Thermal Pad

TIF700PUS Self-Adhesive Gray Thermal Silicone Conductive Pad 7.5W For AI Processors AI Servers Heat Dissipation Product descriptions The TIF®700PUS Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with an exceptionally gel-like softness, achieving a low-stress perfect fit. It is suitable for addressing issues in high

TIF500-75-11US Good Insulation Performance 7.5W Heat Transfer Thermal Silicone Gel Pads For AI Servers AI Processors Product descriptions The TIF®500-75-11US Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness, achieving a perfectly low-stress fit. It is suitable for addressing issues such

High Temperature Silicone Sheet Heat Resistance Pad Thermally Silicone Pad For AI Processors AI Servers Product descriptions TIF®500-40-11US Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness,achieving a perfectly low-stress fit. It is suitable for addressing issues such as large tolerances

TIF500-40-11U Silicone Thermal Pad Offering Anti-Oxidation High Insulation & Quick Heat Dissipation For AI Servers Product descriptions TIF®500-40-11U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness,achieving a perfectly low-stress fit. It is suitable for addressing issues such as large

TIF500-30-11US High-Performance 3.0W/MK Silicone Thermal Pad With Great Conductivity & Insulation For CPU GPU AI And Processors Product descriptions TIF®500-30-11US Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness,achieving a perfectly low-stress fit. It is suitable for addressing issues

TIF500-30-11U Ultra Soft And Highly Compliant Thermally Conductive Gap Filler Pads Thermal Pads For AI Processors Product descriptions TIF®500-30-11U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness,achieving a perfectly low-stress fit. It is suitable for addressing issues such as large

TIF700PUS Good Heat Dissipation 7.5W Silicone Thermal Pad For AI Processors AI Servers The TIF®700PUS Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with an exceptionally gel-like softness, achieving a low-stress perfect fit. It is suitable for addressing issues in high-precision assemblies, such as large tolerances,

Thermal Pad Manufacturer High Temperature Silicon Thermal Pad For AI Servers AI Processors The TIF®700M Series is a well-balanced,general-purpose thermal pad. It offers excellent thermal conductivity and moderate hardness . This balanced design provides both good surface conformity and excellent ease of use,making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. It is an ideal choice for addressing

Good softness and filling properties Thermally Silicone Pad For AI The TIF®500-18-11US Series is a universal thermal pad with balanced performance.It provides good thermal conductivity and moderate hardness. This balanced design combines good surface adhesion and excellent operational convenience, providing effective heat transfer paths and basic physical protection for a wide range of electronic components.The ideal choice for addressing the needs of medium to high power

TIF300US New Energy Vehicle Power Systemsr Efficient Ultra-Soft 3.0 W/MK 0.25mm~0.5mm Thickness Silicone Heat Transfer Thermal Pad The TIF®300US Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with an exceptionally gel-like softness, achieving a low-stress perfect fit. It is suitable for addressing issues in high-precision

TIF500-50-11ES Electrically Isolating Multiple Thickness Factory Thermal Pad Pad For Electric Products Product descriptions TlF®500-50-11ES is a thermal pad specifically designed to address the most demanding thermal challenges and highly sensitive mechanical stress environments. Combining exceptional thermal conductivity with near-fluid softness, it ensures perfect filing of contact interfaces even under ultra-low installation pressure, completely eliminating air thermal

TIF100-40-11US Multiple Thickness Factory Thermal Pad Thermally Conductive Silicone Pad For Electric Products Product descriptions Ziitek TlF®100-40-11US use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink. Features > Good thermal conductive 1.5W/mK >

TIF100-40-11S Custom Size Thermal Pad 1-15W 0.5mm~5.0mm Cooling New Energy Vehicle Silicone Themals Conductive Pads Ziitek TIF®100-40-11S is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling. Features: > Good thermal conductive: 4.0W/mK >

Manufacturer Customized Thermal Conductive Silicon Pad Thermal Conductive Silicone Thermal Heating Pad For Insulation And Buffering Product descriptions Ziitek TlF®800QE is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. Ziitek TIF®800QE is an electrically isolating material, which allows its use in applications

TIF100-30-11F 3.0W/M.K Thermal Pads Silicone Cooling Pad Heat Resistance With Self-Adhesive Films For PC Laptop Product descriptions TlF®100-30-11F thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the

TIF®100-30-11ES High-Strength High-Temperature Resistant Thermal Silicon Insulator Pad Thermal Pad For IGBTs Product descriptions TlF®100-30-11ES thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire

TIF®800ES High-Strength High-Temperature Resistant Thermal Pads Silicon Insulator Pad For Battery Product descriptions TlF®800ES Series is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling. Features > Good thermal conductive: 5.0W/mK >

TIF100C 6050-11 Excellent Thermal Conductivity 6.5W/MK Thermal Conductive Sheet For CPU And GPU Processors​ Product descriptions TS-TIF®100C 6050-11 series is a silicone-based thermal material designed to fill the gaps between heat-generating components and liquid cooling plates or metal bases.lts flexibility and elasticity make it ideal for covering highly uneven surfaces.With excellent thermal conductivity, it efficiently transfers heat from heat-generating elements or PCBs

TIF100C 6530-11 Excellent Thermal Conductivity 8.0W/MK Thermal Gap Filler Pad For CPU And GPU Processors Product descriptions TS-TIF®100C 6530-11 series is a silicone-based thermal material designed to fill the gaps between heat-generating components and liquid cooling plates or metal bases.lts flexibility and elasticity make it ideal for covering highly uneven surfaces.With excellent thermal conductivity, it efficiently transfers heat from heat-generating elements or PCBs to

TIF100C 8045-11 High-Performance 8.0W Thermal Gap Filler Pad For Lndustrial Equipment Product descriptions TS-TIF®100C 8045-11 series is a silicone-based thermal material designed to fill the gaps between heat-generating components and liquid cooling plates or metal bases.lts flexibility and elasticity make it ideal for covering highly uneven surfaces.With excellent thermal conductivity, it efficiently transfers heat from heat-generating elements or PCBs to liquid cooling