Thermal Adhesive Tape

High bond strength double-sided tape with 1.2 W/mK thermal conductivity. Replaces grease and mechanical fixing for heat sinks and processors. UL94 V-0, SGS, ROHS compliant. Custom thicknesses and die-cut shapes available.

TIA®806 series thermal tape offers 0.8W/mK conductivity, strong adhesion, and electrical insulation. Solvent-free, easy to apply, and die-cuttable. Ideal for bonding LED modules, power devices, and communication equipment. Replaces screws and grease.

High performance double-sided tape with 1.2 W/mK thermal conductivity and strong adhesion. Replaces grease and mechanical fixings. Ideal for bonding heat sinks to LEDs, BGA processors, and power converters. UL-certified, fiberglass reinforced, available in custom die-cut shapes.

TIA™800FG series thermal adhesive tape offers 0.8W/mK conductivity and high bond strength for heat sink mounting. Replaces grease and mechanical fixings. Fiberglass reinforced, customizable thicknesses, and free samples available.

High bond strength thermally conductive acrylic tape with 0.8 W/mK thermal conductivity. Replaces grease and mechanical fixing. UL94 V-0, SGS, ROHS compliant. Custom thicknesses and die-cut shapes available.

TIA800FG series thermal adhesive tape offers 0.8 W/mK conductivity and high bond strength. Replaces grease and mechanical fixing. Ideal for mounting heat sinks on BGA processors and power converters. Available in multiple thicknesses from 0.127mm to 0.508mm.

TIA 800FG series double sided thermal adhesive tape offers 0.8 W/mK thermal conductivity and high voltage isolation over 2000 Vac. Fiberglass reinforced with strong acrylic adhesive, it replaces grease and mechanical fixings for heat sink bonding on BGA processors and power converters. Custom thicknesses and die cut shapes available.

High-performance thermal adhesive tape featuring 0.8 W/mK conductivity and glass fiber reinforcement. Provides superior bonding strength for heat sinks, processors, and power semiconductors. Replaces thermal grease and mechanical fasteners with multiple thickness options from 0.005" to 0.020" for various thermal management applications.

High-performance thermal conductive adhesive tape with 1.0 W/mK thermal conductivity and superior bonding strength. Fiberglass reinforced with voltage breakdown up to 3500 Vac, ideal for mounting heat sinks to processors and PCBs. Available in multiple thicknesses from 0.005" to 0.020" with custom die-cut options available.

High-performance thermal conductive adhesive tape with 0.9 W/mK conductivity and fiberglass reinforcement. Features double-sided pressure sensitive adhesive, eliminates need for screws or clips, and provides excellent electrical isolation. Ideal for heat sink mounting on processors, LED systems, and power electronics with continuous temperature range of -50°C to 180°C.

High-performance ceramic-filled silicone elastomer thermal adhesive tape with 0.9 W/mK conductivity and -50°C to 180°C continuous use temperature. Features fiberglass reinforcement, >600 psi tensile strength, and UL94 V0 flame rating. Ideal for heat sink mounting on processors and power electronics, replacing traditional thermal interface materials.

0.304mm thick thermal adhesive tape with 0.9W/mK conductivity and glass fiber reinforcement. Features UL94 V0 flame rating, >5000V dielectric strength, and eliminates need for mechanical fasteners. Ideal for LED systems, power converters, and semiconductor cooling applications.

High-performance thermally conductive adhesive transfer tape with 0.8 W/mK thermal conductivity and thickness options from 0.1mm to 0.5mm. Features fiberglass reinforcement, excellent bond strength, and replaces thermal grease and mechanical fasteners. Ideal for heat sink mounting on processors and power electronics with voltage breakdown up to 3500 Vac.

High-performance thermal adhesive tape with 1.0 W/mK conductivity and glass fiber reinforcement. Features strong double-sided acrylic adhesive, voltage breakdown up to 3500 Vac, and replaces thermal grease and mechanical fastening. Ideal for BGA processors, power converters, and motor control PCBs.

TIA 800 Series thermally conductive acrylic tape offers 0.8 W/mK thermal conductivity and strong adhesion. Replaces grease and mechanical fixings. Ideal for bonding heat sinks, BGA processors, and LED strips. Custom thicknesses available.

High-performance thermal adhesive tape with 0.8 W/mK conductivity for LED fluorescent lamps and power electronics. Features strong double-sided acrylic adhesive, temperature range -45℃ to 120℃, and multiple thickness options from 0.05mm to 0.381mm. Ideal for heat dissipation in power adapters, LED modules, and panel lights. Manufacturer certified with ISO9001, IATF16949, and UL standards.

High-performance thermal conductive adhesive tape with 1.0 W/mK thermal conductivity and glass fiber backing. Features pressure-sensitive acrylic adhesive, voltage breakdown up to 3500 Vac, and replaces thermal grease and mechanical fasteners. Ideal for mounting heat sinks on processors and power converter PCBs with thickness options from 0.005" to 0.020".

High-performance double-sided thermal adhesive tape with 1.6W/mK conductivity and strong bonding. Replaces grease and mechanical fixings. UL certified, ideal for LED power supplies and semiconductors. Custom die-cut available.

High bond strength thermal tape with 0.8W/mK conductivity. Replaces grease and mechanical fixing. Ideal for LED, heat sink, and processor bonding. Custom thicknesses available. Withstands -45°C to 120°C.

High bond strength acrylic adhesive tape with 0.8W/mK thermal conductivity. Replaces grease and mechanical fasteners for heat sink bonding on CPUs, LEDs, and power converters. Offers electrical insulation up to 2500 Vac. Custom thicknesses and die-cut shapes available.