Thermal Pad

High-performance silicone thermal pads with 1.5 W/m-K conductivity, UL 94 V-0 flame rating, and electrical isolation. Available in thicknesses from 0.5mm to 5.0mm with standard 8x16 inch sheets. Ideal for laptops, LED lighting, power adapters, and memory modules with custom die-cut options available.

Premium thermal interface pads with 1.2W/mK conductivity, available in 0.5-5.0mm thicknesses. Features natural tackiness, RoHS compliance, UL recognition, and excellent dielectric properties. Ideal for CPU cooling, LED systems, and electronic device thermal management applications.

Custom-sized thermal interface pad with 1.2W/mK thermal conductivity, available in thicknesses from 0.5mm to 5.0mm. Features Kapton reinforcement, natural tackiness, and UL 94 V0 fire rating. Ideal for CPU, LED systems, and electronic cooling applications with RoHS compliance and fiberglass reinforcement options.

5.0W/Mk Thermal Interface Material Highly Compressible Thermal Gap Filler For Dissipate Heat Of LED Display Power Supply Product descriptions TIF®100-50-11E Series is a well-balanced,general-purpose thermal pad.It offers good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use,making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic

TIF®100-85-11US Silicone Based Thermal Interface Material 8.5W Soft Thermal Pad For Electric Vehicle Product descriptions The TIF®100-85-11US Series​ is a thermal pad designed specifically for environments sensitive to extreme mechanical stress. It combines excellent thermal conductivity with an almost fluid-like extreme softness, ensuring perfect contact interface fillng even under ultra-low mounting pressure,completely eliminating air thermal resistance,and providing

TIF100-60-62US High Compressibility Soft 6.0W Thermally Conductive Gap Filler Pads For Medical Equipment Product descriptions The TIF®100-60-62US Series​ is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress.This product combines high thermal conductivity with exceptional gel-level softness, achieving a perfectly low stress fit. lt is suitable for addressing issues such as large

TIF100-15-11S UL94 V-0 Compliant 1.5W/MK Thermal Management Silicone Pads With Good Insulation Performance Product descriptions The TIF®100-15-11S Series is a well-balanced, general-purpose thermal pad. It offers good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic

TIF700NS High Performance 6.5W Soft Thermal GAP PAD Materials For AI Processors AI Servers Product descriptions The TIF®700NS Series a well-balanced, general-purpose thermal pad. It offers excellent thermal conductivity and moderate hardness. This balanced design provides both good surface conformity and excellent ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. It is an ideal

TIF®800SE High Thermally Conductive 15W/MK Soft Thermally Conductive Gap Filler Pads For Electronic Components IC, CPU, MOS Product descriptions The TIF®800SE Series is a high-end compressible thermal pad that meets top-level cooling requirements while also ensuring excellent assembly workability. Through an innovative material formulation, it successfully achieves an ideal combination of ultra-high thermal conductivity and moderate hardness.This unique performance balance

Low Oil Yield Thermal Silicon Pad For 5G Aerospace AI AIoT And Automotive The TIF®100L-2040-06 Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the

Great Thermal Conductivity Thermal Pad For Computer CPU/GPU Cooling Product descriptions TlF®500-30-11U-AS series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances

Ultra Soft AI Servers Thermal Conductive Gap Filler Pads With Varies Thickness Product descriptions TIF®200-30-16S Series thermally conductive interface materials are applied to fillthe air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effectively

TIF100-50-11US Silicone-Based Gap Pad Filler Ultra-Soft Thermal GAP PAD Materials For AI Processors AI Servers Smart Home Telecom Product descriptions The TIF®100-50-11US Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress.This product combines high thermal conductivity with exceptional gel-level softness, achieving a perfectly low-stress fit. It is suitable for addressing

Low Thermal Impedance Ultra Soft Thermal Pad For 5G, Aerospace, AI, Electric Vehicle​ Product descriptions The TIF®100-50-11ES Series is a thermal pad specifically designed to tackle the high level cooling challenges and environments sensitive to extreme mechanical stress. It combines higt thermal conductivity with a near-fluid ultimate softness, ensuring perfect filing of the contact interface even under ultra-low mounting pressure, completely eliminating air thermal

Good Insulation Performance Ultra-Soft Thermally Conductive Gap Filler Pads For AI Processors AI Servers Product descriptions TIF®100-40-11E Series is a wellbalanced, general-purpose thermal pad. It offers high thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components.

TIF®700NU Good Insulation Performance Ultra-Soft 6.5W Thermally Gap Pad For AI Server Computer CPU GPU Cooling Product descriptions TIF®700NU Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with an exceptionally gel-like softness, achieving a low-stress perfect fit. It is suitable for addressing issues in high-precision

Low Thermal Impedance 5.0W Ultra Soft Thermal Pad For Network Communications And Cloud Computing TIF®100-50-10E Ultra Soft Thermal Pad High thermal conductivity Low thermal impedance Good electrical insulation This thermal pad's ultra-soft texture can effectively fill the gaps between electronic components and heat sinks, achieving a seamless fit. Feature Specifically developed for network communications, cloud computing, servers, and other high-speed computing industries,

TIF100 2855-10 Low Bleed Thermal Pad Thermal GAP PAD Materials For AI Processors AI Servers Product descriptions The TIF®100 2855-10 is a general-purpose thermal pad with balanced performance. It offers high thermal conductivity and moderate hardness. This balanced design provides good surface conformability and excellent ease of use, effectively delivering a thermal transfer path and basic physical protection for a wide range of electronic components. Features > Good thermal

1.5W Thickness 0.5mm Thermal Conductive Pad Gap Filling Materials Silicone Thermal Pad For LED CPU Laptop Product descriptions TlFTM100-06S Series is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling. Features > Good thermal conductivity 1

TIF100-06U Performance Thermal Pad With Highly Efficient Thermal Conductivity For CPU Cooling Product descriptions TlF100-06U series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which