Thermal Pad

TIF700RES Thermally Conductive Gap Filler Pads For Medical Devices Product descriptions TlF®700RES Series thermally conductive interface materials are applied to fill theair gaps between the heating elements and the heat dissipation fins or the metalbase.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the

TIF700R Thermal Pad GPU CPU Heatsink Cooling Conductive Silicone Product descriptions TlF®700R use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink. Features > Good thermal conductive 8.5W/mK > Outstanding thermal performance > High tack surface reduces contact

TIF700RUS Thermal Conductive Silicone Pad For Lithium Battery Graphics Card GPU Product descriptions TlF700HP thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -45℃~200℃ and meet the requirement of UL94V0. Features > Good thermal conductive 8.5W/mK > Outstanding thermal performance > High tack surface reduces contact

TIF700HP Efficient Thermal Conductivity 7.5W/MK Silcione Thermal Pad Easy To Apply For CPU Product descriptions TlF700HP is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling. Features > Good thermal conductive 7.5W/mK > Outstanding thermal

TIF700M Highly Efficient Thermal Conductivity 6.0 W/MK Heat Resistant Silicone Thermal Pads Product descriptions TlF®700M is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. Ziitek TIF700M is an electrically isolating material, which allows its use in applications requiring isolation between heat sinks and high

TIF700QE Silicone 8.0W Thermal Pad For CPU GPU For Various Strict Application Fields Product descriptions TlF700QE is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is

Notebook Thermal Gap Filler 1.5W Silicon Thermal Pad Product descriptions TlF®100-02F use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink. Features > Good thermal conductive 1.5W/mK > Moldability for complex parts > Soft and compressible for low stress

TIF®700Z Heat Resistant 7W/MK Thermal Pads For Laptop Heatsink CPU GPU LED Cooler Product descriptions TlF®700Z is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is

TIF®500-50-10U Thermal Pad 2W/MK Silicon Thermal Gap Pad Filling For Telecommunication Hardware​ Product descriptions TlF®500-50-10U is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of

TIF®800 Wholesale 5.0W Gray Silicone Thermal Pad For Automotive Engine Control Units Product descriptions TlF®800 is an extremely soft gap filling material rated at a thermal conductivity of 5.0W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique filler package and ultra low modulus resin formulation. Ziitek TIF®800 is highly conformal to rough

4.0W Insulation Silicone Thermal Conductive Sheet TIF®100-4010S Silicone Thermal Transfer Pad For Battery CPU Product descriptions TlF®100-40-10S is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. Ziitek TIF®100-40-10S is an electrically isolating material, which allows its use in applications requiring

TIF®700HQ Electric Insulation Silicone Thermal Pad For EV Battery Product descriptions TlF®700HQ is an extremely soft gap filling material rated at a thermal conductivity of 8.0W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique filler package and ultra low modulus resin formulation. Ziitek TIF®700HQ is highly conformal to rough or irregular

TIF®700Q Factory Price Hot Selling Thermal Conductive Silicon Pad 8W/MK Silicone Thermal Gap Filling Product descriptions TlF®700Q is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of

TIF®500-50-11U Ultra Soft 5W/M-K Ceramic Filled Silicone IC Thermal Pad Product descriptions TlF®500-50-11U use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink. Features > Good thermal conductive 5.0W/mK > Moldability for complex parts > Soft and compressible

TIF®200-01U Hot Selling Thermal Conductive Silicon Pad Product descriptions TlF®200-01U use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink. Features > Good thermal conductive 1.5W/mK > Moldability for complex parts > Soft and compressible for low stress

2.0W/mK Heatsink Thermal Pads GPU CPU Heatsink Cooling Conductive Silicone Thermal Pad Accessories Supplies Product descriptions TlF®100-20-10E use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink. Features > Good thermal conductive 2.0W/mK > Moldability for

TIF®100-20-02S High Thermal Conductive Pad For Automotive Silicon Thermal Pad Product descriptions TlF®100-20-02S is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling. Features > Good thermal conductive 2.0W/mK > Moldability for complex

Sample Free 3.0 W/M.K Thermally Conductive Pad For LED/TV Heat Dissipation Product descriptions TlF®100-30-11F is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling. Features > Good thermal conductive 3.0W/mK > Moldability for complex parts

Thermal Conductive Silicon Pad For Mass storage devices Product descriptions TlF®100-30-11S is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent

High-performance thermal pad with 4.0W/mK conductivity for GPU and CPU cooling applications. Features natural tackiness, RoHS compliance, UL recognition, and available in thicknesses from 0.5mm to 5.0mm. Ideal for semiconductor test equipment, motherboards, LED systems, and portable devices requiring efficient heat dissipation.