Thermal Pad

Ultra-soft thermal gap filler with 5.0W/mK conductivity, hardness 27 Shore 00, and thickness 0.25–5.0mm. Self-adhesive, electrically insulating, UL V-0 rated. Ideal for stress-sensitive components in EV batteries, 5G, and servers. Custom shapes available.

TIF100-30-01E silicone thermal pad offers 3.0W/mK conductivity, UL recognition, and high durability. Fills uneven gaps to enhance heat dissipation and component lifespan. Custom thickness and die-cut shapes available.

High thermal conductivity gap filler pad with 1.8 W/mK, soft and compressible for low-stress applications. Naturally tacky, no adhesive needed. UL 94 V0 rated, custom thickness and die-cut shapes available. Ideal for automotive, LED, and power supply cooling.

High thermal conductivity 6.0W/mK silicone pad with self-adhesive backing. Soft, compressible, and electrically isolating. UL 94-V0 flame rated. Custom thickness and die-cut shapes available. Ideal for LED, CPU, and automotive electronics cooling.

TIF200-15-01F-A1 thermal pad fills air gaps between heat sources and sinks. With 1.5W/mK conductivity, UL recognition, and RoHS compliance, it offers soft compressibility for uneven surfaces. Custom thicknesses and die-cut shapes available for efficient thermal management.

Ultra-soft thermal pad with 2.6W/mK conductivity and low-stress fit for delicate components. UL94 V-0 rated, available in 0.25-5.0mm thickness. Custom shapes and adhesive options offered. Ideal for LEDs, motherboards, and automotive electronics.

TIF600 Series silicone thermal pad offers 4.7W/mK conductivity, low hardness, and electrical isolation. Naturally tacky, soft, and compressible for low-stress assembly. UL94 V-0 rated, available in custom thicknesses and die-cut shapes. Ideal for LED, power adapters, and heat pipe solutions.

TIF200-08-04U is a UL recognized silicone thermal gap filler pad with 0.8W/mK conductivity. Soft, compressible, and electrically isolating, it reduces contact resistance for efficient heat dissipation. Ideal for CPUs, display cards, and LED applications. Custom thicknesses and die-cut shapes available.

TIF500-20-01U gap filler pads offer 2.0W/m-K thermal conductivity, UL94 V-0 rating, and soft compressibility for uneven surfaces. Ideal for LED, telecom, and automotive cooling. Available in custom thicknesses and die-cut shapes.

High-performance 1.5W/mK thermal silicone pad with ultra-softness, low thermal resistance, and electrical isolation. Custom die-cutting available. UL94 V0 rated, stable from -45°C to 200°C. Ideal for laptops, CPUs, GPUs, and power supplies.

TIF100-30-05S thermal pad offers 3.0W/mK conductivity, low oil permeability, and high softness. Operates from -45°C to 200°C, UL94V0 rated. Ideal for UAVs, motherboards, and power supplies. Custom thickness and die-cut shapes available.

Ultra soft TIF100-12U thermal pad offers low thermal resistance, high compliance, and stable performance from -45°C to 200°C. UL94V0 rated, available in 0.5mm to 5.0mm thickness. Ideal for drones, motherboards, and power supplies. Custom sizes supported.

Ultra soft thermal pad with 1.5W/mK conductivity, low thermal resistance, and high compliance. Operates from -45°C to 200°C, UL94V0 rated. Custom thicknesses and die-cut shapes available for drones and electronics.

High-performance silicone thermal pad with 6.0W/mK thermal conductivity, ideal for filling air gaps between heating elements and heat sinks. Soft, compressible, and electrically isolating. UL94 V-0 rated. Available in 0.5mm to 5.0mm thickness. Custom sizes and die-cut shapes supported.

Soft, compressible thermal pad with 4.0W/m-K conductivity fills air gaps for efficient heat transfer. Naturally tacky, electrically isolating, UL94 V-0 rated. Custom thicknesses and die-cut shapes available for LED, power, and automotive electronics.

TIF100-01US thermally conductive pad fills air gaps between heating elements and heat sinks. Soft, compressible, and electrically isolating with 1.5W/m-K thermal conductivity. UL V-0 rated, available in custom thicknesses and die-cut shapes for LED, laptop, and automotive applications.

High-performance silicone thermal pads with 1.5 W/m-K conductivity, UL 94 V-0 flame rating, and electrical isolation. Available in thicknesses from 0.5mm to 5.0mm with standard 8x16 inch sheets. Ideal for laptops, LED lighting, power adapters, and memory modules with custom die-cut options available.

Premium thermal interface pads with 1.2W/mK conductivity, available in 0.5-5.0mm thicknesses. Features natural tackiness, RoHS compliance, UL recognition, and excellent dielectric properties. Ideal for CPU cooling, LED systems, and electronic device thermal management applications.

Custom-sized thermal interface pad with 1.2W/mK thermal conductivity, available in thicknesses from 0.5mm to 5.0mm. Features Kapton reinforcement, natural tackiness, and UL 94 V0 fire rating. Ideal for CPU, LED systems, and electronic cooling applications with RoHS compliance and fiberglass reinforcement options.

TIF100-50-11E is a 5.0W/mK thermal gap filler with high compressibility and softness, ideal for LED displays and power supplies. UL94 V-0, RoHS compliant. Custom thicknesses and shapes available for optimal thermal management.