Thermal Pad

TIF200-15-12S Customized Self Adhesive Thermal Gap Filler Pad Product descriptions TlF200-15-12S Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to themetal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the

TIF100 10055-62 Thermally Conductive Heat Transfer Pad Silicone Sheet Thermal Pad For Automotive Electronics Product descriptions TIF®100 10055-62 series of thermal interface materials is specifically designed to fill air gaps between heat-generating components and heat sinks or metal baseplates.lt offers excellent compliance, allowing it to conform tightly to heat sources with varying shapes and height differences. Even in confined or irregular spaces,it maintains stable

High Strength 6.0W Electrically Insulating Pad Thermal Pad For Electronic Components Heat Sinks Product descriptions TIF®100 6545-11 series of thermal interface materials is specifically designed to fill air gaps between heat-generating components and heat sinks or metal baseplates.lt offers excellent compliance, allowing it to conform tightly to heat sources with varying shapes and height differences. Even in confined or irregular spaces,it maintains stable thermal

1.5W Thickness 0.5mm Thermal Conductive Pad Gap Filling Materials Silicone Thermal Pad For LED CPU Laptop Product descriptions TlFTM100-06S Series is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling. Features > Good thermal conductivity 1

Thermal Conductive Silicone Pad For Notebook Memory Motherboard Display Insulated CPU Computer Accessories​ Product descriptions TIF®800QE series of thermal interface materials is specifically designed to fill air gaps between heat-generating components and heat sinks or metal baseplates. It offers excellent compliance, alowing it to conform fightly to heat sources with varying shapes and height dferences. Even in confined or iregular spaces,it maintains stable thermal

TIF100-11U High Performance Thermal Pad Silicone Cooling Pad With Dual Self-Adhesive Films For PC Laptop Product descriptions TlF100-11U is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. Ziitek TlF100-11U is an electrically isolating material, which allows its use in applications requiring isolation between

TIF100-06U Performance Thermal Pad With Highly Efficient Thermal Conductivity For CPU Cooling Product descriptions TlF100-06U series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which

High Thermal Conductive 13W Silicone Thermal Sheet Thermal Pad For Automotive Efficient Heat Dissipation Product descriptions TlF800Q is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling. Features > Good thermal conductive:13.0W/mK >

TIF800QE High Thermal Conductivity Gray Silicone Thermal Pad For Electronic Heat Dissipation Product descriptions The TIF800QE series of thermal interface materials is specifically designed to fill air gaps between heat-generating components and heat sinks or metal baseplates. It ofers excellent compliance, allowing it to conform tightly to heat sources with varying shapes and height differences. Even in confined or irregular spaces,it maintains stable thermal conductivity

Customized TIF®100-18-11E Self Adhesive High Heat Transfer Thermal Pad For Laptops Product descriptions TlF®100-18-11E series is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling. Features > Good thermal conductivity > Naturally tacky

Efficient Thermal Conductivity Silicone Thermal Pads For Electronics Cooling Product descriptions TlF®300 series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances

TIF®100-02U Wholesale Silicone Thermal Conductive Pads For Laptop LED Cooling Product descriptions TlF®100-02U series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly

Factory custom size thermal pad with 1.2W/mK conductivity, UL recognition, and RoHS compliance. Ideal for CPU, GPU, LED systems, and electronic cooling applications. Available in thickness range 0.5mm to 5.0mm with pressure-sensitive adhesive options for various industrial uses.

High-performance thermal silicone pad with 6.0W/mK conductivity for efficient heat sink cooling. Features UL94 V0 fire rating, natural adhesion, and thickness options from 0.5mm to 5.0mm. Ideal for LED lighting, power adapters, routers, and semiconductor test equipment with customizable die-cut shapes.

Ultra-soft silicone thermal conductive gap filler pad with 3.0W/mK thermal conductivity and 45 Shore 00 hardness. Features natural tackiness, RoHS compliance, UL recognition, and excellent vibration dampening. Available in thicknesses from 0.5mm to 5.0mm for CPU, LED, and electronic cooling applications.

Ultra-soft silicone thermal conductive pad with 2.5W/mK thermal conductivity and 60 Shore 00 hardness. Features natural tackiness, excellent vibration dampening, and electrical isolation. RoHS compliant and UL recognized for semiconductor, CPU, LED, and electronics cooling applications.

Ultra-soft silicone thermal pad with 2.0W/m-K conductivity and 20 Shore 00 hardness for low-stress applications. Features natural tackiness, RoHS compliance, UL recognition, and excellent conformability to irregular surfaces. Available in thicknesses from 0.5mm to 5.0mm with custom die-cut shapes and adhesive options.

TIF100-10-02F silicone thermal pad offers 1.5 W/mK thermal conductivity with thickness range of 0.5-5.0mm. Features UL94 V-0 flame rating, -40°C to 160°C operating temperature, and excellent dielectric properties. Ideal for electronics cooling in IT infrastructure, LED power supplies, and portable devices.

TIF100 2855-10 Low Bleed Thermal Pad Thermal GAP PAD Materials For AI Processors AI Servers Product descriptions The TIF®100 2855-10 is a general-purpose thermal pad with balanced performance. It offers high thermal conductivity and moderate hardness. This balanced design provides good surface conformability and excellent ease of use, effectively delivering a thermal transfer path and basic physical protection for a wide range of electronic components. Features > Good thermal

TIF700M Highly Efficient Thermal Conductivity 6.0 W/MK Heat Resistant Silicone Thermal Pads Product descriptions The TIF®100-40-11U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness, achieving a perfectly low-stress fit, It issuitable for addressing issues such as large tolerances, uneven