Thermal Conductive Pad

Ultra-soft 7.5W/mK thermal pad with near-fluid softness for minimal mounting pressure. Self-adhesive, high insulation, UL94 V-0 certified. Ideal for AI servers, GPUs, and sensitive electronics. Custom shapes and thicknesses available.

TIF700M series thermal pad offers 6.0W/mK conductivity, moderate hardness, and self-adhesive design. Ideal for AI servers, CPUs, and power electronics. UL V-0 rated, electrically isolating, and available in custom shapes. Balances performance and cost effectively.

Ultra soft thermal interface material with 5.0W/mK conductivity. Self-adhesive, electrically insulating, and highly compliant for precision components. Ideal for AI servers, inverters, and telecom devices. UL V-0 rated. Custom shapes and thicknesses available.

TIF 800ES thermal gap pad offers 5.0W/mK conductivity, soft compressibility, and natural tack. Ideal for LEDs, automotive, and telecom. UL 94-V0 rated, available in custom shapes and thicknesses from 0.5mm to 5.0mm.

High-performance thermal pad with 1.2W/mK conductivity, soft and compressible for low-stress assembly. UL94 V-0 rated, electrically isolating, and durable. Custom thickness and die-cut shapes available. Ideal for CPUs, LEDs, and power supplies.

TIF100-66U series silicone thermal pad offers 1.2W/mK conductivity, soft compressibility, and natural tack. UL 94-V0 rated, electrically isolating, and available in custom thicknesses from 0.5mm to 5.0mm. Ideal for CPUs, LEDs, automotive electronics, and battery packs.

Soft, compressible thermal pad with 1.0W/mK conductivity. UL94 V0 rated, RoHS compliant. Custom thicknesses and die-cut shapes available. Ideal for CPUs, LEDs, and automotive electronics.

High-performance thermal interface material with 6.5W/mK conductivity, naturally tacky, and flexible for uneven surfaces. UL 94-V0 rated, available in custom thicknesses and shapes. Ideal for automotive, telecom, and LED applications.

High-performance thermal pad with 3.0W/mK conductivity and >5500VAC dielectric strength. UL94V0 rated, low oil permeability, and high compliance. Operates from -40°C to 200°C. Custom thicknesses and shapes available for automotive, telecom, and LED applications.

Ultra-soft thermal interface material for stress-sensitive components. High thermal conductivity, low hardness, and high tack reduce contact resistance. UL94 V-0, RoHS compliant. Custom shapes and thicknesses available.

Ultra-soft thermal pad with 2.0 W/m-K conductivity, ideal for stress-sensitive components. UL94 V-0 rated, customizable thickness 0.25-5.0mm. Reduces mechanical stress in high-precision assemblies.

The TIF 500 Series thermal pad offers 2.6 W/mK thermal conductivity and 35 Shore OO hardness for excellent conformity. Self-adhesive, electrically insulating, and UL 94 V-0 rated. Ideal for 5G, aerospace, AI, and AR/VR applications. Custom shapes and thicknesses available.

TIF200-04ES thermal pad offers 1.0 W/mK conductivity, excellent electrical insulation, and ultra-soft cushioning. Self-adhesive, puncture-resistant, and V-0 rated. Ideal for power devices, EVs, and 5G. Custom shapes and thicknesses available.

Soft, compressible 6.5W thermal pad with UL94 V-0 rating. Ideal for AI servers, CPUs, and power electronics. Custom thicknesses and shapes available. Naturally tacky, no adhesive needed.

High-performance thermal interface material with 6.0 W/mK conductivity and fiberglass reinforcement. Features self-adhesive, flexibility, and V-0 flame rating. Ideal for CPU/GPU cooling, power tools, and EV batteries. Custom shapes and thicknesses available.

High-performance thermal pad with 1.25W/mK conductivity, soft and compressible for low-stress applications. Naturally tacky, no adhesive needed. UL 94 V0 flame rated, custom thickness and die-cut shapes available. Ideal for CPUs, GPUs, and power electronics.

TIF 100-18-56E series thermal pad offers 1.8W/mK conductivity, softness, and self-adhesion for efficient heat transfer. Ideal for power modules, LEDs, and CPUs. UL V-0 rated, customizable thickness, and available with fabric or adhesive options.

Ultra-soft TIF100-66U gap filler pad with 1.5 W/mK thermal conductivity and 55 Shore 00 hardness. Self-adhesive, electrically insulating, and highly conformable for delicate components. Ideal for 5G, aerospace, and AI applications. Custom shapes available.

High performance thermal pad with 5.0W/mK conductivity and UL 94 V0 flame rating. Self-adhesive, flexible, and RoHS compliant. Ideal for AI servers, GPU cooling, LED drivers, and power electronics. Custom sizes available.

TIF 100-12-66U silicone thermal pad offers 1.2W/mK conductivity, soft compressibility, and natural tackiness. Ideal for filling air gaps in laptops, LEDs, and automotive electronics. UL V-0 rated, available in custom shapes and thicknesses.