Thermal Pad

High-performance 5.0W/mK thermal gap filler with natural tack, soft compressibility, and UL V-0 rating. Ideal for LED, CPU, GPU, and MOS cooling. Custom thicknesses and shapes available. Enhances heat dissipation and component lifespan.

High-strength, high-temp resistant silicone gap pad with 5.0W/mK thermal conductivity. Soft, compressible, and electrically isolating. Ideal for EV battery packs, automotive electronics, and LED lighting. UL 94 V0 rated. Custom thicknesses and shapes available.

TIF100-30-11E thermal pad offers 3.0W/mK conductivity, soft compressibility, and natural tack. Ideal for CPUs, LEDs, and power supplies. UL V-0 rated, custom shapes available. Balances cost and performance for medium to high power needs.

TIF100-20-11U series thermal pad fills air gaps between heat sources and sinks. Features 2.0 W/mK conductivity, soft compressibility, and natural tack. UL94 V-0 rated. Custom shapes and thicknesses available. Ideal for AI servers, EV batteries, and LED lighting.

TIF800HQ is a soft, compressible thermal pad with 13.0W/mK conductivity and UL 94 V0 rating. It offers natural tack, vibration dampening, and electrical isolation. Custom thicknesses and die-cut shapes available for medical, LED, and automotive electronics.

Ultra-soft thermal pad with 4.0W/mK conductivity, naturally tacky, and available in 0.25-5mm thickness. Ideal for stress-sensitive components in automotive, telecom, and electronics. UL94 V-0 rated, customizable shapes, and supports high-precision assemblies.

TIF700NES thermal gap filler pad offers 6.5 W/mK conductivity, natural tack, and high compliance. Ideal for telecom and automotive electronics. UL94 V-0 rated, available in custom thicknesses and shapes. Enhances heat dissipation and component lifespan.

High-performance thermal gap filler pad with 1.8W/mK conductivity, naturally tacky, and flexible for uneven surfaces. Ideal for telecom, automotive, and LED applications. UL V-0 rated, available in custom shapes and thicknesses.

TIF100-30-11S silicone thermal pad offers 3.0W/mK thermal conductivity and >5500VAC dielectric strength. Naturally tacky, flexible, and available in 0.5mm-5.0mm thickness. Ideal for automotive electronics, battery packs, and telecom equipment. UL 94 V0 rated. Custom shapes and sizes available.

High-performance silicone thermal pad with 2.0W/mK conductivity, UL94 V-0 rated, RoHS compliant. Naturally tacky, flexible, and available in custom thicknesses from 0.5mm to 5.0mm. Ideal for automotive electronics, LED, and battery packs.

TIF500-65-11US is a soft, compressible silicone gap pad with 6.5W/m-K thermal conductivity and electrical isolation. Ideal for CPUs, LEDs, and 5G devices. UL V-0 rated, available in custom shapes and thicknesses. Low stress, naturally tacky.

Ultra-soft thermal pad with 6.5W/m-K conductivity, 65 Shore 00 hardness, and UL V-0 rating. Ideal for low-stress applications on precision components. Custom shapes and thicknesses available.

TIF100-18-11U thermally conductive gap filler pad offers 1.8 W/mK thermal conductivity, naturally tacky surface, and soft compressibility for low-stress applications. Ideal for filling air gaps in electronics, LED lighting, and battery systems. UL 94 V0 rated, available in custom thicknesses and die-cut shapes.

High thermal conductivity of 3.5W/mK fills air gaps between heating elements and heat sinks. Naturally tacky, flexible, and elastic for uneven surfaces. Available in 0.5-5.0mm thickness with custom shapes. UL 94 V0 rated, ideal for telecom, automotive, and LED applications.

TIF100-20-11S thermal pad fills air gaps between heat sources and sinks. 2.0W/mK conductivity, soft and compressible for low-stress assembly. UL V-0 rated, custom shapes available. Enhances component efficiency and lifespan.

TIF700HP silicone thermal pad offers 7.5W/mK conductivity, high tack, and UL94 V0 rating. Flexible and compressible for uneven surfaces. Ideal for UAVs, CPUs, and LEDs. Custom thicknesses from 0.5mm to 5.0mm available.

High-performance thermal gap filler pad with 10.0W/mK conductivity, soft and compressible for low-stress applications. Naturally tacky, no adhesive needed. UL94 V-0 rated, available in 0.5mm to 5.0mm thicknesses. Ideal for CPUs, LEDs, and power electronics. Custom die-cut options available.

High-performance silicone thermal pad with 4.0W/mK conductivity, ideal for filling gaps between heat sources and sinks. Soft, compressible, electrically isolating, and UL 94 V0 rated. Custom thicknesses and die-cut shapes available for LED, CPU, GPU, and automotive applications.

Ultra-soft silicone thermal pad with 6.5W/mK conductivity, ideal for low-stress applications. Fills gaps perfectly under minimal pressure, eliminating air resistance. UL V-0 rated, available in custom shapes and thicknesses from 0.5mm to 5mm.

High-performance 12W/mK silicone thermal pad with natural tack, excellent compliance, and UL recognition. Fills gaps between heat sources and sinks, enhancing heat dissipation. Available in custom thicknesses from 0.5mm to 5mm. RoHS compliant.