CPU Thermal Pad

High-performance 2.6W/mK thermal conductivity pad with 2.5mm thickness for efficient CPU and motherboard cooling. Features UL94 V-0 fire rating, broad hardness options, and easy installation. Certified with ISO9001, IATF16949, and IECQ QC 080000 standards for reliable thermal management solutions.

High-performance TIF580US thermal pad with 2.6W/mK conductivity and 2.0mm thickness for efficient CPU and motherboard cooling. Features ceramic-filled silicone construction, UL 94 V0 fire rating, and comprehensive quality certifications including ISO9001:2015. Ideal for electronics requiring reliable thermal management solutions.

High-performance thermal pad with 2.6W/mK conductivity and 1.5mm thickness for efficient CPU and motherboard cooling. Features ceramic-filled silicone construction, UL 94 V0 fire rating, and multiple international certifications including ISO9001 and IATF16949. Ideal for electronics requiring reliable thermal management.

High-performance thermal pad with 2.6W/mK conductivity and 1.0mm thickness designed for motherboard and CPU cooling. Features UL 94 V0 fire rating, broad hardness options, and easy installation. Certified with ISO9001, IATF16949, and IECQ standards for reliable thermal management in electronic devices.

High-performance TIF500 thermal pad with 2.6 W/mK thermal conductivity and electrical isolation properties. Available in thicknesses from 0.5mm to 5.0mm, this violet ceramic-filled silicone rubber material provides excellent heat management for electronic devices including portable electronics, storage devices, and audio/video components.

High-performance TIF500S thermal pad with 3.2 W/mK conductivity and electrical isolation properties. Ideal for CPU cooling, portable electronics, and storage devices. Available in thicknesses from 0.25mm to 5.08mm with pressure-sensitive adhesive options. Operating range -40°C to 160°C with >5500 VAC dielectric strength.

3.0W High Temperature Silicone Thermal Gap Pad For Network Communication Products Laptop CPU/GPU Cooling Company Profile With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others. Certifications:

2.8W Electronic Components AI Server Thermal Pads 0.5mm High Quality Thermal Conductivity Insulated Pad Company Profile Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped

Factory Custom Size Battery Led Laptop Termal Pad 2W 1.5mm Silicone Themals Conductive Pads Company Profile Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications. Certifications: ISO9001:2015 ISO14001: 2004 IATF16949:2016 IECQ QC 080000:2017

Ultra Soft Thermal Insulated Gap Pad For Gpu Laptop With High Temperature Resistance And 2.0W/M-K Thermal Conductivity​ Company Profile Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting

Gpu Laptop Thermal Silicone Pad 2.5g/cm³ Specific Gravity Thermal Insulated Gap Pad For High Temperature Resistance Company Profile Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting

2W Customized Thermal Pad Thermal Gap Filler Insulation Sheet Silicone Pad For LED CPU GPU MOS Thickness 0.5mmT Company Profile With professional R&D capabilities and many year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation. Certifications: ISO9001:2015

4.0W/mK Outstanding thermal performance 5.0mmT silicone pads for Routers Company Profile Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. TIF100-40-11US-Series-Datasheet.pdf TIF1200-40-11US is a silicone based, thermally conductive gap pad. Its unreinforced construction allows

low cost insulation 4.5mmT silicone pads for Mass storage devices,4.0W/mK Company Profile . Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications. TIF100-40-11US-Series-Datasheet.pdf TIF1180-40-11US is not only designed to take advantage of

good performance UL recognized silicone pads for DVD-Rom cooling,20 shore00 Company Profile With professional R&D capabilities and over 13 year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation. TIF100-40-11US-Series-Datasheet.pdf TIF1160-40-11US use a special

Easy release construction silicone pads for IT infrastructure ,4.0W/mK Company Profile Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field. We serve customers with customized products, full product lines and flexible production, which makes us be the best and

Outstanding thermal performance TIF1120-40-11US thermal pad for Memory Modules ​ Company Profile Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. TIF100-40-11US-Series-Datasheet.pdf TIF1120-40-11US thermal silicone pad is a product with both performance and economy. It is a

Naturally tacky needing no further adhesive coating silicone pads for CPU Company Profile Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications. TIF100-40-11US-Series-Datasheet.pdf TIF1100-40-11US is a silicone based, thermally conductive gap

Easy release construction 4.0W/mK gray silicone pads for IT infrastructure Company Profile With professional R&D capabilities and over 13 year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation. TIF100-40-11US-Series-Datasheet.pdf TIF180-40-11US is not only

Outstanding thermal performance silicone pads for RDRAM memory modules ,20 Shore 00 Company Profile Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field. We serve customers with customized products, full product lines and flexible production, which makes us be the