Thermal Pad

Ultra-soft thermal pad with 3.0W/mK conductivity and excellent insulation. Protects sensitive components from mechanical stress. Self-adhesive, RoHS and UL compliant. Custom sizes and shapes available for B2B orders.

Ultra-soft thermal pad with 3.0 W/m-K conductivity, Shore 00 hardness of 27, and thickness from 0.25 to 5.0 mm. Self-adhesive, electrically insulating, and UL 94 V-0 rated. Ideal for AI processors, CPUs, and EV batteries. Custom shapes available.

Ultra-soft thermal pad with 7.5 W/mK conductivity for stress-sensitive components. Self-adhesive, high insulation, and V-0 flame rated. Ideal for AI servers, 5G base stations, and medical devices. Custom shapes and thicknesses available.

Ultra-soft 7.5W/mK thermal pad designed for AI servers and high heat flux electronics. Self-adhesive, high insulation, low compression stress. UL V-0 rated. Custom shapes and thicknesses available.

The TIF700M series thermal pad offers 6.0W/mK thermal conductivity and ultra-soft compliance for AI servers and processors. Self-adhesive, electrically isolating, and durable from -40 to 200°C. UL V-0 rated. Custom shapes and thicknesses available.

The TIF500-18-11US thermal pad offers 1.8W/mK conductivity, good softness, and self-adhesive properties. Ideal for AI, power tools, and EV batteries. UL V-0 rated, custom shapes available. Balances performance and cost effectively.

Ultra-soft thermal pad with 3.0 W/mK conductivity, ideal for delicate EV components. Self-adhesive, high insulation, UL V-0 rated. Custom thicknesses and shapes available. Reliable thermal management for new energy vehicles.

TIF500-50-11ES thermal pad offers 5.0W/mK conductivity, ultra-soft conformability, and electrical isolation. Ideal for high-heat-flux components, it eliminates air gaps under low pressure. UL 94 V0 rated, available in custom thicknesses and shapes for demanding B2B applications.

Ultra-soft thermal pad with 4.0W/mK conductivity, ideal for protecting sensitive components. UL94 V-0 rated, available in custom shapes and thicknesses. Low-stress fit for uneven surfaces. ISO certified.

High-performance silicone thermal gap pad with 4.0W/mK conductivity, 0.5-5.0mm thickness, and low hardness for conformability. Electrically isolating, naturally tacky, and UL94 V0 rated. Ideal for automotive electronics, CPUs, and power supplies. Custom sizes and adhesive options available.

High thermal conductivity silicone pad with 3.0W/mK, low thermal resistance, and high softness. UL94V0 rated, electrically isolating, and moldable for complex parts. Ideal for CPUs, LEDs, and automotive electronics. Custom thicknesses available.

Ziitek TIF800QE thermal pad offers 13.0W/mK conductivity, soft compressibility, and natural tack for low-stress applications. UL recognized, RoHS compliant, and customizable in thickness. Ideal for LED, automotive, and telecom heat dissipation.

High-performance silicone thermal pad with 3.0W/mK conductivity, UL recognized and RoHS compliant. Fills uneven gaps between heat sources and sinks, enhancing cooling efficiency and component lifespan. Available in custom thicknesses and die-cut shapes for versatile applications.

High thermal conductivity 3.0W/mK silicone pad fills air gaps between heating elements and heat sinks. UL94 V-0 rated, electrically isolating, with high durability. Custom shapes and thicknesses available. RoHS compliant.

High-strength thermal pad with 3.0W/mK conductivity, UL recognized and RoHS compliant. Fills uneven gaps to enhance heat transfer and component lifespan. Custom thicknesses from 0.5mm to 5.0mm available.

High-performance 5.0W/mK thermal gap filler with natural tack, soft compressibility, and UL V-0 rating. Ideal for LED, CPU, GPU, and MOS cooling. Custom thicknesses and shapes available. Enhances heat dissipation and component lifespan.

High-strength, high-temp resistant silicone gap pad with 5.0W/mK thermal conductivity. Soft, compressible, and electrically isolating. Ideal for EV battery packs, automotive electronics, and LED lighting. UL 94 V0 rated. Custom thicknesses and shapes available.

TIF100-30-11E thermal pad offers 3.0W/mK conductivity, soft compressibility, and natural tack. Ideal for CPUs, LEDs, and power supplies. UL V-0 rated, custom shapes available. Balances cost and performance for medium to high power needs.

TIF100-20-11U series thermal pad fills air gaps between heat sources and sinks. Features 2.0 W/mK conductivity, soft compressibility, and natural tack. UL94 V-0 rated. Custom shapes and thicknesses available. Ideal for AI servers, EV batteries, and LED lighting.

TIF800HQ is a soft, compressible thermal pad with 13.0W/mK conductivity and UL 94 V0 rating. It offers natural tack, vibration dampening, and electrical isolation. Custom thicknesses and die-cut shapes available for medical, LED, and automotive electronics.