 4 W/mK conductivity, ultra-soft compressibility, and natural tack. Ideal for LED lighting, LCD BLU, and power electronics. UL94 V0 rated, available in 0.25–5.08mm thicknesses with adhesive or reinforcement options.

High thermal conductivity silicone pad with 1.5W/mK, soft and compressible for uneven surfaces. UL94 V-0, SGS, ROHS compliant. Ideal for LED TV, semiconductor ATE, and automotive ECUs. Custom thicknesses and adhesive options available.

TIF120-15-12U is an ultra soft ceramic filled silicone pad with 1.5 W/mK thermal conductivity. Naturally tacky, low stress, and conformable to irregular surfaces. Available in 0.25mm to 5.08mm thickness. UL 94 V0 rated. Ideal for LED, automotive, telecom, and semiconductor cooling.

TIF1120-15-02S series silicone thermal gap pad offers 1.5W/mK conductivity, UL 94 V0 rating, and fiberglass reinforcement. Electrically isolating with high durability, ideal for LED, automotive, and memory modules. Custom thicknesses and adhesive options available.

Ziitek TIF1100-02S thermal pad offers 1.5W/mK conductivity and 2.0mm thickness. Features high tack, RoHS compliance, and UL94 V-0 rating. Ideal for memory modules, automotive electronics, and IT infrastructure. Custom shapes and thicknesses available.

High durability thermal pad with 1.5W/mK conductivity, fiberglass reinforced for puncture resistance. UL recognized and RoHS compliant. Electrically isolating with custom shapes and thickness options available for memory modules and electronics.

TIF1120-02F Series thermal gap pad offers 1.5W/mK conductivity and ultra-low modulus for excellent adhesion to rough surfaces. Electrically isolating, vibration dampening, and available in thicknesses from 0.254mm to 5.080mm. Ideal for automotive, telecom, and semiconductor applications.

High-performance thermally conductive gap pad with 1.5W/mK thermal conductivity, UL recognized and RoHS compliant. Features low hardness, electrical isolation, and fiberglass reinforcement for durability. Ideal for CPU, LED, and power supply applications. Custom thicknesses and adhesive options available.

TIF®140-60-06S thermal gap pad with 6.0 W/mK conductivity fills air gaps between heat sources and sinks. Soft, compressible, naturally tacky, and electrically isolating. UL94 V-0 certified. Custom thicknesses available for efficient thermal management.

Ultra-soft thermal pad with 3.0 W/mK conductivity, ideal for stress-sensitive components. Self-adhesive, good insulation, UL94 V-0 certified. Custom shapes and thicknesses available.

Electrically isolating thermal pad with 2W/mK conductivity and high tack surface. UL recognized, RoHS compliant, and fiberglass reinforced. Ideal for LED controllers, power adapters, and modules. Custom thicknesses and adhesive options available.

TIF180-20-50E series silicone thermal pad offers 2.0W/mK conductivity, low hardness, and electrical isolation. UL recognized, soft and compressible for stress-free assembly. Available in 0.5mm to 5mm thickness with custom die-cut options.

High thermal conductivity 4 W/mK silicone pad with natural tack, no adhesive needed. Soft, compressible, electrically isolating, UL94 V0 rated. Ideal for IGBTs, LEDs, and power electronics. Custom sizes and thicknesses available.

High-performance thermal interface pad with 13.0 W/m-K conductivity, naturally tacky, and available in thicknesses from 0.75mm to 5.0mm. Ideal for automotive engine control units, LED lighting, and telecom hardware. UL94 V-0 rated, custom shapes available.

High-performance thermal conductive pad with 5.0 W/mK thermal conductivity and 60 Shore 00 hardness. Designed for RDRAM memory modules, LED lighting systems, and electronic cooling applications. Features natural adhesion, multiple thickness options, and UL94 V0 fire rating for reliable heat dissipation in demanding environments.

Ultra-soft silicone thermal pad with 3.0W/mK conductivity for efficient heat transfer in electronic devices. Available in thicknesses from 0.5mm to 5.0mm, featuring natural adhesion, V-0 fire rating, and custom die-cut options. Ideal for LED systems, automotive controls, and computer components.