Thermal Pad

Ultra-soft thermal pad with 8.5W/mK conductivity, ideal for electric vehicle batteries and delicate electronics. Self-adhesive, high insulation, UL V-0 rated. Custom shapes and thicknesses available.

Ultra-soft thermal pad with 6.0W/m-K conductivity and 65 Shore 00 hardness. Protects sensitive components from mechanical stress. Self-adhesive, V-0 rated, customizable thickness 0.25-5.00mm. Ideal for medical, EV, and telecom applications.

General-purpose thermal pad with 1.5W/mK conductivity and UL94 V-0 rating. Soft, compressible, and naturally tacky for easy application. Available in custom shapes and thicknesses from 0.25mm to 5mm. Ideal for 5G, EV, and industrial electronics.

High thermal conductivity 6.5W/mK with softness for excellent surface conformity. Self-adhesive, good insulation, and V-0 flame rated. Ideal for CPUs, AI processors, and servers. Custom shapes and thicknesses available.

Ultra-high thermal conductivity of 15W/mK with soft compressibility for efficient heat dissipation. Self-adhesive, electrically insulating, and rated V-0 flame retardant. Ideal for AI servers, EV batteries, and high-power electronics. Custom shapes available.

High-performance thermal interface pad with 4.0 W/mK conductivity, low oil yield, and UL94 V-0 rating. Soft, compressible, and electrically isolating for 5G, aerospace, and automotive electronics. Custom thicknesses and die-cut shapes available.

High-performance thermal interface pad with 3.0 W/mK conductivity, soft and compressible for uneven surfaces. Naturally tacky, no adhesive needed. UL 94 V0 rated, custom thicknesses available. Ideal for CPUs, GPUs, AI servers, and automotive electronics.

Ultra soft silicone gap filler for AI servers and electronics. 3.0W/mK thermal conductivity, UL94 V-0, RoHS compliant. Naturally tacky, compressible, and available in custom thicknesses and shapes for efficient heat dissipation.

Ultra-soft thermal gap pad with 5.0W/mK conductivity, Shore 00 hardness, and UL94 V-0 rating. Protects sensitive components from mechanical stress. Custom thicknesses and shapes available. Ideal for AI servers, telecom, and EVs.

Ultra-soft thermal pad with 5.0W/mK conductivity and near-fluid softness for low-stress applications. Eliminates air gaps under ultra-low pressure. UL94 V-0, RoHS compliant. Custom shapes and thicknesses available.

TIF100-40-11E gap filler pad offers 4.0W/mK thermal conductivity, ultra-soft compliance, and excellent insulation. Self-adhesive design ensures easy installation. Ideal for AI servers, CPUs, and power electronics. UL94 V-0 rated. Custom shapes available.

Ultra-soft thermal pad with 6.5W/mK conductivity and excellent insulation. Protects delicate components from mechanical stress. Self-adhesive, UL94 V-0 rated. Custom shapes and thicknesses available.

Ultra-soft thermal pad with 5.0 W/m*K thermal conductivity and low thermal impedance. Fills gaps seamlessly for efficient heat dissipation. Ideal for 5G, servers, and cloud computing. UL V-0 rated, customizable thickness from 0.25mm to 5.0mm.

TIF100 2855-10 thermal pad offers 2.8W/mK conductivity, low bleed, and self-adhesive design. Ideal for AI processors and servers, it provides reliable heat transfer and insulation. UL V-0 rated, available in custom shapes and thicknesses from 0.25mm to 5.0mm.

High-performance thermal pad with 1.5W/mK conductivity, soft and compressible for uneven surfaces. Naturally tacky, RoHS compliant, UL 94-V0 rated. Custom thickness and die-cut shapes available for efficient CPU and electronics cooling.

Ultra-soft thermally conductive pad with 4.0 W/mK rating, ideal for protecting sensitive components. Self-adhesive, electrically insulating, and compliant with uneven surfaces. UL V-0 rated. Custom shapes and thicknesses available.

Ultra-soft thermal pad with 7.5W/mK conductivity, designed for AI servers and precision electronics. Self-adhesive, low-stress fit for uneven surfaces. UL V-0 rated, custom shapes available. Ideal for CPUs, GPUs, and 5G base stations.

Ultra-soft thermal pad with 7.5W/mK conductivity and excellent insulation. Protects sensitive components from mechanical stress. Self-adhesive, UL94 V-0 rated. Custom shapes and thicknesses available for AI servers, 5G, and automotive applications.

Ultra-soft thermal interface material with 4.0 W/mK conductivity and 65 Shore 00 hardness. Protects sensitive AI components from mechanical stress. Self-adhesive, V-0 rated, custom thicknesses available. Ideal for CPUs, servers, and telecom hardware.

Ultra-soft thermal pad with 4.0 W/mK conductivity, 5500V/mm breakdown voltage, and V-0 flame rating. Self-adhesive, electrically isolating, and ideal for AI servers, CPUs, and power supplies. Custom shapes and thicknesses available.