Thermal Conductive Pad

Ultra-soft thermal pad with 1.2W/mK conductivity, ideal for stress-sensitive components. Naturally tacky, RoHS & UL compliant. Available in 0.25-5.00mm thicknesses with custom shapes and adhesive options.

The TIF100-12-05ES series thermal pad offers 1.2 W/mK conductivity, soft compressibility, and UL 94 V0 fire rating. Ideal for CPUs, GPUs, and power supplies. Available in 0.5mm to 5.0mm thickness with custom die cuts and adhesive options.

High thermal conductivity 1.2 W/mK silicone pad with polyimide film reinforcement. Soft, compressible, and naturally tacky for easy installation. Ideal for filling gaps in laptops, LEDs, and power supplies. UL 94 V0 rated. Custom thickness and die-cut shapes available.

TIF 100-20-19S soft thermal pad offers 2.0 W/mK thermal conductivity and electrical insulation. Self-adhesive, flexible, and UL94 V-0 rated. Ideal for AI servers, CPUs, and power modules. Custom shapes and thicknesses available.

High-performance thermal pad with 4.0W/mK conductivity and low volatility. Ideal for aerospace, automotive, and electronics. UL94 V-0 rated, flexible, and easy to install. Custom sizes available.

Soft and compressible thermal pad with 1.5 W/mK conductivity, naturally tacky, electrically isolating, and durable. Ideal for CPU, LED, and power modules. Custom thicknesses and die-cut shapes available. UL94 V0 rated.

Ultra-soft thermal interface material with 6.0 W/mK conductivity, ideal for protecting sensitive components. Naturally tacky, compressible, and available in 0.25-5.00mm thickness. UL94 V-0 certified. Custom shapes and sizes offered.

TIF100-02S thermal pad with 1.5W/mK conductivity fills gaps between heating elements and heat sinks. Soft, compressible, high tack surface reduces contact resistance. UL recognized, RoHS compliant. Custom shapes and thicknesses available.

High-strength, high-temperature resistant thermal pad with 1.5W/mK conductivity. Soft, compressible, and moldable for complex parts. UL 94 V0 rated. Custom thickness and die-cut shapes available. Ideal for battery, LED, and automotive thermal management.

TIF 100-02U thermal pad fills air gaps between heating elements and heat sinks. With 1.5W/mK conductivity, soft compressibility, and UL 94 V0 rating, it enhances component life. Custom thicknesses and die-cut shapes available for OEM applications.

High-performance thermal conductive pad with 1.5W/mK conductivity, naturally tacky, soft, and compressible. Ideal for medical devices, LEDs, and CPUs. UL certified, customizable thickness, and electrically isolating for enhanced durability.

High-performance thermal conductive pad with 1.5W/mK conductivity, soft and compressible for low-stress applications. Naturally tacky, UL recognized, RoHS compliant. Custom sizes and thicknesses available for efficient heat transfer in electronics, LED, and automotive uses.

Premium soft silicone thermal pad with 1.5W/mK conductivity, electrically isolating and RoHS compliant. Naturally tacky, available in 0.5mm–5.0mm thicknesses and custom shapes. UL 94 V0 rated, ideal for CPUs, LEDs, automotive, and telecom hardware.

TIF 100-01U thermal pad offers 1.5W/mK conductivity, low thermal resistance, and high softness. UL94V0 rated, operates from -45 to 200°C. Custom thicknesses and die-cut shapes available for automotive and electronics cooling.

TIF 100-01US soft silicone thermal pad offers 1.5W/mK conductivity, low hardness, and electrical isolation. Ideal for CPUs, LEDs, and power supplies. UL 94 V0 rated. Custom thickness and die-cut shapes available.

High-performance thermal silicone pad with 1.5W/mK conductivity, 0.25-5.0mm thickness, and UL/RoHS certification. Soft, compressible, and electrically isolating for LED, battery, and CPU cooling. Custom sizes and die-cut shapes available.

Ultra-soft silicone thermal pad with 3.0W/mK conductivity, ideal for protecting delicate components in 5G, aerospace, AI, and automotive applications. Self-adhesive, electrically insulating, and highly conformable. Custom shapes and thicknesses available.

TIF100-10-02F series thermal pad with 1.5 W/mK conductivity, ultra soft and compressible for low stress applications. Fills air gaps to enhance heat dissipation and component lifespan. Custom thickness from 0.254mm to 5.080mm. UL 94 V0 rated.

Ultra-soft thermal pad with 7.5W/mK conductivity, ideal for AI servers and delicate components. Self-adhesive, high insulation, UL V-0 rated. Custom shapes and thicknesses available.

TIF 700PU Series thermal pad offers 7.5W/mK conductivity and ultra-softness for AI servers. It eliminates air resistance under low pressure, protects sensitive components, and is self-adhesive. Custom shapes and thicknesses available. UL V-0 rated.